US2020222825A1PendingUtilityA1

Hexavalent chromium free etch manganese recovery system

Assignee: SRG GLOBAL LLCPriority: Jul 10, 2017Filed: Jan 20, 2020Published: Jul 16, 2020
Est. expiryJul 10, 2037(~11 yrs left)· nominal 20-yr term from priority
C25D 21/16C23C 18/24C23C 18/1893B01D 3/10B01D 3/085B01D 1/26B01D 1/22C25D 13/16C09K 13/00C08J 7/12B01D 1/14C09K 13/04C23C 18/31C25D 13/24
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Claims

Abstract

Methods for recovering manganese etchant solutions are provided wherein a process solution used to rinse or neutralize a nonconductive substrate after etching the substrate is collected and evaporated to provide a concentrated process solution that is fed back into the manganese etchant solution or acid rinse.

Claims

exact text as granted — not AI-modified
1 - 24 . (canceled) 
     
     
         25 . An evaporating system for recovering a manganese etchant solution, the evaporating system comprising:
 an evaporator assembly for evaporating water from a process solution to form a concentrated process solution,   wherein the evaporator assembly is connected to a process tank for use in an electroless metallization process,   wherein the process tank contains the process solution that is configured to be transferred into an evaporating processing tank.   
     
     
         26 . The evaporating system of  claim 25 , wherein the evaporating processing tank further comprises a heater and an air agitator. 
     
     
         27 . The evaporating system of  claim 25 , wherein the evaporator assembly discharges the concentrated process solution when it is concentrated to greater than or equal to about 2 g/L Mn. 
     
     
         28 . The evaporating system of  claim 25 , wherein the process solution comprises a source of manganese ions. 
     
     
         29 . The evaporating system of  claim 25 , wherein the process solution comprises an acid. 
     
     
         30 . The evaporating system of  claim 25 , wherein the evaporator assembly comprises a vacuum evaporator. 
     
     
         31 . The evaporating system of  claim 25 , wherein the evaporator assembly comprises an atmospheric evaporator. 
     
     
         32 . The evaporating system of  claim 25 , wherein the evaporating system comprises a first conduit for transferring the process solution from the process tank to the evaporating processing tank. 
     
     
         33 . The evaporating system of  claim 32 , wherein the first conduit includes a filter. 
     
     
         34 . The evaporating system of  claim 32 , wherein the first conduit includes a one-way valve. 
     
     
         35 . The evaporating system of  claim 32 , wherein the first conduit includes a pump. 
     
     
         36 . A method for etching a substrate using the evaporating system of  claim 25 , the method comprising:
 etching a nonconductive substrate with a manganese etchant solution to form an etched substrate;   neutralizing with a neutralizer the etched substrate, wherein the neutralizer comprises a process solution comprising an acid and an oxidizer;   removing from the neutralizer at least a portion of the process solution to the evaporator assembly;   evaporating the process solution in the evaporator assembly to remove water from the process solution to form the concentrated process solution.   
     
     
         37 . The method of  claim 36 , the method further comprising activating the etched substrate after neutralizing. 
     
     
         38 . The method of  claim 37 , the method further comprising accelerating the etched substrate after activating. 
     
     
         39 . The method of  claim 36 , the method further comprising metallizing the etched substrate after neutralizing to provide a metallized substrate. 
     
     
         40 . A vehicle component comprising the metallized substrate of  claim 39 . 
     
     
         41 . The vehicle component of  claim 40 , wherein the vehicle component comprises a decorative trim.

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