US2020235150A1PendingUtilityA1

Solid-state image pickup device and method of driving the same

Assignee: SONY CORPPriority: Dec 5, 2012Filed: Apr 7, 2020Published: Jul 23, 2020
Est. expiryDec 5, 2032(~6.3 yrs left)· nominal 20-yr term from priority
H10W 20/496H04N 25/76H10F 39/811H10F 39/803H04N 25/78H10D 99/00H10F 39/80373H10F 39/8063H10F 39/8057H10F 39/8053H10F 39/8037H10F 39/813H10F 39/199H10F 39/182H10F 39/18H10F 39/80H10F 39/8027H01L 27/14609H01L 27/14607H01L 23/5223H04N 5/374H01L 27/14621H01L 27/14645H01L 27/14612H01L 27/14641H01L 27/14601H01L 27/1464H01L 27/14627H01L 27/14636H01L 27/00H01L 27/14614H01L 27/14623H01L 27/14643H04N 5/378
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Claims

Abstract

Imaging sensors, imaging apparatuses, and methods of driving an image sensor are provided. An image sensor can include a semiconductor substrate with a photoelectric conversion element and a charge-conversion element. The sensor can further include a capacitance switch. A charge accumulation element is located adjacent the photoelectric conversion element. At least a portion of the charge accumulation element overlaps a charge accumulation region of the photoelectric conversion element. The charge accumulation element is selectively connected to the charge-voltage conversion element by the capacitance switch.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A light detecting device, comprising:
 a semiconductor substrate including:   a plurality of photoelectric conversion elements formed in a semiconductor substrate, which includes a first photoelectric conversion element configured to receive light from a first surface of the semiconductor substrate;   a floating diffusion region configured to receive a first electric charge from the first photoelectric conversion element through a first transfer transistor; and   a wiring layer disposed over a second surface of the semiconductor substrate, the wiring layer including a first charge accumulation element selectively coupled to the floating diffusion region,   wherein the second surface is opposed to the first surface.   
     
     
         2 . The light detecting device of  claim 1 , wherein the first photoelectric conversion element is between an on-chip lens and the wiring layer. 
     
     
         3 . The light detecting device of  claim 1 , wherein at least a part of the first charge accumulation element overlaps the first photoelectric conversion element. 
     
     
         4 . The light detecting device of  claim 1 , further comprising a switch transistor coupled to the floating diffusion region and the first charge accumulation element. 
     
     
         5 . The light detecting device of  claim 4 , wherein
 the charge accumulation element includes:
 a first electrode coupled to the switch transistor; and 
 a second electrode coupled to a wiring. 
   
     
     
         6 . The light detecting device of  claim 5 , wherein the wiring configured to receive a ground potential. 
     
     
         7 . The light detecting device of  claim 5 , wherein the floating diffusion region is selectively coupled to the first electrode via the switch transistor. 
     
     
         8 . The light detecting device of  claim 4 , further comprising a reset transistor coupled to the switch transistor. 
     
     
         9 . The light detecting device of  claim 8 , wherein a source of the reset transistor and one of a drain or a source of the switch transistor are in a common region. 
     
     
         10 . The light detecting device of  claim 1 , further comprising
 an amplifier transistor coupled to the floating diffusion region.

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