Casting mold material and copper alloy material

Abstract

A casting mold material used when casting a metal material includes, as a composition: Cr within a range of 0.3 mass % or more and 0.7 mass % or less; Zr within a range of 0.025 mass % or more and 0.15 mass % or less; Sn within a range of 0.005 mass % or more and 0.04 mass % or less; P within a range of 0.005 mass % or more and 0.03 mass % or less; and a balance consisting of Cu and inevitable impurities, in which a Zr content [Zr] (mass %) and a P content [P] (mass %) have a relationship of [Zr]/[P]≥5, and a Sn content [Sn] (mass %) and a P content [P] (mass %) have a relationship of [Sn]/[P]≤5.

1 . A casting mold material used when casting a metal material, comprising:
 Cr within a range of 0.3 mass % or more and 0.7 mass % or less;   Zr within a range of 0.025 mass % or more and 0.15 mass % or less;   Sn within a range of 0.005 mass % or more and 0.04 mass % or less;   P within a range of 0.005 mass % or more and 0.03 mass % or less; and   a balance consisting of Cu and inevitable impurities,   wherein a Zr content [Zr] (mass %) and a P content [P] (mass %) have a relationship of [Zr]/[P]≥5, and   a Sn content [Sn] (mass %) and a P content [P] (mass %) have a relationship of [Sn]/[P]≤5.   
     
     
         2 . The casting mold material according to  claim 1 , further comprising:
 Si within a range of 0.005 mass % or more and 0.03 mass % or less.   
     
     
         3 . The casting mold material according to  claim 1 ,
 wherein a total content of Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti is 0.03 mass % or less.   
     
     
         4 . The casting mold material according to  claim 1 ,
 wherein electrical conductivity is higher than 70% IACS.   
     
     
         5 . The casting mold material according to  claim 1 ,
 wherein Vickers hardness is 115 Hv or more.   
     
     
         6 . The casting mold material according to  claim 1 ,
 wherein an average crystal grain size after performing heat treatment at 1000° C. for 30 minutes is 100 μm or smaller.   
     
     
         7 . A copper alloy material comprising:
 Cr within a range of 0.3 mass % or more and 0.7 mass % or less;   Zr within a range of 0.025 mass % or more and 0.15 mass % or less;   Sn within a range of 0.005 mass % or more and 0.04 mass % or less;   P within a range of 0.005 mass % or more and 0.03 mass % or less; and   a balance consisting of Cu and inevitable impurities,   wherein a Zr content [Zr] (mass %) and a P content [P] (mass %) have a relationship of [Zr]/[P]≥5,   a Sn content [Sn] (mass %) and a P content [P] (mass %) have a relationship of [Sn]/[P]≤5, and   electrical conductivity after performing a solution treatment at 1015° C. for 1.5 hours and then performing an aging treatment at 475° C. for 3 hours is higher than 70% IACS.   
     
     
         8 . The copper alloy material according to  claim 7 , further comprising:
 Si within a range of 0.005 mass % or more and 0.03 mass % or less.   
     
     
         9 . The copper alloy material according to  claim 7 ,
 wherein a total content of elements of Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti is 0.03 mass % or less.