Heatsink for electrical circuitry

Abstract

A heatsink assembly comprising a substrate having an active circuitry, at least one cavity located adjacent to at least one heat producing element of the active circuitry, at least one vessel sealably coupled to said substrate in fluid communication with the at least one cavity, and a phase change material (PCM) contained inside the vessel. The vessel and at least one cavity configured to facilitate migration of the PCM from the vessel into the at least one cavity for absorbing heat produced by the at least one heat producing element of the active circuitry

1 . A method of constructing a circuitry assembly configured to disperse heat produced by active components embedded in or on a substrate, the method comprising:
 forming at least one cavity in said substrate;   placing a phase change material (PCM) inside at least one vessel; and   sealingly coupling between an opening of said at least one vessel and an opening of said at least one cavity.   
     
     
         2 . The method of  claim 1 , further comprising at least one of the following:
 placing a porous medium inside the at least one vessel; or   placing a porous medium inside the at least one cavity of the substrate.   
     
     
         3 . The method of  claim 1  wherein the sealingly coupling comprises:
 forming at least one via in a carrier board; 
 sealingly attaching the substrate to said carrier board such that the opening of the at least one cavity thereof is in fluid communication with said at least one via; and 
 sealingly attaching the at least one vessel to said carrier board such that said at least one via communicates between the opening of the at least one vessel and the at least one cavity of the substrate. 
 
     
     
         4 . The method of  claim 3 , further comprising at least one of the following:
 placing a porous medium inside the at least one vessel; or   placing a porous medium inside the at least one cavity of the substrate.   
     
     
         5 . The method of  claim 3 , further comprising:
 applying at least one coating layer over a surface area of the carrier board;   forming the at least one via in the carrier board to pass through said at least one coating layer; and   thermally coupling between said at least one coating layer and the at least one vessel.   
     
     
         6 . The method of  claim 3 , further comprising at least one of the following: placing a porous medium inside the at least one vessel; and placing a porous medium inside the at least one cavity of the substrate. 
     
     
         7 . The method of  claim 3 , further comprising forming at least one cavity in the carrier board configured to receive PCM from the at least one vessel and facilitate migration thereof to the at least one cavity of the substrate through the at least one via of the carrier board. 
     
     
         8 . The method of  claim 7 , further comprising at least one of the following: placing a porous medium inside the at least one vessel; placing a porous medium inside the at least one cavity of the substrate; or placing a porous medium in the at least one cavity of the carrier board. 
     
     
         9 . The method of  claim 3 , further comprising:
 forming a plurality of vias in the carrier board; and   sealingly attaching a plurality of said substrate to said carrier board, each of said plurality of substrates having a respective active circuitry and at least one cavity, said plurality of substrates attached to the carrier board such that the opening of the at least one cavity of a respective substrate of said plurality of substrates communicates with the opening of the at least one vessel through a respective at least one via of the carrier board.   
     
     
         10 . The method of  claim 9 , further comprising at least one of the following: placing a porous medium inside the at least one vessel; or placing a porous medium inside the at least one cavity of each one of the plurality of substrates. 
     
     
         11 . The method of  claim 9 , further comprising:
 applying at least one coating layer over a surface area of the carrier board;   forming the plurality of vias in the carrier board to pass through said at least one coating layer; and   thermally coupling between said at least one coating layer and the at least one vessel.   
     
     
         12 . The method of  claim 11 , further comprising at least one of the following: placing a porous medium inside the at least one vessel; or placing a porous medium inside the at least one cavity of each one of the plurality of substrates. 
     
     
         13 . The method of  claim 9 , further comprising forming at least one cavity in the carrier board configured to receive PCM from the at least one vessel and facilitate migration thereof to the at least one cavity of each one of the plurality of substrates through the plurality of vias of the carrier board. 
     
     
         14 . The method of  claim 13 , further comprising at least one of the following: placing a porous medium inside the at least one vessel; placing a porous medium inside the at least one cavity of each one of the plurality of substrates; or placing a porous medium inside the at least one cavity of the carrier board. 
     
     
         15 . The method of  claim 9 , further comprising:
 placing a PCM in a plurality of vessels; and   sealingly coupling each of said plurality of vessels to at least one of the plurality of substrates in fluid communication with its at least one cavity through at least one of the plurality of vias of the carrier board.   
     
     
         16 . The method of  claim 15 , further comprising at least one of the following: placing a porous medium inside the plurality of vessels; or placing a porous medium inside the at least one cavity of each one of the plurality of substrates. 
     
     
         17 . The method of  claim 15 , further comprising:
 applying at least one coating layer over a surface area of the carrier board;   forming the plurality of vias in the carrier board to pass through said at least one coating layer; and   thermally coupling between said at least one coating layer and the plurality of vessels.   
     
     
         18 . The method of  claim 17 , further comprising at least one of following: placing a porous medium inside the plurality of vessels; or placing a porous medium inside the at least one cavity of each one of the plurality of substrates. 
     
