Heat dissipating module with three-dimensional structure

Abstract

A heat dissipating module with three-dimensional structure includes a heat dissipating cavity connecting to a top of a heat absorbing cavity to form a distance from a heat source. When a working fluid in the heat absorbing cavity absorbs the thermal energy and is vaporized, the vapor would flow up to a vapor guiding space due to thermosyphon effect and principles of Boyle's Law, and then the vapor is projected and spread rapidly and evenly to the heat dissipating cavity through a projecting exit. Then the vapor is condensed into liquid and become the working fluid again by heat exchange. The condensed liquid then drips down and flows back to the heat absorbing cavity via micro-passages, forming a cycle of phase change of the working fluid for operation of heat dissipation.

What is claimed is: 
     
         1 . A heat dissipating module with three-dimensional structure, comprising:
 a heat absorbing cavity vertically arranged as a bottom section thereof arranged to be contacted with a heat source and a first opening arranged at a top section thereof to form a connecting space between said bottom section of said heat absorbing cavity and said first opening;   a vapor guiding chamber arranged in said connecting space near said first opening and including a cover board arranged in a shape corresponding to an inner periphery of said connecting space for said cover board to be fixed in said connecting space near said first opening, at a center of said cover board, a second opening being arranged with an outer diameter shorter than an inner diameter of said connecting space to form a projecting exit and a vapor guiding space vertically arranged in a middle of said heat absorbing cavity filled with a working fluid;   a heat dissipating cavity connecting said opening of said heat absorbing cavity and further connecting with said projecting exit of said heat absorbing cavity, thereby being far from said bottom section of said heat absorbing cavity, said heat dissipating cavity including a plurality of fins on a top surface thereof for heat dissipation;   at least one layer of capillary structure vertically arranged on an inner periphery wall of said heat absorbing cavity, an upper section thereof connecting said heat dissipating cavity and a lower section thereof connecting said bottom section of said heat absorbing cavity, thereby forming a micro-passage structure;   whereby when the working fluid absorbs the thermal energy from the heat source, the working fluid is vaporized and the vapor is guided to flow upwards through the vapor guiding space and then projected from the projecting exit and spread rapidly and evenly to the heat dissipating cavity for the fins to perform heat dissipation; then the vapor in the heat dissipating cavity further goes through a heat exchange process and is condensed back to liquid form for dripping and flowing back to the heat absorbing cavity by the micro-passage structure via the upper section and then the lower section of the capillary structure layer and becoming the working fluid again, so as to form a cycle of the heat dissipating module.   
     
     
         2 . The heat dissipating module with three-dimensional structure as claimed in  claim 1 , wherein the layer of capillary structure has a flange surface for the cover board to be disposed thereon, further defining the vapor guiding chamber. 
     
     
         3 . The heat dissipating module with three-dimensional structure as claimed in  claim 2 , wherein the cover board is a flat board with a conic hole arranged in the middle thereof, an upper part of said conic hole having a substantially shorter diameter and a lower part having a substantially longer diameter. 
     
     
         4 . The heat dissipating module with three-dimensional structure as claimed in  claim 2 , wherein the cover board is a hollow conic section with the second opening arranged at a top of the hollow conic section. 
     
     
         5 . The heat dissipating module with three-dimensional structure as claimed in  claim 4 , wherein a micro structure is further arranged on an inner periphery of the hollow conic section. 
     
     
         6 . The heat dissipating module with three-dimensional structure as claimed in  claim 4 , wherein a helix structure is further arranged on an inner periphery of the hollow conic section. 
     
     
         7 . The heat dissipating module with three-dimensional structure as claimed in  claim 1 , wherein another layer of capillary structure is horizontally arranged on a bottom surface of the heat absorbing cavity. 
     
     
         8 . The heat dissipating module with three-dimensional structure as claimed in  claim 7 , wherein both layers of capillary structure are formed by microporous structure arranged on an inner periphery of the heat absorbing cavity. 
     
     
         9 . The heat dissipating module with three-dimensional structure as claimed in  claim 8 , wherein a lower end of the vertically arranged capillary structure layer is either connecting or not connecting to the horizontally arranged capillary structure layer. 
     
     
         10 . The heat dissipating module with three-dimensional structure as claimed in  claim 1 , wherein the bottom section of the heat absorbing cavity includes a bottom surface and a periphery extended upwards from said bottom surface in order to be contacted with different heat sources.