Semiconductor module

Abstract

A semiconductor module includes a plurality of semiconductor elements, a sealing resin body, a positive electrode side terminal, a negative electrode side terminal, and an output terminal. The positive electrode side terminal, the negative electrode side terminal, and the output terminal are each connected to any of the semiconductor elements, and project from a same surface of the sealing resin body. Projecting portions of the positive electrode side terminal, the negative electrode side terminal, and the output terminal are arranged next to each other in an arrangement direction so that the projecting portion of the output terminal is located at an end.

1 . A semiconductor module comprising:
 a plurality of semiconductor elements that constitute upper and lower arms;   a sealing resin body that seals the plurality of semiconductor elements;   a first power supply terminal and a second power supply terminal, each of the first power supply terminal and the second power supply terminal being connected to any of the plurality of semiconductor elements and projecting from the sealing resin body, the first power supply terminal being one of a positive electrode side terminal and a negative electrode side terminal, the second power supply terminal being the other of the positive electrode side terminal and the negative electrode side terminal; and   an output terminal that is connected to any of the plurality of semiconductor elements and projects from the sealing resin body, wherein   the first power supply terminal, the second power supply terminal, and the output terminal project from a same surface of the sealing resin body, and projecting portions of the first power supply terminal, the second power supply terminal, and the output terminal are arranged next to each other in an arrangement direction so that the projecting portion of the output terminal is located at a first end, the projecting portion of the first power supply terminal is located at a second end opposite to the first end, and the projecting portion of the second power supply terminal is located between the projecting portion of the first power supply terminal and the projecting portion of the output terminal,   a projection length of the projecting portion of the first power supply terminal is shorter than a projection length of the projecting portion of the second power supply terminal, and   at least one of the projecting portion of the first power supply terminal and the projecting portion of the second power supply terminal has a notch, whereas the projecting portion of the output terminal does not have the notch.   
     
     
         2 . The semiconductor module according to  claim 1 , wherein
 the projecting portion of the first power supply terminal has the notch.   
     
     
         3 . The semiconductor module according to  claim 2 , wherein
 the projecting portion of the output terminal has a projection length greater than the projecting portions of the first power supply terminal and the second power supply terminal,   the projecting portion of the first power supply terminal has the notch as a first notch, and   the projecting portion of the second power supply terminal has a second notch.   
     
     
         4 . The semiconductor module according to  claim 3 , wherein
 out of the first power supply terminal, the second power supply terminal and the output terminal, only the output terminal has a bent portion in the projecting portion thereof.   
     
     
         5 . The semiconductor module according to  claim 1 , wherein
 the projecting portions of the first power supply terminal, the second power supply terminal and the output terminal have equal widths and equal thicknesses to each other.   
     
     
         6 . The semiconductor module according to  claim 1 , wherein
 each of the projecting portion of the first power supply terminal and the projecting portion of the second power supply terminal has a cross-sectional area greater than the projecting portion of the output terminal, the cross-sectional area being defined in a direction orthogonal to a projecting direction of the projecting portion.   
     
     
         7 . The semiconductor module according to  claim 1 , wherein
 the projecting portion of the second power supply terminal has a cross-sectional area greater than the projecting potion of the first power supply terminal, the cross-sectional area being defined in a direction orthogonal to a projecting direction of the projecting portion of the second power supply terminal.   
     
     
         8 . The semiconductor module according to  claim 1 , further comprising
 a first bus bar connecting to the projecting portion of the first power supply terminal; and   a second bus bar connecting to the projecting portion of the second power supply terminal, wherein   the first bus bar and the second bus bar extend in the arrangement direction, and face each other in respective plate thickness directions.   
     
     
         9 . The semiconductor module according to  claim 8 , wherein
 the second bus bar has a cross-sectional area greater than the first bus bar, the cross-sectional area being defined in a direction orthogonal to an extension direction of the second bus bar.