Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor device

Abstract

A thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein a mass ratio (insulating-coated carbon fibers/binder resin) of the insulating-coated carbon fibers to the binder resin is less than 1.30, and wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.

1 - 12 : (canceled) 
     
     
         13 . A thermal conducting sheet, comprising:
 a binder resin;   insulating-coated carbon fibers; and   
       a thermal conducting filler other than the insulating-coated carbon fibers,
 wherein a mass ratio (insulating-coated carbon fibers/binder resin) of the insulating-coated carbon fibers to the binder resin is less than 1.30, 
 wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material, and 
 wherein an average thickness of the coating film is 100 nm or greater but 1,000 nm or less. 
 
     
     
         14 . The thermal conducting sheet according to  claim 13 ,
 wherein an amount of the thermal conducting filler is from 48% by volume through 75% by volume.   
     
     
         15 . The thermal conducting sheet according to  claim 13 ,
 wherein compressibility of the thermal conducting sheet at a load of 0.5 kgf/cm 2  is 3% or more.   
     
     
         16 . The thermal conducting sheet according to  claim 13 ,
 wherein the average thickness of the coating film is 200 nm or greater but 1,000 nm or less.   
     
     
         17 . The thermal conducting sheet according to  claim 13 ,
 wherein the thermal conducting filler includes at least one selected from the group consisting of aluminum oxide, aluminum nitride, and zinc oxide.   
     
     
         18 . The thermal conducting sheet according to  claim 13 ,
 wherein the binder resin is a silicone resin.   
     
     
         19 . A method for producing the thermal conducting sheet according to  claim 13 , the method comprising:
 obtaining a molded body of a thermal conducting resin composition containing the binder resin, the insulating-coated carbon fibers, and the thermal conducting filler by molding the thermal conducting resin composition into a predetermined shape and curing the thermal conducting resin composition; and   obtaining a molded body sheet by cutting the molded body so as to have a sheet shape.   
     
     
         20 . The method for producing the thermal conducting sheet according to  claim 19 , further comprising:
 obtaining the insulating-coated carbon fibers by applying energy to a mixture obtained by mixing the polymerizable material, the carbon fibers, a polymerization initiator, and a solvent to activate the polymerization initiator, and form a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of the polymerizable material.   
     
     
         21 . A heat dissipation member, comprising:
 a heat spreader configured to dissipate heat generated by an electronic part; and   the thermal conducting sheet according to  claim 13  provided on the heat spreader and interposed between the heat spreader and the electronic part.   
     
     
         22 . A semiconductor device, comprising:
 an electronic part;   a heat spreader configured to dissipate heat generated by the electronic part; and   the thermal conducting sheet according to  claim 13  provided on the heat spreader and interposed between the heat spreader and the electronic part.   
     
     
         23 . The semiconductor device according to  claim 22 , further comprising:
 a heat sink,   wherein the thermal conducting sheet according to  claim 13  is interposed between the heat spreader and the heat sink.