Circumscribing defects in optical devices

Abstract

Methods of circumscribing defects in optical devices are described. A perimeter is formed about a defect by laser ablation, where the perimeter electrically isolates the defect. The perimeter does not have damage due to excess energy from the laser and thus does not create new electrical shorts.

1 - 41 . (canceled) 
     
     
         42 . A method of forming a laser ablation perimeter surrounding a defect in an electrochromic device, the method comprising:
 (a) energizing a laser while a laser beam is shuttered;   (b) allowing the laser to reach a steady state energy level before opening a shutter; and   (c) applying a laser focus at a first position located within an area that will be surrounded by the laser ablation perimeter and circumscribing the defect with the laser beam by moving the laser focus along the laser ablation perimeter.   
     
     
         43 . The method of  claim 42 , further comprising closing the laser ablation perimeter by overlapping the laser focus at a second position at the laser ablation perimeter. 
     
     
         44 . The method of  claim 43 , further comprising returning the laser focus to the area surrounded by the laser ablation perimeter where a laser ablation is then ceased. 
     
     
         45 . The method of  claim 43 , wherein overlapping the laser focus at the second position generates an overlap of between 25% and 90% of a thickness of a laser line. 
     
     
         46 . The method of  claim 43 , wherein overlapping the laser focus at the second position generates an overlap of between 25% and 90% of a thickness of a laser line. 
     
     
         47 . The method of  claim 43 , wherein overlapping the laser focus at the second position generates an overlap of between 50% and 90% of a thickness of a laser line. 
     
     
         48 . The method of  claim 42 , wherein the laser ablation perimeter has an average diameter of 200 micrometers or less. 
     
     
         49 . The method of  claim 42 , wherein the laser ablation perimeter has an average diameter of 100 micrometers or less. 
     
     
         50 . The method of  claim 42 , wherein a fluence level of the laser at a beginning and end of the circumscription of the defect is lower than a fluence level of the laser during the remainder of the circumscription of the defect. 
     
     
         51 . The method of  claim 42 , wherein circumscribing the defect with the laser beam includes increasing a fluence level of the laser while translating the laser focus from a first region to a second region of the laser ablation perimeter. 
     
     
         52 . The method of  claim 51 , further comprising increasing the fluence level while translating the laser focus from the second region to the first region to close the laser ablation perimeter. 
     
     
         53 . A method of ablating a defect in an electrochromic device, the method comprising:
 (a) locating a laser focus at a first position at or near the defect; and   (b) moving the laser focus to ablate one or more regions that include a defect area, wherein moving the laser focus includes rasterizing the laser focus over the one or more regions.   
     
     
         54 . The method of  claim 53 , wherein the one or more regions are overlapping. 
     
     
         55 . The method of  claim 54 , wherein moving the laser focus to ablate the one or more overlapping regions comprises overlapping the laser focus in overlapping areas. 
     
     
         56 . The method of  claim 53 , wherein the one or more regions form a cross shape. 
     
     
         57 . The method of  claim 53 , wherein the one or more regions form a rectangular shape. 
     
     
         58 . The method of  claim 53 , wherein the one or more regions form a sawtooth pattern. 
     
     
         59 . The method of  claim 53 , wherein the laser focus is in the form of a laser spot. 
     
     
         60 . The method of  claim 59 , wherein the laser spot is in a rectangular shape. 
     
     
         61 . The method of  claim 53 , wherein there is an overlap of the laser focus during rasterizing.