Multi-part flexible encapsulation housing for electronic devices

Abstract

Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

1 - 20 . (canceled) 
     
     
         21 . A wearable conformal integrated circuit (IC) device comprising:
 a flexible substrate;   a flexible electronic circuitry attached to the flexible substrate; and   a flexible multi-part encapsulation housing conformable to surface contours of a human body part, the flexible multi-part encapsulation housing substantially encasing therein the flexible electronic circuitry and the flexible substrate, the multi-part encapsulation housing including a first encapsulation housing component attached to a second encapsulation housing component, the first encapsulation housing component having at least one first recessed region for seating therein the flexible electronic circuitry, and the second encapsulation housing component having at least one second recessed region for seating therein the flexible substrate.   
     
     
         22 . The wearable conformal IC device of  claim 21 , wherein the least one first recessed region of the first encapsulation housing component comprises at least one recessed substrate region for seating therein the flexible substrate. 
     
     
         23 . The wearable conformal IC device of  claim 21 , wherein the flexible electronic circuitry comprises a plurality of electrically interconnected IC devices, and wherein the at least one first recessed region comprises a plurality of pockets for seating therein the IC devices. 
     
     
         24 . The wearable conformal IC device of  claim 21 , wherein the flexible substrate has one or more through holes, the first encapsulation housing component having a first projection that protrudes into a first of the one or more through holes to thereby align and interlock the first encapsulation housing component with the flexible substrate and the flexible electronic circuitry. 
     
     
         25 . The wearable conformal IC device of  claim 21 , wherein the flexible substrate has one or more through holes, the second encapsulation housing component having a second projection that passes through a second of the one or more through holes and engages a complementary aperture in the first encapsulation housing component to thereby align and interlock the first and second encapsulation housing components with the flexible substrate and the flexible electronic circuitry. 
     
     
         26 . The wearable conformal IC device of  claim 21 , wherein the flexible multi-part encapsulation housing has a durometer hardness rating of at least about 20 Shore A and a tear strength of at least about 80 pounds per inch (ppi). 
     
     
         27 . The wearable conformal IC device of  claim 21 , wherein the flexible multi-part encapsulation housing is fabricated from a stretchable and bendable non-conductive material. 
     
     
         28 . The wearable conformal IC device of  claim 21 , wherein the first and second encapsulation housing components are molded from liquid silicone rubber (LSR) materials in a liquid injection molding (LIM) process. 
     
     
         29 . The wearable conformal IC device of  claim 21 , wherein the first and second encapsulation housing components are adhered together such that the flexible substrate and the flexible electronic circuitry are sandwiched between the first and second encapsulation housing components. 
     
     
         30 . The wearable conformal IC device of  claim 21 , wherein the flexible substrate and the flexible electronic circuitry cooperatively form a flexible printed circuit board assembly (FPCBA). 
     
     
         31 . The wearable conformal IC device of  claim 21 , wherein the flexible multi-part encapsulation housing is configured to hermetically seal the flexible substrate and the flexible electronic circuitry. 
     
     
         32 . The wearable conformal IC device of  claim 21 , wherein the flexible electronic circuitry comprises an integrated circuit sensor system with at least one sensing device and at least one controller device. 
     
     
         33 . The wearable conformal IC device of  claim 21 , wherein the flexible electronic circuitry includes a plurality of device islands and a plurality of flexible electrical interconnects electrically connecting two or more of the device islands. 
     
     
         34 . The wearable conformal IC device of  claim 21 , wherein the flexible multi-part encapsulation housing completely encases therein the flexible electronic circuitry and the flexible substrate. 
     
     
         35 . A method for encapsulating a wearable conformal electronic device, the method comprising:
 molding a top flexible encapsulation housing component;   molding a bottom flexible encapsulation housing component conformable to surface contours of a human body part;   placing the bottom flexible encapsulation housing component into an assembly fixture;   dispensing a first shot of adhesive onto the bottom flexible encapsulation housing component;   placing a flexible printed circuit board assembly (FPCBA) on top of the first shot of adhesive and the bottom flexible encapsulation housing component in the assembly fixture;   dispensing a second shot of adhesive onto the FPCBA and the bottom flexible encapsulation housing component; and   placing the top flexible encapsulation housing component on top of the FPCBA and the second shot of adhesive in the assembly fixture to create a stack and thereby encase the FPCBA between the top and bottom flexible encapsulation housing components.   
     
     
         36 . The method of  claim 35 , further comprising applying pressure to the stack to thereby cure the adhesive at or near room temperature. 
     
     
         37 . The method of  claim 35 , further comprising performing a die cut on the stack. 
     
     
         38 . The method of  claim 35 , further comprising priming portions of the FPCBA prior to dispensing the second shot of adhesive. 
     
     
         39 . The method of  claim 35 , wherein the FPCBA includes a plurality of spaced IC devices electrically connected via electrical interconnects, and wherein the top flexible encapsulation housing component comprises a plurality of pockets for seating therein the IC devices and the electrical interconnects. 
     
     
         40 . The method of  claim 35 , wherein the bottom encapsulation housing component comprises a second recessed substrate region for seating therein the flexible substrate. 
     
     
         41 . The method of  claim 35 , wherein the FPCBA includes a plurality of device islands electrically connected via flexible electrical interconnects. 
     
     
         42 . The method of  claim 35 , wherein the FPCBA is completely encased between the top and bottom flexible encapsulation housing components.