Thermal spray deposited environmental barrier coating

Abstract

In one example, a method for forming an environmental barrier coating (EBC) on a substrate. The method may include heating a backside of a substrate using a furnace enclosure, wherein a frontside of the substrate is outside the furnace enclosure, wherein the heating of the backside of the substrate with the furnace enclosure heats the frontside of the substrate to a surface temperature by heat conduction from the backside of the substrate to the frontside of the substrate; and depositing an environmental barrier coating (EBC) on the frontside of the substrate via a thermal spray device while the backside of the substrate is heated using the furnace enclosure, wherein the surface temperature of the frontside of the substrate is selected to control at least one of a porosity of the deposited EBC or a weight percent of a crystalline phase in the deposited EBC.

1 . A method comprising:
 heating a backside of a substrate using a furnace enclosure, wherein a frontside of the substrate is outside the furnace enclosure, wherein the heating of the backside of the substrate with the furnace enclosure heats the frontside of the substrate to a surface temperature by heat conduction from the backside of the substrate to the frontside of the substrate; and   depositing an environmental barrier coating (EBC) on the frontside of the substrate via a thermal spray device while the backside of the substrate is heated using the furnace enclosure, wherein the surface temperature of the frontside of the substrate is selected to control at least one of a porosity of the deposited EBC or a weight percent of a crystalline phase in the deposited EBC.   
     
     
         2 . The method of  claim 1 , wherein heating the backside of the substrate using the furnace enclosure comprises heating the backside of the substrate with the furnace enclosure having a furnace temperature of at about 1000 degrees Celsius to about 1400 degrees Celsius. 
     
     
         3 . The method of  claim 1 , wherein the surface temperature of the surface of the frontside is at least about 1000 degrees Celsius while the EBC is deposited on the frontside of the substrate. 
     
     
         4 . The method of  claim 1 , wherein the surface temperature of the surface of the frontside is at or above a crystalline transition temperature of the EBC when the EBC is deposited on the frontside of the substrate. 
     
     
         5 . The method of  claim 1 , wherein the furnace enclosure defines an opening approximately a size and shape of the substrate, wherein the substrate is located in the opening of the furnace enclosure during the backside heating such that the backside of the substrate is inside the furnace enclosure and the frontside of the substrate is outside of the furnace enclosure. 
     
     
         6 . The method of  claim 5 , wherein the substrate substantially covers the opening of the furnace enclosure. 
     
     
         7 . The method of  claim 1 , wherein the frontside of the substrate is not heated by another heating source during the deposition of the EBC on the frontside. 
     
     
         8 . The method of  claim 1 , wherein the deposited EBC includes at least about  50  weight percent crystalline phase. 
     
     
         9 . The method of  claim 1 , further comprising heat treating the deposited EBC at or above a heat treatment temperature for first period of time following the deposition of the deposited EBC on the substrate. 
     
     
         10 . The method of  claim 9 , wherein the heat-treated EBC includes at least about  96  weight percent crystalline phase. 
     
     
         11 . A system comprising:
 a furnace including a furnace enclosure, wherein the furnace is configured to heat a backside of a substrate using the furnace enclosure while a frontside of the substrate is outside the furnace enclosure;   a thermal spray device; and   a computing device configured to control the furnace to heat the backside of the substrates using the furnace enclosure to heat the frontside of the substrate to a surface temperature by heat conduction from the backside of the substrate to the frontside of the substrate; and control the thermal spray device to deposit an environmental barrier coating (EBC) on the frontside of the substrate while the backside of the substrate is heated using the furnace enclosure, wherein the surface temperature of the frontside of the substrate is selected to control at least one of a porosity of the deposited EBC or a weight percent of a crystalline phase in the deposited EBC.   
     
     
         12 . The system of  claim 11 , wherein heating the backside of the substrate using the furnace enclosure comprises heating the backside of the substrate with the furnace enclosure having a furnace temperature of at about 1000 degrees Celsius to about 1400 degrees Celsius. 
     
     
         13 . The system of  claim 11 , wherein the surface temperature of the surface of the frontside is at least about 1000 degrees Celsius while the EBC is deposited on the frontside of the substrate. 
     
     
         14 . The system of  claim 11 , wherein the surface temperature of the surface of the frontside is at or above a crystalline transition temperature of the EBC when the EBC is deposited on the frontside of the substrate. 
     
     
         15 . The system of  claim 11 , wherein the furnace enclosure defines an opening approximately a size and shape of the substrate, wherein the substrate is located in the opening of the furnace enclosure during the backside heating such that the backside of the substrate is inside the furnace enclosure and the frontside of the substrate is outside of the furnace enclosure. 
     
     
         16 . The system of  claim 15 , wherein the substrate substantially covers the opening of the furnace enclosure. 
     
     
         17 . The system of  claim 11 , wherein the frontside of the substrate is not heated by another heating source during the deposition of the EBC on the frontside. 
     
     
         18 . The system of  claim 11 , wherein the deposited EBC includes at least about  50  weight percent crystalline phase. 
     
     
         19 . The system of  claim 11 , further comprising heat treating the deposited EBC at or above a heat treatment temperature for first period of time following the deposition of the deposited EBC on the substrate. 
     
     
         20 . The system of  claim 19 , wherein the heat-treated EBC includes at least about  96  weight percent crystalline phase.