Silicon-containing resin composition

Abstract

A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the composition, and a crack-free silica-based coating film formed using the composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.

What is claimed is: 
     
         1 . A silicon-containing resin composition comprising a silicon-containing resin, a curing agent and a solvent,
 wherein the silicon-containing resin is one or more selected from the group consisting of a siloxane resin and a polysilane,   the curing agent comprises at least one curing agent selected from the group consisting of curing agents that generate a base component by the action of light or heat, Brønsted acids, imidazoles, organophosphorus compounds, organophosphorus compound complexes, organic amine complexes, and amidines, and   the solvent contains a cycloalkyl acetate represented by the following formula (S1):   
       
         
           
           
               
               
           
         
         wherein (S1) R s1  represents an alkyl group having 1 to 3 carbon atoms; p is an integer of 1 to 6; and q is an integer of 0 to (p+1), and 
         a content of the cycloalkyl acetate represented by the above formula (S1) in the solvent is 30 to 100% by mass. 
       
     
     
         2 . The silicon-containing resin composition according to  claim 1 , further comprising a nitroxy compound. 
     
     
         3 . A method for forming a silica-based coating film, comprising:
 applying the silicon-containing resin composition according to  claim 1  to a substrate to form a coating film; and   baking the coating film.   
     
     
         4 . The method for forming a silica-based coating film according to  claim 3 , wherein the silica-based coating film has a film thickness of 0.01 to 20 μm. 
     
     
         5 . A method for forming a silica-based coating film, comprising:
 applying the silicon-containing resin composition according to  claim 2  to a substrate to form a coating film; and   baking the coating film   
     
     
         6 . The method for forming a silica-based coating film according to  claim 5 , wherein the silica-based coating film has a film thickness of 0.01 to 20 μm.