Measurement device and measurement method, exposure apparatus and exposure method, and device manufacturing method

Abstract

An alignment system is equipped with: an alignment system having an objective optical system, an irradiation system and a beam receiving system; and a calculation system, the objective optical system including an objective transparent plate that faces a wafer movable in a Y-axis direction, the irradiation system irradiating a grating mark provided at the wafer with measurement beams via the objective transparent plate while scanning the measurement beams in the Y-axis direction, the beam receiving system receiving diffraction beams from the grating mark of the measurement beams via the objective optical system, and the calculation system obtaining positional information of the grating mark on the basis of the output of the beam receiving system, wherein the objective transparent plate deflects or diffracts the diffraction beams diffracted at the grating mark toward the beam receiving system.

1 - 19 . (canceled) 
     
     
         20 . A measurement system comprising:
 a mark detection device that has an irradiation system and a beam receiving system, the irradiation system irradiating a mark provided at an object that is moving with a measurement beam while moving the measurement beam, the beam receiving system receiving a beam from the mark; and   a position measurement device separated from the mark detection device, that acquires position information on a surface of the object, wherein   acquisition of the position information on the surface of the object by the position measurement device is performed prior to detection of the mark by the mark detection device.   
     
     
         21 . The measurement system according to  claim 20 , wherein
 a movement direction of the object and a movement direction of the measurement beam are in a first axis direction.   
     
     
         22 . The measurement system according to  claim 21 , wherein
 by movement of the object in the first axis direction, the object comes close to a processing position where a processing device is capable of applying processing to the object.   
     
     
         23 . The measurement system according to  claim 21 , further comprising
 a first movement device that moves the object in the first axis direction.   
     
     
         24 . The measurement system according to  claim 20 , wherein
 the mark is provided on the surface of the object, and   the position information on the surface of the object acquired by the position measurement device is position information on the surface of the object in a second axis direction intersecting the surface of the object.   
     
     
         25 . The measurement system according to  claim 24 , further comprising
 a second movement device that moves the object in the second axis direction, based on the position information on the surface of the object in the second axis direction acquired by the position measurement device, wherein   movement of the object by the second movement device is performed prior to the detection of the mark by the mark detection device.   
     
     
         26 . The measurement system according to  claim 20 , further comprising
 an objective optical system, wherein   the mark is a diffraction mark, and   the beam receiving system receives a diffraction beam, via the objective optical system, from the diffraction mark of the object facing the objective optical system.   
     
     
         27 . The measurement system according to  claim 26 , wherein
 the objective optical system includes an objective optical element, and   the objective optical element has a first area in which an optical path of the measurement beam from the irradiation system is provided, and a second area in which an optical component is provided, the optical component deflecting or diffracting the diffraction beam generated at the diffraction mark toward the beam receiving system.   
     
     
         28 . The measurement system according to  claim 26 , wherein
 the objective optical system includes an objective optical element, and   the objective optical element deflects or diffracts a beam other than a zero-order beam of the diffraction beam toward the beam receiving system.   
     
     
         29 . The measurement system according to  claim 20 , further comprising
 a mark position acquiring device that acquires position information of the mark based on a detection result of the mark detection device; and   an object position controlling device that controls a position of the object based on the position information of the mark acquired by the mark position acquiring device.   
     
     
         30 . An exposure apparatus comprising:
 the measurement system according to  claim 29 ; and   a pattern formation device that forms a predetermined pattern on the object by irradiating the object with an energy beam.   
     
     
         31 . A measurement system comprising:
 a mark detection device that has an irradiation system and a beam receiving system, the irradiation system irradiating a mark provided at an object that is moving with a measurement beam while moving the measurement beam, the beam receiving system receiving a beam from the mark; and   a position measurement device separated from the mark detection device, that acquires position information on a surface of the object, wherein   acquisition of the position information on the surface of the object by the position measurement device is performed in parallel with detection of the mark by the mark detection device.   
     
     
         32 . The measurement system according to  claim 31 , wherein
 a movement direction of the object and a movement direction of the measurement beam are in a first axis direction.   
     
     
         33 . The measurement system according to  claim 32 , wherein
 by movement of the object in the first axis direction, the object comes close to a processing position where a processing device is capable of applying processing to the object.   
     
     
         34 . The measurement system according to  claim 32 , further comprising
 a first movement device that moves the object in the first axis direction.   
     
     
         35 . The measurement system according to  claim 31 , wherein
 the mark is provided on the surface of the object, and   the position information on the surface of the object acquired by the position measurement device is position information on the surface of the object in a second axis direction intersecting the surface of the object.   
     
     
         36 . The measurement system according to  claim 35 , further comprising
 a second movement device that moves the object in the second axis direction, based on the position information on the surface of the object in the second axis direction acquired by the position measurement device.   
     
     
         37 . The measurement system according to  claim 31 , further comprising
 an objective optical system, wherein   the mark is a diffraction mark, and   the beam receiving system receives a diffraction beam, via the objective optical system, from the diffraction mark of the object facing the objective optical system.   
     
