Head suspension assembly and disk apparatus

Abstract

A head suspension assembly includes a support plate, an interconnection member including a metal plate on the support plate, a first insulating layer on the metal plate, a conductive layer on the first insulating layer and forming a pair of connection pads, and a second insulating layer on the conductive layer, a head mounted in the interconnection member, and a piezoelectric element electrically connected to the connection pads and configured to displace the head when a predetermined voltage is applied to the connection pads. At least one opening is formed in each of the connection pads. The piezoelectric element is electrically connected to each of the connection pads by a conductive adhesive that is between the piezoelectric element and each of the connection pads and filled into the opening.

1 . A head suspension assembly comprising:
 a support plate;   an interconnection member comprising
 a metal plate on the support plate, 
 a first insulating layer on the metal plate, 
 a conductive layer on the first insulating layer and forming a pair of connection pads, and 
 a second insulating layer on the conductive layer; 
   a head mounted in the interconnection member; and   a piezoelectric element electrically connected to the connection pads and configured to displace the head when a predetermined voltage is applied to the connection pads, wherein   at least one opening is formed in each of the connection pads, and   the piezoelectric element is electrically connected to each of the connection pads by a conductive adhesive that is between the piezoelectric element and each of the connection pads and filled into the opening.   
     
     
         2 . The head suspension assembly according to  claim 1 , wherein
 the opening in each of the connection pads penetrates the conductive layer.   
     
     
         3 . The head suspension assembly according to  claim 2 , wherein
 the conductive adhesive is bonded to a surface of each of the connection pads, an inner surface of the opening, and a part of the first insulating layer.   
     
     
         4 . The head suspension assembly according to  claim 1 , wherein
 a plurality of openings is formed in each of the connection pads, and   the conductive adhesive is between the piezoelectric element and each of the connection pads and filled into the plurality of openings.   
     
     
         5 . The head suspension assembly according to  claim 4 , wherein
 a total number of the openings in one of the paired connection pads is greater than a total number of the openings in the other of the paired connection pads.   
     
     
         6 . The head suspension assembly according to  claim 1 , wherein
 a plurality of openings is formed on both sides of at least one of the connection pads.   
     
     
         7 . The head suspension assembly according to  claim 1 , wherein
 the opening in at least one of the connection pads has a wavelike shape.   
     
     
         8 . The head suspension assembly according to  claim 1 , wherein
 the opening in at least one of the connection pads has an H-shape.   
     
     
         9 . The head suspension assembly according to  claim 1 , wherein
 the pair of connection pads are arranged on one side of the piezoelectric element.   
     
     
         10 . The head suspension assembly according to  claim 1 , wherein
 the opening in at least one of the connection pads penetrates the conductive layer and the first insulating layer, and   the conductive adhesive is bonded to the surface of the one of the connection pads, an inner surface of the opening, and a part of the metal plate.   
     
     
         11 . A disk apparatus comprising:
 a disk-like recording medium having a recording layer; and   a head suspension assembly comprising:
 a support plate, 
 an interconnection member disposed on the support plate and comprising:
 a metal plate on the support plate, 
 a first insulating layer on the metal plate, 
 a conductive layer on the first insulating layer and forming a pair of connection pads, and 
 a second insulating layer on the conductive layer, 
 
 a head mounted in the interconnection member and configured to read data from and write data onto the recording layer, and 
 a piezoelectric element electrically connected to the connection pads and configured to displace the head when a predetermined voltage is applied to the connection pads, wherein 
 at least one opening is formed in each of the connection pads, and 
 the piezoelectric element is electrically connected to each of the connection pads by a conductive adhesive that is between the piezoelectric element and each of the connection pads and filled into the opening. 
   
     
     
         12 . The disk apparatus according to  claim 11 , wherein
 the opening in each of the connection pads penetrates the conductive layer.   
     
     
         13 . The disk apparatus according to  claim 12 , wherein
 the conductive adhesive is bonded to a surface of each of the connection pads, an inner surface of the opening, and a part of the first insulating layer.   
     
     
         14 . The disk apparatus according to  claim 11 , wherein
 a plurality of openings is formed in each of the connection pads, and   the conductive adhesive is between the piezoelectric element and each of the connection pads and filled into the plurality of openings.   
     
     
         15 . The disk apparatus according to  claim 14 , wherein
 a total number of the openings in one of the paired connection pads is greater than a total number of the openings in the other of the paired connection pads.   
     
     
         16 . The disk apparatus according to  claim 11 , wherein
 a plurality of openings is formed on both sides of at least one of the connection pads.   
     
     
         17 . The disk apparatus according to  claim 11 , wherein
 the opening in at least one of the connection pads has a wavelike shape.   
     
     
         18 . The disk apparatus according to  claim 11 , wherein
 the opening in at least one of the connection pads has an H-shape.   
     
     
         19 . The disk apparatus according to  claim 11 , wherein
 the pair of connection pads are arranged on one side of the piezoelectric element.   
     
     
         20 . The disk apparatus according to  claim 11 , wherein
 the opening in at least one of the connection pads penetrates the conductive layer and the first insulating layer, and   the conductive adhesive is bonded to the surface of the one of the connection pads, an inner surface of the opening, and a part of the metal plate.