Electronic package structure

Abstract

An electronic package structure includes a first printed circuit board, a second printed circuit board and first space columns. The first printed circuit board has a first surface and a through hole. The second printed circuit board has a second surface facing the first surface. Each first space column is interconnected between the first surface and the second surface. An encapsulation layer is filled between the first and second printed circuit boards and among the first space columns so as to define a hollow chamber. A MEMS microphone component located within the hollow chamber is located on the first surface and aligned with the through hole. A sensing component is located within the hollow chamber.

What is claimed is: 
     
         1 . An electronic package structure comprising:
 a first printed circuit board having a first surface and a through hole;   a second printed circuit board having a second surface facing the first surface;   a plurality of first space columns, each first space column is interconnected between the first surface and the second surface;   an encapsulation layer filled between the first and second printed circuit boards and among the first space columns so as to define a hollow chamber;   a Micro-Electro-Mechanical System (MEMS) microphone component disposed within the hollow chamber and located on the first surface and aligned with the through hole; and   a sensing component located within the hollow chamber.   
     
     
         2 . The electronic package structure of  claim 1 , wherein the first space columns are electrically-insulated columns. 
     
     
         3 . The electronic package structure of  claim 1  further comprising at least one electrically-conductive column disposed within the hollow chamber and interconnected between the first and second printed circuit boards. 
     
     
         4 . The electronic package structure of  claim 3  further comprising at least one acoustic signal processing component disposed within the hollow chamber and located on the first surface, wherein the acoustic signal processing component is electrically connected to the second printed circuit board via the electrically-conductive column. 
     
     
         5 . The electronic package structure of  claim 4 , wherein the electrically-conductive column is closer to the acoustic signal processing component than the first space columns. 
     
     
         6 . The electronic package structure of  claim 1  further comprising at least one second space column within the hollow chamber and interconnected between the first surface and the second surface. 
     
     
         7 . The electronic package structure of  claim 6 , wherein the second space column is not covered by the encapsulation layer. 
     
     
         8 . The electronic package structure of  claim 1  further comprising at least one integrated circuit component disposed within the hollow chamber and not covered by the encapsulation layer. 
     
     
         9 . The electronic package structure of  claim 1  further comprising at least one integrated circuit component disposed within the hollow chamber and covered by the encapsulation layer. 
     
     
         10 . The electronic package structure of  claim 1  further comprising at least one integrated circuit component disposed on the second printed circuit board and covered by the encapsulation layer, and the second printed circuit board has an area greater than that of the first printed circuit board. 
     
     
         11 . The electronic package structure of  claim 10 , wherein the first printed circuit board has a third surface opposite to the first surface, and the encapsulation layer covers the third surface but exposes the through hole. 
     
     
         12 . The electronic package structure of  claim 1 , wherein the sensing component is located on the second surface of the second printed circuit board. 
     
     
         13 . The electronic package structure of  claim 1 , wherein the MEMS microphone component and the sensing component are not covered by the encapsulation layer.