     
         38 . The measurement system according to  claim 37 , wherein
 the objective optical system includes an objective optical element, and   the objective optical element has a first area in which an optical path of the measurement beam from the irradiation system is provided, and a second area in which an optical component is provided, the optical component deflecting or diffracting the diffraction beam generated at the diffraction mark toward the beam receiving system.   
     
     
         39 . The measurement system according to  claim 37 , wherein
 the objective optical system includes an objective optical element, and   the objective optical element deflects or diffracts a beam other than a zero-order beam of the diffraction beam toward the beam receiving system.   
     
     
         40 . The measurement system according to  claim 31 , further comprising
 a mark position acquiring device that acquires position information of the mark based on a detection result of the mark detection device; and   an object position controlling device that controls a position of the object based on the position information of the mark acquired by the mark position acquiring device.   
     
     
         41 . An exposure apparatus comprising:
 the measurement system according to  claim 40 ; and   a pattern formation device that forms a predetermined pattern on the object by irradiating the object with an energy beam.   
     
     
         42 . A measurement system in which an object that moves toward a processing position serves as a measurement target, in the processing position a processing device being capable of applying processing to the object, the measurement system comprising:
 a mark detection device that has an irradiation system to irradiate a mark provided at the object that is moving with a measurement beam while moving the measurement beam; and   a beam receiving system to receive a beam from the mark, wherein   the irradiation system irradiates the object with the measurement beam while moving the measurement beam, during a period when the object moves toward the processing position.   
     
     
         43 . The measurement system according to  claim 42 , wherein
 a movement direction of the object and a movement direction of the measurement beam are in a first axis direction.   
     
     
         44 . The measurement system according to  claim 43 , further comprising
 a first movement device that moves the object in the first axis direction.   
     
     
         45 . The measurement system according to  claim 42 , further comprising
 a position measurement device that acquires position information on a surface of the object in a second axis direction intersecting the surface of the object, wherein   the mark is provided on the surface of the object.   
     
     
         46 . The measurement system according to  claim 45 , further comprising
 a second movement device that moves the object in the second axis direction, based on the position information on the surface of the object in the second axis direction acquired by the position measurement device, wherein   movement of the object by the second movement device is performed prior to detection of the mark by a mark detection device having the irradiation system and the beam receiving system.   
     
     
         47 . The measurement system according to  claim 45 , wherein
 acquisition of the position information by the position measurement device is performed prior to detection of the mark by a mark detection device having the irradiation system and the beam receiving system.   
     
     
         48 . The measurement system according to  claim 45 , wherein
 a distance between the object and the processing position on detection of the mark by a mark detection device having the irradiation system and the beam receiving system is shorter than a distance between the object and the processing position on acquisition of the position information by the position measurement device.   
     
     
         49 . The measurement system according to  claim 42 , further comprising
 an objective optical system, wherein   the mark is a diffraction mark, and   the beam receiving system receives a diffraction beam, via the objective optical system, from the diffraction mark of the object facing the objective optical system.   
     
     
         50 . The measurement system according to  claim 49 , wherein
 the objective optical system includes an objective optical element, and   the objective optical element has a first area in which an optical path of the measurement beam from the irradiation system is provided, and a second area in which an optical component is provided, the optical component deflecting or diffracting the diffraction beam generated at the diffraction mark toward the beam receiving system.   
     
     
         51 . The measurement system according to  claim 49 , wherein
 the objective optical system includes an objective optical element, and   the objective optical element deflects or diffracts a beam other than a zero-order beam of the diffraction beam toward the beam receiving system.   
     
     
         52 . The measurement system according to  claim 42 , further comprising
 a mark position acquiring device that acquires position information of the mark based on a detection result of the mark detection device; and   an object position controlling device that controls a position of the object based on the position information of the mark acquired by the mark position acquiring device.   
     
     
         53 . An exposure apparatus comprising:
 the measurement system according to  claim 52 ; and   a pattern formation device that forms a predetermined pattern on the object by irradiating the object with an energy beam.   
     
     
         54 . A measurement method comprising:
 irradiating a mark provided at an object that is moving with a measurement beam while moving the measurement beam, and receiving a beam from the mark; and   acquiring position information on a surface of the object, wherein   the acquiring is performed prior to detecting the mark by the irradiating and the receiving.   
     
     
         55 . A measurement method comprising:
 irradiating a mark provided at an object that is moving with a measurement beam while moving the measurement beam, and receiving a beam from the mark; and   acquiring position information on a surface of the object, wherein   the acquiring is performed in parallel with detecting the mark by the irradiating and the receiving.   
     
     
         56 . A measurement method in which an object that moves toward a processing position serves as a measurement target, in the processing position processing being applied to the object, the measurement method comprising:
 irradiating a mark provided at the object that is moving with a measurement beam while moving the measurement beam; and   receiving a beam from the mark, wherein   the measurement beam is irradiated on the object while being moved, during a period when the object moves toward the processing position.