US2020282266A1PendingUtilityA1
Method for forming a golf ball and resulting golf ball
Est. expiryMar 5, 2039(~12.6 yrs left)· nominal 20-yr term from priority
B29C 43/52B29K 2075/00B29C 43/18A63B 45/00A63B 37/0006A63B 37/004A63B 37/0075A63B 37/0039A63B 37/0064A63B 37/0033A63B 37/008A63B 37/0012
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Claims
Abstract
A pre-molded dimple-free golf ball is formed before dimples are created in a thermoplastic cover of the pre-molded dimple-free golf ball.
Claims
exact text as granted — not AI-modified1 . A method of forming a golf ball comprising the steps of:
forming a subassembly comprising a core; forming a pre-molded dimple-free golf ball by compression molding a thermoplastic cover comprised of first and second pre-formed thermoplastic half-shells about the subassembly using a pair of mold cavities having inner surfaces that are configured to form a smooth outer surface on the thermoplastic cover at a pre-molding temperature Tdf; providing a compression mold press having at least one pair of mold cavities wherein each of a top mold cavity and a bottom mold cavity of the pair is configured to form a predetermined dimple pattern on the outer surface of the pre-molded dimple-free golf ball; depositing the pre-molded dimple free-golf ball into the bottom mold cavity; closing said top mold cavity and bottom mold cavity about the pre-molded dimple-free golf ball such that an inner surface of each of the top mold cavity and bottom mold cavity having the predetermined dimple pattern therein contacts the dimple-free outer surface of the pre-molded golf ball under contact pressure at a first temperature followed by applying a molding cycle to the closed top mold cavity and bottom mold cavity at a dimpling temperature Tcm sufficient to form a dimpled golf ball wherein an outer surface of the thermoplastic cover is re-solidified and contains the predetermined dimple pattern; wherein the dimpling temperature Tcm is lower than the pre-molding temperature Tdf; and the first temperature is lower than each of the pre-molding temperature Tdf and the dimpling temperature Tcm.
2 . (canceled)
3 . (canceled)
4 . The method of claim 1 , wherein the thermoplastic cover comprises at least one thermoplastic polyurethane.
5 . The method of claim 1 , wherein the subassembly further comprises an outermost layer that is disposed between the core and the thermoplastic cover; wherein the outermost layer comprises an ionomer composition.
6 . The method of claim 1 , wherein the core comprises an inner core surrounded by an outer core layer.
7 . The method of claim 1 , wherein the pre-molded dimple-free golf ball has a diameter of greater than 1.68 inches.
8 . The method of claim 7 , wherein the pre-molded dimple-free golf ball has a diameter of greater than 1.70 inches.
9 . The method of claim 1 , wherein the thermoplastic cover has a thickness of from about 0.025 inches to about 0.045 inches.
10 . The method of claim 1 , wherein Tcm is less than Tdf by at least 40° F.
11 . The method of claim 10 , wherein Tcm is less than Tdf by from about 90° F. to about 170° F.
12 . The method of claim 10 , wherein Tcm is less than Tdf by from about 120° F. to about 170° F.
13 . The method of claim 1 , wherein Tcm is applied for a duration of from about 1 minute to about 3 minutes.
14 . (canceled)
15 . (canceled)
16 . A golf ball made according to the method of claim 1 , wherein the subassembly further comprises an outermost layer that is disposed between the core and the thermoplastic cover; wherein the outermost layer comprises an ionomer composition.
17 . The golf ball of claim 16 , wherein the core comprises an inner core surrounded by an outer core layer.
18 . The golf ball of claim 16 , wherein the golf ball has a diameter of from about 1.68 inches to 1.70 inches; the core has a diameter of from about 1.530 inches to 1.560 inches; and the subassembly has a diameter of from about 1.610 inches to 1.640 inches.
19 . The method of claim 1 , wherein the dimpling temperature Tcm is from about 280° F. to 380° F. and less than the pre-molding temperature Tdf by at least 40° F.; and wherein the pre-molding temperature Tdf is greater than the first temperature by at least 70° F.
20 . The method of claim 1 , wherein pre-molding temperature Tdf is less than 440° F. and the dimpling temperature Tcm is lower than the pre-molding temperature Tdf by from about 60° F. to about 160° F.; and wherein the pre-molding temperature Tdf is greater than the first temperature by at least 70° F.
21 . The method of claim 1 , wherein the dimpling temperature Tcm is lower than the pre-molding temperature Tdf by from about 120° F. to about 170° F. and the pre-molding temperature Tdf is greater than the first temperature by at least 70° F.
22 . The method of claim 1 , wherein pre-molding temperature Tdf is 380° F.-450° F. and the dimpling temperature Tcm is lower than the pre-molding temperature Tdf by from about 90° F. to less than about 120° F.; and wherein the pre-molding temperature Tdf is greater than the first temperature by at least 100° F.Join the waitlist — get patent alerts
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