Telecommunications device

Abstract

The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

1 - 27 . (canceled) 
     
     
         28 . A telecommunications jack comprising:
 a housing defining a port for receiving a plug;   a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing;   a plurality of wire termination contacts for terminating wires to the jack;   a circuit board that electrically connects the contact springs to the wire termination contacts, the circuit board including first and second conductive layers separated by a first dielectric layer, the first dielectric layer having a thickness less than 0.01 inches, and the first conductive layer being an outermost layer of the circuit board; and   the first and second conductive layers respectively including first and second capacitor plates for providing a capacitive coupling between conductive tracings of the first and second conductive layers, the first and second capacitor plates opposing one another and being separated by the first dielectric layer.   
     
     
         29 . The telecommunications jack of  claim 28 , wherein the first dielectric layer has a thickness less than 0.0075 inches. 
     
     
         30 . The telecommunications jack of  claim 29 , further comprising a third conductive layer separated from the second conductive layer by a second dielectric layer, the second dielectric layer being thicker than the first dielectric layer. 
     
     
         31 . The telecommunications jack of  claim 30 , wherein the second dielectric layer is at least 2.5 times thicker than the first dielectric layer. 
     
     
         32 . The telecommunications jack of  claim 31 , wherein the third conductive layer includes capacitor elements for providing a capacitive coupling between conductive tracings of the third conductive layer. 
     
     
         33 . The telecommunications jack of  claim 28 , further comprising a second dielectric layer that is at least 2.5 times thicker than the first dielectric layer.