US2020344885A1PendingUtilityA1
Circuit structure
Assignee: LITE ON ELECTRONICS GUANGZHOUPriority: Apr 25, 2019Filed: Mar 30, 2020Published: Oct 29, 2020
Est. expiryApr 25, 2039(~12.7 yrs left)· nominal 20-yr term from priority
G06F 3/03543H01H 2219/062H05K 2201/10106H01H 13/83H01H 13/7065H01H 2219/06H05K 1/189H01H 2209/002H05K 2201/0989H01H 2219/064H05K 2201/09663G06F 1/1662H05K 2201/09263G06F 3/0202H05K 2201/09236H05K 2201/10022H05K 1/118
51
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Claims
Abstract
The disclosure provides a circuit structure including a first flexible insulating layer, a plurality of wires, and a second flexible insulating layer. The wires are stacked in parallel on the first flexible insulating layer. The second flexible insulating layer is stacked on the wires and has at least one insulating-layer opening from which a part of at least one of the wires is exposed.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A circuit structure, comprising:
a first flexible insulating layer; a plurality of wires stacked in parallel on the first flexible insulating layer; and a second flexible insulating layer stacked on the plurality of wires and having at least one insulating-layer opening from which a part of at least one of the plurality of wires is exposed.
2 . The circuit structure of claim 1 , wherein the plurality of wires comprise a first wire and a second wire adjacent to each other, and the first wire and the second wire are connected at a portion not covered by the first flexible insulating layer and the second flexible insulating layer, and at least one of the first wire and the second wire has at least one wire opening corresponding to the at least one insulating-layer opening, and a part of the at least one of the first wire and the second wire is exposed from the at least one insulating-layer opening.
3 . The circuit structure of claim 2 , further comprising at least one electronic component disposed in the at least one insulating-layer opening and electrically coupled to both ends of the at least one wire opening.
4 . The circuit structure of claim 1 , wherein the plurality of wires comprise a first wire, a second wire, and at least one third wire disposed between the first wire and the second wire, the at least one insulating-layer opening comprises a first opening, a second opening, and at least one third opening, the first wire is partially exposed from the first opening, the second wire is partially exposed from the second opening, the at least one third wire is partially exposed from the at least one third opening.
5 . The circuit structure of claim 4 , further comprising a first electronic component and a second electronic component, wherein the at least one third opening comprises two third openings, and the first electronic component is electrically coupled to a portion of the first wire exposed from the first opening and a portion of the at least one third wire exposed from one of the third openings, the second electronic component is electrically coupled to a portion of the second wire exposed from the second opening and a portion of the at least one third wire exposed from another one of the third openings.
6 . The circuit structure of claim 5 , wherein the first electronic component or the second electronic component is an electronic component having two pins, and one of the first electronic component and the second electronic component is an active device and the other is a passive device.
7 . The circuit structure of claim 5 , wherein the first wire and the third wire both electrically coupled to the first electronic component are adjacent or not adjacent to each other, and/or the second wire and the third wire both electrically coupled to the second electronic component are adjacent or not adjacent to each other.
8 . The circuit structure of claim 4 , further comprising a third electronic component, wherein the at least one third opening comprises a third opening, and the third electronic component is electrically coupled to portions of the first wire, the second wire and the third wire respectively exposed from the first opening, the second opening and the third opening.
9 . The circuit structure of claim 8 , wherein the third electronic component is an electronic component having three pins.
10 . The circuit structure of claim 8 , wherein the first wire and the third wire both electrically coupled to the third electronic component are adjacent or not adjacent to each other, and/or the second wire and the third wire both electrically coupled to the third electronic component are adjacent or not adjacent to each other.
11 . The circuit structure of claim 4 , wherein at least two of the first opening, the second opening, and the at least one third opening communicate with each other.
12 . The circuit structure of claim 1 , wherein the circuit structure is formed on a flexible flat cable, and through an adhesive the first flexible insulating layer is bonded with the plurality of wires and the second flexible insulating layer is bonded with the plurality of wires, and the first flexible insulating layer and the second flexible insulating layer are bonded together at a portion where the plurality of wires are not provided.Join the waitlist — get patent alerts
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