Filter component for filtering an interference signal

Abstract

A filter component for filtering an interference signal comprises at least one multilayer ceramic capacitor ( 2, 3, 5 ) having a main body ( 6 ), in which a plurality of ceramic layers ( 9 ) and internal electrodes ( 10, 11, 12 ) are stacked one above another, and wherein connection contacts ( 7, 8 ) are arranged at the main body ( 6 ). The ceramic layers ( 9 ) comprise a lead lanthanum zirconate titanate ceramic, for example.

1 - 13 . (canceled) 
     
     
         14 . A method of operating a multilayer ceramic capacitor for filtering an interference signal,
 wherein the multilayer ceramic capacitor is configured such that in a plot of the electrical capacitance of the multilayer capacitor over a voltage applied to the multilayer capacitor, the capacitance increases with increasing voltage until a maximum of capacitance at a voltage of greater than zero is reached and after that the capacitance decreases with increasing voltage, wherein the multilayer capacitor is operated at an operating voltage that is significantly less than the voltage at which the maximum of capacitance is reached.   
     
     
         15 . The method according to  claim 14 ,
 wherein the operating voltage is at most half the magnitude of the voltage at which the maximum of capacitance is reached.   
     
     
         16 . (canceled) 
     
     
         17 . The method according to  claim 14 , wherein the multilayer ceramic capacitor has a main body, in which a plurality of ceramic layers and internal electrodes are stacked one above another, wherein a ceramic material of the ceramic layers is of the formula
   Pb (1-1.5a-0.5b+1.5d+e+0.5f) A a B b (Zr 1-x Ti x ) (1-c-d-e-f) Li d C e Fe f Si c O 3   +y .PbO,   wherein A is selected from a group consisting of La, Nd, Y, Eu, Gd, Tb, Dy, Ho, Er and Yb; B is selected from a group consisting of Na, K and Ag; C is selected from a group consisting of Ni, Cu, Co and Mn; wherein:   0<a<0.12;   0.05≤x≤0.3;   0≤b<0.12;   0≤c<0.12;   0<d<0.12;   0≤e<0.12;   0≤f<0.12;   0≤y<1; and wherein   b+d+e+f>0.   
     
     
         18 . The method of  claim 32 , wherein at least one of the connection contacts comprises a layered structure of copper-Invar-copper. 
     
     
         19 . The method according to  claim 32 , wherein at least one of the connection contacts is a lead frame. 
     
     
         20 . The method according to  claim 32 , wherein at least one of the connection contacts is configured in meandering fashion. 
     
     
         21 . The method according to  claim 14 , wherein the multilayer ceramic capacitor is operated at a temperature of 150° C. or higher. 
     
     
         22 . The method according to  claim 14 , wherein the multilayer ceramic capacitor is operated in an automotive application. 
     
     
         23 . The method according to  claim 14 , wherein the multilayer ceramic capacitor is operated at voltage peaks of up to 2000 V. 
     
     
         24 . The method according to  claim 14 ,
 wherein the multilayer ceramic capacitor comprises ceramic layers comprising a lead lanthanum zirconate titanate ceramic.   
     
     
         25 . The method according to  claim 32 ,
 wherein at least one of the connection contacts is secured to the main body by a sintered connecting material.   
     
     
         26 . The method according to  claim 32 ,
 wherein an external electrode is arranged on at least one outer side of the main body, wherein the external electrode comprises at least one sputtered layer.   
     
     
         27 . The method according to  claim 32 ,
 wherein the multilayer ceramic capacitor comprises first internal electrodes, which are electrically connected to a first one of the connection contacts, second internal electrodes, which are connected to a second one of the connection contacts, and third internal electrodes, which are connected to none of the connection contacts.   
     
     
         28 . The method according to  claim 32 ,
 wherein at least one load relief region for mechanical load relief is formed in the main body.   
     
     
         29 . The method according to  claim 32 ,
 wherein the connection contacts are connected to a printed circuit board by a sintered connecting material.   
     
     
         30 . The method according to  claim 32 , wherein the printed circuit board is screwed to the busbar. 
     
     
         31 . The method according to  claim 14 ,
 wherein the multilayer ceramic capacitor is interconnected between first connections to a voltage supply and second connections to a load.   
     
     
         32 . The method according to  claim 14 ,
 wherein the multilayer ceramic capacitor has a main body, in which a plurality of ceramic layers and internal electrodes are stacked one above another, wherein connection contacts are arranged at the main body.   
     
     
         33 . The method according to  claim 14 , wherein the operating voltage is between 300 and 500 Volt DC and the maximum of capacitance is at a voltage of larger than 1000 Volt DC.