Optical sensing device having integrated optics and methods of manufacturing the same

Abstract

The present disclosure provides a communication system, a sensing device, and a semiconductor device, among other things. One example of the disclosed sensing device includes a semiconductor die having a photodetector. an optical element optically coupled to and disposed on the photodetector, at least one support structure substantially surrounding the optical element, and a top metal portion disposed on the semiconductor die adjacent to but distanced away from the optical element and the at least one support structure.

What is claimed is: 
     
         1 . A sensing device for detecting light, the sensing device comprising:
 a substrate comprising a top surface;   an optical element provided on the top surface of the substrate, wherein the optical element comprises a top light-receiving surface having a first cross-sectional area and a bottom surface in contact with the top surface of the substrate, wherein the bottom surface of the optical element comprises a second cross-sectional area that is smaller than the first cross-sectional area; and   at least one support structure provided on the top surface of the substrate and adjacent to the optical element, wherein the at least one support structure is coupled with the optical element and physically supports the optical element on the substrate.   
     
     
         2 . The sensing device of  claim 1 , further comprising a gap provided between the bottom surface of the optical element and the at least one support structure. 
     
     
         3 . The sensing device of  claim 2 , wherein the top surface directs light incident thereon toward a photodetector. 
     
     
         4 . The sensing device of  claim 3 , wherein the photodetector is provided on the top surface of the substrate. 
     
     
         5 . The sensing device of  claim 1 , wherein the at least one support structure is integral with the optical element. 
     
     
         6 . The sensing device of  claim 1 , wherein the at least one support structure comprises a plurality of support structures and wherein each of the plurality of support structures are coupled with the top light-receiving surface of the optical element. 
     
     
         7 . The sensing device of  claim 1 , wherein the at least one support structure comprises a single support structure. 
     
     
         8 . The sensing device of  claim 1 , wherein the optical element comprises a truncated cone structure. 
     
     
         9 . The sensing device of  claim 1 , wherein a diameter of the light-receiving surface of the optical element is larger than a diameter of the bottom surface of the optical element. 
     
     
         11 . The sensing device of  claim 1 , wherein the substrate comprises a semiconductor die. 
     
     
         12 . The sensing device of  claim 11 , wherein the semiconductor die comprises a dielectric layer. 
     
     
         13 . The sensing device of  claim 1 , further comprising a metal pad formed on the top surface of the substrate. 
     
     
         14 . The sensing device of  claim 1 , wherein the at least one support structure comprises a void area. 
     
     
         15 . An optical system, comprising:
 an optical sensing device configured to convert a light signal into an electrical signal, the optical sensing device comprising:
 an optical element comprising a top light-receiving surface having a first cross-sectional area and a bottom surface having a second cross-sectional area that is smaller than the first cross-sectional area; and 
 at least one support structure provided adjacent to the optical element, wherein the at least one support structure physically supports the optical element. 
   
     
     
         16 . The optical system of  claim 15 , further comprising:
 a substrate comprising a top surface, wherein the optical element and the at least one support structure are provided on the top surface of the substrate and wherein the bottom surface of the optical element is in proximity with the top surface of the substrate.   
     
     
         17 . The optical system of  claim 15 , further comprising:
 a gap provided between the at least one support structure and the optical element and wherein a size of the gap is larger in proximity with the bottom surface of the optical element as compared to the top light-receiving surface of the optical element.   
     
     
         18 . The optical system of  claim 15 , wherein the at least one support structure comprises a plurality of support structures and wherein each of the plurality of support structures are coupled with the top light-receiving surface of the optical element. 
     
     
         19 . An optical device, comprising:
 a semiconductor die having a top surface, wherein a photodetector is provided in the semiconductor die and wherein the photodetector comprises a light-receiving surface that is substantially co-planar with the top surface of the semiconductor die;   an optical element provided on the top surface of the semiconductor die, wherein the optical element comprises a top light-receiving surface having a first cross-sectional area and a bottom surface in contact with the top surface of the semiconductor die, wherein the bottom surface of the optical element comprises a second cross-sectional area that is smaller than the first cross-sectional area; and   a support structure provided on the top surface of the semiconductor die, wherein the support structure is coupled with the optical element and physically supports the optical element.   
     
     
         20 . The optical device of  claim 19 , wherein the support structure comprises at least one void area and wherein a combination of the support structure and the at least one void area completely surround the optical element.