Polyester based copolymer resin and molded product comprising the same

Abstract

There are provided a polyester based copolymer resin capable of having an excellent shrinkage rate and being heat-shrunk at a low temperature, and a molded product comprising the same. The polyester based copolymer resin includes a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a predetermined residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4′-(hydroxymethyl)cyclohexane carboxylate and a predetermined residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol.

1 . A polyester based copolymer resin comprising:
 a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and   a diol-derived residue including, based on 100 mol % of the residue derived from an aromatic dicarboxylic acid, between 1 mol % and 5 mol % of a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4′-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1, between 1 mol % and 12 mol % of a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol represented by the following Chemical Formula 2, between 1 mol % and 15 mol % of a residue derived from 1,4-cyclohexanedimethanol, between 2 mol % and 15 mol % of a residue derived from diethylene glycol, and between 53 mol % and 95 mol % of a residue derived from ethylene glycol.   
       
         
           
           
               
               
           
         
       
     
     
         2 . The polyester based copolymer resin of  claim 1 , wherein the aromatic dicarboxylic acid is one or more selected from the group consisting of terephthalic acid, dimethyl terephthalate, cycloaliphatic dicarboxylic acid, isophthalic acid, adipic acid, azelaic acid, naphthalenedicarboxylic acid, and succinic acid. 
     
     
         3 . A molded product, comprising a polyester based copolymer resin, the polyester based copolymer resin comprising:
 a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and   a diol-derived residue including, based on 100 mol % of the residue derived from an aromatic dicarboxylic acid, between 1 mol % and 5 mol % of a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4′-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1, between 1 mol % and 12 mol % of a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol represented by the following Chemical Formula 2, between 1 mol % and 15 mol % of a residue derived from 1,4-cyclohexanedimethanol, between 2 mol % and 15 mol % of a residue derived from diethylene glycol, and between 53 mol % and 95 mol % of a residue derived from ethylene glycol.   
       
         
           
           
               
               
           
         
       
     
     
         4 . The molded product of  claim 3 , wherein the molded product is a heat shrinkable film. 
     
     
         5 . The molded product of  claim 4 , wherein a shrinkage initiation temperature of the heat shrinkable film is 60° C. or less, and the maximum heat shrinkage rate thereof at 60° C. is 4% or more. 
     
     
         6 . The molded product of  claim 4 , wherein the maximum heat shrinkage rate of the heat shrinkable film at 90° C. is 80% or more.