Resin multilayer substrate

Abstract

A resin multilayer substrate includes a stacked body including resin layers, a component, one or more first conductor patterns, and one or more second conductor patterns each disposed in a gap between the resin layers. At least a portion of an outline of each of the one or more first conductor patterns overlaps with the component. An outline of each of the one or more second conductor patterns does not overlap with the component. A resin portion is adjacent to each of the one or more first conductor patterns along a portion of the outline of each of the one or more first conductor patterns that overlaps with the component. The resin portion is made of a resin paste including thermoplastic resin powder as a main material. The resin portion is not disposed in a portion along the outline of each of the one or more second conductor patterns.

What is claimed is: 
     
         1 . A method of manufacturing a resin multilayer substrate, the method comprising:
 preparing a plurality of resin sheets;   stacking the plurality of resin sheets; and   thermocompression-bonding the stack of the plurality of resin sheets; wherein   a component is embedded in the stack of the plurality of resin sheets;   in the step of preparing the plurality of resin sheets, a conductor pattern is formed on at least one of the plurality of resin sheets;   the conductor pattern includes one or more first conductor patterns and one or more second conductor patterns;   each of the one or more first conductor patterns overlaps with the component when viewed in a stacking direction of the plurality of resin sheets;   none of the one or more second conductor patterns overlaps with the component when viewed in the stacking direction; and   at least one resin portion including a thermoplastic resin is formed on a surface of at least one of the plurality of resin sheets so as to be disposed at a position along an outline of each of the one or more first conductor patterns, and so as not to be disposed at a position along an outline of each of the one or more second conductor patterns.   
     
     
         2 . A method of manufacturing a resin multilayer substrate, the method comprising:
 preparing a plurality of resin sheets;   stacking the plurality of resin sheets; and   thermocompression-bonding the stack of the plurality of resin sheets; wherein   a cavity is formed in the stack of the plurality of resin sheets;   in the step of preparing the plurality of resin sheets, a conductor pattern is formed on at least one of the plurality of resin sheets;   the conductor pattern includes one or more first conductor patterns and one or more second conductor patterns;   each of the one or more first conductor patterns overlaps with the cavity when viewed in a stacking direction of the plurality of resin sheets;   none of the one or more second conductor patterns overlaps with the cavity when viewed in the stacking direction; and   at least one resin portion including a thermoplastic resin is formed on a surface of at least one of the plurality of resin sheets so as to be disposed at a position along an outline of each of the one or more first conductor patterns, and so as not to be disposed at a position along an outline of each of the one or more second conductor patterns.   
     
     
         3 . A method of manufacturing a resin multilayer substrate, the method comprising:
 preparing a plurality of resin sheets;   stacking the plurality of resin sheets; and   thermocompression-bonding the stack of the plurality of resin sheets; wherein   a first conductive foil is embedded in the stack of the plurality of resin sheets;   in the step of preparing the plurality of resin sheets, a conductor pattern is formed on at least one of the plurality of resin sheets;   the conductor pattern includes one or more first conductor patterns and one or more second conductor patterns;   each of the one or more first conductor patterns overlaps with the first conductive foil when viewed in a stacking direction of the plurality of resin sheets;   none of the one or more second conductor patterns overlaps with the first conductive foil when viewed in the stacking direction;   at least one resin portion including a thermoplastic resin is formed on a surface of the at least one of the plurality of resin sheets so as to be disposed at a position along an outline of each of the one or more first conductor patterns, and so as not to be disposed at a position along an outline of each of the one or more second conductor patterns; and   the first conductive foil is thicker than each of the one or more first conductor patterns and each of the one or more second conductor patterns.   
     
     
         4 . A method of manufacturing a resin multilayer substrate, the method comprising:
 preparing a plurality of resin sheets;   stacking the plurality of resin sheets; and   thermocompression-bonding the stack of the plurality of resin sheets; wherein   a component is embedded in the stack of the plurality of resin sheets;   in the step of preparing the plurality of resin sheets, a conductor-via joint portion is formed in the plurality of resin sheets;   the conductor-via joint portion includes one or more first conductor-via joint portions and one or more second conductor-via joint portions;   each of the one or more first conductor-via joint portions overlaps with the component when viewed in a stacking direction of the plurality of resin sheets;   none of the one or more second conductor-via joint portions overlaps with the component when viewed in the stacking direction; and   at least one resin portion including a thermoplastic resin is formed on a surface of the resin sheet so as to be disposed at a position along an outline of each of the one or more first conductor-via joint portions, and so as not to be disposed at a position along an outline of each of the one or more second conductor-via joint portions.   
     
     
         5 . A method of manufacturing a resin multilayer substrate, the method comprising:
 preparing a plurality of resin sheets;   stacking the plurality of resin sheets; and   thermocompression-bonding the stack of the plurality of resin sheets; wherein   a cavity is formed in the stack of the plurality of resin sheets;   in the step of preparing the plurality of resin sheets, a conductor-via joint portion is formed in the plurality of resin sheets;   the conductor-via joint portion includes one or more first conductor-via joint portions and one or more second conductor-via joint portions;   each of the one or more first conductor-via joint portions overlaps with the cavity when viewed in a stacking direction of the plurality of resin sheets;   none of the one or more second conductor-via joint portions overlaps with the cavity when viewed in the stacking direction; and   at least one resin portion including a thermoplastic resin is formed on a surface of at least one of the plurality of resin sheets so as to be disposed at a position along an outline of each of the one or more first conductor-via joint portions, and so as not to be disposed at a position along an outline of each of the one or more second conductor-via joint portions.   
     
     
         6 . A method of manufacturing a resin multilayer substrate, the method comprising:
 preparing a plurality of resin sheets;   stacking the plurality of resin sheets; and   thermocompression-bonding the stack of the plurality of resin sheets; wherein   a first conductive foil is embedded in the stack of the plurality of resin sheets;   in the step of preparing the plurality of resin sheets, a conductor-via joint portion is formed in the plurality of resin sheets;   the conductor-via joint portion includes one or more first conductor-via joint portions and one or more second conductor-via joint portions;   each of the one or more first conductor-via joint portions overlaps with the first conductive foil when viewed in a stacking direction of the plurality of resin sheets;   none of the one or more second conductor-via joint portions overlaps with the first conductive foil when viewed in the stacking direction;   at least one resin portion including a thermoplastic resin is formed on a surface of at least one of the plurality of resin sheets so as to be disposed at a position along an outline of each of the one or more first conductor-via joint portions, and so as not to be disposed at a position along an outline of each of the one or more second conductor-via joint portions; and   the first conductive foil is thicker than any other conductive foils provided inside the stack of the plurality of resin sheets.   
     
     
         7 . The method of manufacturing a resin multilayer substrate according to  claim 1 , wherein the at least one resin portion is formed by applying a resin paste. 
     
     
         8 . The method of manufacturing a resin multilayer substrate according to  claim 7 , wherein the resin paste includes a fibrillated liquid crystal polymer. 
     
     
         9 . The method of manufacturing a resin multilayer substrate according to  claim 1 , wherein
 the plurality of resin sheets include a thermoplastic resin as a main material; and   the thermoplastic resin of the at least one resin portion is the same as the thermoplastic resin of the plurality of resin sheets.