Glass substrate with through glass vias

Abstract

A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

1 - 14 . (canceled) 
     
     
         15 . A glass substrate comprising:
 a glass plate having a first principal surface and a second principal surface opposite to the first principal surface;   a first conductive portion formed on the first principal surface of the glass plate; and   a through glass via extending in the direction of the thickness of the glass plate; wherein,   a part of the first conductive portion overlaps the through glass via when the glass substrate is viewed in plan.   
     
     
         16 . The glass substrate according to  claim 15 , wherein the through glass via tapers from the second principal surface to the first principal surface. 
     
     
         17 . The glass substrate according to  claim 15 , further comprising a second conductive portion formed on the second principal surface, wherein
 a part of the second conductive portion overlaps the through glass via when the glass substrate is viewed in plan.   
     
     
         18 . The glass substrate according to  claim 17 , wherein the part of the second conductive portion is electrically connected with the part of the first conductive portion. 
     
     
         19 . The glass substrate according to  claim 15 , further comprising a protective coating that is formed on the first conductive portion and has etching resistance of an etchant containing hydrogen fluoride. 
     
     
         20 . The glass substrate according to  claim 15 , further comprising a positioning element for positional adjustment between the through glass via and the first conductive portion. 
     
     
         21 . An interposer comprising:
 the glass substrate according to  claim 15 ; and   an electronic device disposed at a side of one of the first conductive portion and the second conductive portion, wherein,   the first conductive portion and the second conductive portion differ in design rule.