Polishing device and polishing method

Abstract

A polishing device includes a substrate holder, a dispenser configured to dispense an abrasive to a surface of a substrate held by the substrate holder, a polisher including an elastic body configured to polish the surface of the substrate as the elastic body is rotated with respect to the surface of the substrate. An area of contact between the elastic body and the surface of the substrate during polishing is smaller than a surface area of a region of the substrate that is to be polished by the elastic body. The elastic body is moved, while the elastic body is rotated, with a downward velocity component prior to contacting the surface of the substrate and with an upward velocity component after the elastic body comes into contact with the surface of the substrate.

What is claimed is: 
     
         1 . A polishing device comprising:
 a substrate holder;   a dispenser configured to dispense an abrasive to a surface of a substrate held by the substrate holder; and   a polisher including an elastic body configured to polish the surface of the substrate as the elastic body is rotated with respect to the surface of the substrate, wherein   an area of contact between the elastic body and the surface of the substrate during polishing is smaller than a surface area of a region of the substrate that is to be polished by the elastic body, and   the elastic body is moved, while the elastic body is rotated, with a downward velocity component prior to contacting the surface of the substrate and with an upward velocity component after the elastic body comes into contact with the surface of the substrate.   
     
     
         2 . The polishing device according to  claim 1 , wherein the elastic body is circular or elliptical in cross-section perpendicular to the surface of the substrate, the polishing device further comprising a first rotation mechanism configured to rotate the elastic body about a center axis thereof which extends parallel to the surface of the substrate. 
     
     
         3 . The polishing device according to  claim 2 , further comprising a second rotation mechanism configured to rotate the substrate holder on which the substrate is held, about a center axis that extends vertically from a center of a surface region of the substrate holder. 
     
     
         4 . The polishing device according to  claim 1 , wherein a length of the elastic body in a direction along a rotational axis of the elastic body is greater than a diameter of a surface region of the substrate holder on which the substrate is held. 
     
     
         5 . The polishing device according to  claim 1 , further comprising a movement mechanism configured to move the polisher relative to the substrate in directions along the surface of the substrate. 
     
     
         6 . The polishing device according to  claim 1 , wherein the elastic body has an storage modulus equal to or higher than 0.01 GPa and equal to or less than 10 GPa. 
     
     
         7 . The polishing device according to  claim 1 , wherein the elastic body comprises resin or non-woven fabric. 
     
     
         8 . The polishing device according to  claim 1 , wherein the abrasive comprises abrasive grains. 
     
     
         9 . The polishing device according to  claim 1 , wherein the polishing device comprises a plurality of elastic bodies configured to be rotated during the polishing. 
     
     
         10 . The polishing device according to  claim 9 , wherein the plurality of elastic bodies are configured to be rotated about rotational axes, respectively, that extend parallel to a surface of the substrate holder. 
     
     
         11 . A polishing method comprising:
 placing a substrate onto a substrate holder;   dispensing an abrasive onto a surface of the substrate;   rotating an elastic body to polish the surface of the substrate;   moving the elastic body, while rotating the elastic body, with a downward velocity component to make contact with the surface of the substrate, and with an upward velocity component after the elastic body comes into contact with the surface of the substrate, wherein   an area of contact between the elastic body and the surface of the substrate is smaller than a surface area of a region of the substrate that is to be polished by the elastic body.   
     
     
         12 . The polishing method according to  claim 11 , wherein
 the elastic body is circular or elliptical in cross-section perpendicular to the surface of the substrate, and   the elastic body is rotated about a center axis thereof which extends parallel to the surface of the substrate.   
     
     
         13 . The polishing method according to  claim 11 , further comprising rotating the substrate holder on which the substrate is placed, about a center axis that extends vertically from a center of a surface region of the substrate holder. 
     
     
         14 . The polishing method according to  claim 11 , wherein a portion of the elastic body that is in contact with the substrate has a width in the circumferential direction equal to or less than a minimum size of a pattern formed on the substrate. 
     
     
         15 . The polishing method according to  claim 11 , wherein a distance of movement of an arbitrary point in the elastic body on the surface of the substrate while the point is in contact with the substrate is equal to or less than a minimum size of a pattern formed on the substrate. 
     
     
         16 . The polishing method according to  claim 11 , wherein the elastic body has an storage modulus equal to or higher than 0.01 GPa and equal to or less than 10 GPa. 
     
     
         17 . The polishing method according to  claim 11 , wherein the elastic body comprises resin or non-woven fabric. 
     
     
         18 . The polishing method according to  claim 11 , wherein the abrasive comprises abrasive grains. 
     
     
         19 . The polishing method according to  claim 11 , further comprising:
 moving a second elastic body, while rotating the second elastic body, with a downward velocity component to make contact with the surface of the substrate, and with an upward velocity component after the second elastic body comes into contact with the surface of the substrate, wherein   an area of contact between the second elastic body and the surface of the substrate is smaller than a surface area of a region of the substrate that is to be polished by the second elastic body.   
     
     
         20 . The polishing method according to  claim 19 , wherein the elastic body and the second elastic body rotate about the same rotational axis.