Vapor chamber

Abstract

A vapor chamber includes an upper plate, a lower plate and a fixing frame. The lower plate is attached on the upper plate. The lower plate includes a raised structure. The fixing frame is attached on the lower plate. The fixing frame includes a hollow portion and at least one fastening part. The raised structure is accommodated within the hollow portion. The fixing frame is helpful for facilitating the manufacturer or the user to directly assemble and fix the vapor chamber on a supporting plate with a heat source. Moreover, due to the fixing frame, the possibility of causing deformation of the vapor chamber is minimized.

What is claimed is: 
     
         1 . A vapor chamber, comprising:
 an upper plate;   a lower plate attached on the upper plate, wherein the lower plate comprises a raised structure; and   a fixing frame attached on the lower plate, wherein the fixing frame comprises a hollow portion and at least one fastening part, and the raised structure is accommodated within the hollow portion.   
     
     
         2 . The vapor chamber according to  claim 1 , wherein the vapor chamber is in thermal contact with a heat source, and the heat source is fixed on a supporting plate, wherein the raised structure is contacted with the heat source, and the fastening part of the fixing frame is fixed on the supporting plate. 
     
     
         3 . The vapor chamber according to  claim 1 , wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate, and the thermal conduction property of the lower plate is superior to a thermal conduction property of the fixing frame. 
     
     
         4 . The vapor chamber according to  claim 1 , wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate, and the thermal conduction property of the upper plate is superior to or equal to a thermal conduction property of the fixing frame. 
     
     
         5 . The vapor chamber according to  claim 1 , wherein a metallic strength of the fixing frame is higher than a metallic strength of the lower plate, and the metallic strength of the fixing frame is higher than or equal to a metallic strength of the upper plate. 
     
     
         6 . The vapor chamber according to  claim 1 , wherein the fixing frame is made of copper alloy, stainless steel, plastic steel or aluminum alloy. 
     
     
         7 . The vapor chamber according to  claim 1 , wherein the upper plate is made of copper alloy, and the lower plate is made of pure copper. 
     
     
         8 . The vapor chamber according to  claim 1 , wherein the fastening part is a male threaded rod, a female threaded rod or a threaded hole. 
     
     
         9 . The vapor chamber according to  claim 1 , wherein the fixing frame is a hollow frame with a through-hole, and the through-hole is the hollow portion. 
     
     
         10 . The vapor chamber according to  claim 1 , wherein the fixing frame has a notch, or the fixing frame is defined by two individual sub-frames. 
     
     
         11 . A vapor chamber, comprising:
 an upper plate;   a lower plate attached on the upper plate; and   a fixing frame attached on the lower plate, wherein the fixing frame comprises a fastening part.   
     
     
         12 . The vapor chamber according to  claim 11 , wherein the vapor chamber is in thermal contact with the heat source, and the heat source is fixed on a supporting plate, wherein the fixing frame is contacted with the heat source, a heat from the heat source is transferred to the lower plate through the fixing frame, and the fastening part of the fixing frame is fixed on the supporting plate. 
     
     
         13 . The vapor chamber according to  claim 11 , wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate, and the thermal conduction property of the lower plate is superior to a thermal conduction property of the fixing frame. 
     
     
         14 . The vapor chamber according to  claim 11 , wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate, and the thermal conduction property of the upper plate is superior to or equal to a thermal conduction property of the fixing frame. 
     
     
         15 . The vapor chamber according to  claim 11 , wherein a metallic strength of the fixing frame is higher than a metallic strength of the lower plate, and the metallic strength of the fixing frame is higher than or equal to a metallic strength of the upper plate. 
     
     
         16 . The vapor chamber according to  claim 11 , wherein the fixing frame is made of copper alloy, stainless steel, plastic steel or aluminum alloy. 
     
     
         17 . The vapor chamber according to  claim 11 , wherein the upper plate is made of copper alloy, and the lower plate is made of pure copper. 
     
     
         18 . The vapor chamber according to  claim 11 , wherein the fastening part is a male threaded rod, a female threaded rod or a threaded hole. 
     
     
         19 . The vapor chamber according to  claim 11 , wherein the fixing frame is a hollow frame with a through-hole, and the through-hole is the hollow portion. 
     
     
         20 . The vapor chamber according to  claim 11 , wherein the fixing frame has a notch, or the fixing frame is defined by two individual sub-frames. 
     
     
         21 . The vapor chamber according to  claim 11 , wherein the vapor chamber further comprises a heat conduction block, wherein the heat conduction block is attached on the lower plate, the heat conduction block is in thermal contact with a heat source, and the heat source is fixed on a supporting plate, wherein the heat conduction block is contacted with the heat source, a heat from the heat source is transferred to the lower plate through the heat conduction block, and the fastening part of the fixing frame is fixed on the supporting plate. 
     
     
         22 . The vapor chamber according to  claim 21 , wherein a thermal conduction property of the lower plate or the heat conduction block is superior to a thermal conduction property of the upper plate, and the thermal conduction property of the lower plate or the heat conduction block is superior to a thermal conduction property of the fixing frame. 
     
     
         23 . The vapor chamber according to  claim 21 , wherein a thermal conduction property of the lower plate or the heat conduction block is superior to a thermal conduction property of the upper plate, and a thermal conduction property of the upper plate is superior to or equal to a thermal conduction property of the fixing frame. 
     
     
         24 . The vapor chamber according to  claim 21 , wherein a metallic strength of the fixing frame is higher than a metallic strength of the lower plate, and the metallic strength of the fixing frame is higher than or equal to a metallic strength of the upper plate. 
     
     
         25 . The vapor chamber according to  claim 21 , wherein the fixing frame is made of copper alloy, stainless steel, plastic steel or aluminum alloy. 
     
     
         26 . The vapor chamber according to  claim 21 , wherein the upper plate is made of copper alloy, and the lower plate or the heat conduction block is made of pure copper.