     
         19 . A circuitry assembly configured to disperse heat produced by active components embedded in or on a substrate, said circuitry assembly comprising:
 a substrate having at least one cavity and a respective opening of said at least one cavity;   at least one vessel sealably coupled to said substrate in fluid communication with the opening of said at least one cavity; and   a phase change material (PCM) placed inside said at least one vessel for migration via the opening of said at least one vessel into said at least one cavity for absorbing heat produced by said at least one heat producing element of said active circuitry.   
     
     
         20 . The circuitry assembly of  claim 19 , further comprising at least one of the following: a porous medium placed inside the at least one vessel; or a porous medium placed inside the at least one cavity of the substrate. 
     
     
         21 . The circuitry assembly of  claim 19 , further comprising a carrier board having at least one via formed therein, wherein the substrate is sealingly attached to said carrier board such that the opening of the at least one cavity is in fluid communication with said at least one via; and wherein the at least one vessel is sealingly attached to said carrier board such that said at least one via communicates between the opening of the at least one vessel and the at least one cavity of the substrate. 
     
     
         22 . The circuitry assembly of  claim 21 , further comprising at least one of the following: a porous medium placed inside the at least one vessel; or a porous medium placed inside the at least one cavity of the substrate. 
     
     
         23 . The circuitry assembly of  claim 21 , further comprising at least one coating layer applied over a surface area of the carrier board, wherein the at least one via formed in the carrier board passes through said at least one coating layer, and wherein said at least one coating layer is thermally coupled to the at least one vessel. 
     
     
         24 . The method of  claim 23 , further comprising at least one of the following: a porous medium placed inside the at least one vessel; or a porous medium placed inside the at least one cavity of the substrate. 
     
     
         25 . The circuitry assembly of  claim 21 , further comprising at least one cavity formed in the carrier board and configured to receive PCM from the at least one vessel and facilitate migration thereof to the at least one cavity of the substrate through the at least one via of the carrier board. 
     
     
         26 . The circuitry assembly of  claim 25 , further comprising at least one of the following: a porous medium placed inside the at least one vessel; a porous medium placed inside the at least one cavity of the substrate; or a porous medium placed inside the at least one cavity of the carrier board. 
     
     
         27 . The circuitry assembly of  claim 21 , further comprising a plurality of vias formed in the carrier board and a plurality of substrates each having a respective active circuitry and at least one cavity sealingly, each one of said plurality of substrates attached to said carrier board such that the at least one cavity of a respective substrate of said plurality of substrates communicates with the at least one vessel through a respective at least one via of the carrier board. 
     
     
         28 . The circuitry assembly of  claim 27 , further comprising at least one of the following: a porous medium placed inside the at least one vessel; or a porous medium placed inside the at least one cavity of each one of the plurality of substrates. 
     
     
         29 . The circuitry assembly of  claim 27 , further comprising at least one coating layer applied over a surface area of the carrier board, wherein the plurality of vias in the carrier board pass through said at least one coating layer, and wherein said at least one coating layer is thermally coupled to the at least one vessel. 
     
     
         30 . The circuitry assembly of  claim 29 , further comprising at least one of the following: a porous medium placed inside the at least one vessel; or a porous medium placed inside the at least one cavity of each one of the plurality of substrates. 
     
     
         31 . The circuitry assembly of  claim 21 , further comprising at least one cavity formed in the carrier board and configured to receive PCM from the at least one vessel and facilitate migration thereof to the at least one cavity of each one of the plurality of substrates through the plurality of vias of the carrier board. 
     
     
         32 . The circuitry assembly of  claim 21 , further comprising at least one of the following: a porous medium placed inside the at least one vessel; a porous medium placed inside the at least one cavity of each one of the plurality of substrates; or a porous medium placed inside the at least one cavity of the carrier board. 
     
     
         33 . The circuitry assembly of  claim 27 , further comprising a plurality of vessels each having a PCM, and wherein each one of said plurality of vessels is sealingly coupled to at least one of the plurality of substrates in fluid communication with its at least one cavity through at least one of the plurality of vias of the carrier board. 
     
     
         34 . The circuitry assembly of  claim 33 , further comprising at least one of the following: a porous medium placed inside the plurality of vessels; or a porous medium placed inside the at least one cavity of each one of the plurality of substrates. 
     
     
         35 . The circuitry assembly of  claim 33 , further comprising at least one coating layer applied over a surface area of the carrier board, wherein the plurality of vias are formed in the carrier board to pass through said at least one coating layer, and wherein said at least one coating layer is thermally coupled to the plurality of vessels. 
     
     
         36 . The circuitry assembly of  claim 35 , further comprising at least one of following: a porous medium placed inside the plurality of vessels; or a porous medium placed inside the at least one cavity of each one of the plurality of substrates.