Electrolytic sn or sn alloy plating solution and method for producing sn or sn alloy plated article

Abstract

The purpose of the present invention is to provide an electrolytic Sn or Sn alloy plating solution capable of lowering Pb concentration. An electrolytic Sn or Sn alloy plating solution for forming a plated article for solder bonding, at least comprising: a sulfur-based compound; an Sn salt; one or more types of acids or water-soluble salts thereof selected from inorganic acid, organic acid or water-soluble salt thereof; and a surfactant, wherein the sulfur-based compound is a thiol compound represented by following general formula (Formula. A), a salt of the thiol compound (Formula A), or a disulfide compound (Formula B).

1 . An electrolytic Sn or Sn alloy plating solution for forming a plated article for solder bonding, at least comprising:
 a sulfur-based compound;   an Sn salt;   one or more types of acids or water-soluble salts thereof selected from inorganic acid, organic acid or water-soluble salt thereof; and   a surfactant,   wherein the sulfur-based compound is a thiol compound represented by following general formula (Formula A), a salt of the thiol compound (Formula A), or a disulfide compound (Formula B).
   HS—R 1    Formula A:
 
   R 2 —S—S—R 2    Formula B:
 
   R 1  is any of   
       
         
           
           
               
               
           
         
         R 2  is any of 
       
       
         
           
           
               
               
           
         
       
     
     
         2 . The electrolytic Sn or Sn alloy plating solution according to  claim 1 , wherein a ratio of concentration of the sulfur-based compound, Sn of the Sn salt, the acids or water-soluble salts thereof, and the surfactant is 1:0.2 to 700:1 to 3000:0.01 to 1000 by weight ratio. 
     
     
         3 . The electrolytic Sn or Sn alloy plating solution according to  claim 1 , wherein the R 1  is any of the general formulas (I) to (III), the R 2  is the general formula (IV) or (V), and the Formula (A) or the Formula (B) is bonded with 2-position or 6-position of the R 1  or the R 2 . 
     
     
         4 . The electrolytic Sn or Sn alloy plating solution according to  claim 1 , wherein the acids or water-soluble salts thereof are one or more types of acids or salts thereof selected from sulfuric acid, hydrochloric acid, nitric acid, phosphoric acid, sulfamic acid, organic sulfonic acid, carboxylic acid, or salt thereof, and also,
 the surfactant includes one or more types of surfactants selected from anionic surfactant, cationic surfactant, and non-ionic surfactant.   
     
     
         5 . The electrolytic Sn or Sn alloy plating solution according to  claim 1 , further comprising one or more types of metal salts other than Sn salt selected from Ag salt, Cu salt, Bi salt, In salt, Au salt, Sb salt, Zn salt, and Ni salt. 
     
     
         6 . A method for producing an Sn or Sn alloy plated article for producing a plated article for solder bonding, comprising:
 a plating solution preparation step for preparing an electrolytic Sn or Sn alloy plating solution; and   a plating step for producing the Sn or Sn alloy plated article using the plating solution,   wherein, in the plating solution preparation step, the electrolytic Sn or Sn alloy plating solution is prepared by at least comprising: a sulfur-based compound; an Sn salt; one or more types of acids or water-soluble salts thereof selected from inorganic acid, organic acid or water-soluble salt thereof; and a surfactant,   wherein the sulfur-based compound is a thiol compound represented by following general formula (Formula A), a salt of the thiol compound (Formula A), or a disulfide compound (Formula B).
   HS—R 1    Formula A:
 
   R 2 —S—S—R 2    Formula B:
 
   R 1  is any of   
       
         
           
           
               
               
           
         
         R 2  is any of 
       
       
         
           
           
               
               
           
         
       
     
     
         7 . The method for producing the Sn or Sn alloy plated article according to  claim 6 , wherein a film of the Sn or Sn alloy plated article is low alpha grade Sn or Sn alloy plating film (less than 0.01 counts/hr/cm 2 ). 
     
     
         8 . The electrolytic Sn or Sn alloy plating solution according to  claim 2 , wherein the R 1  is any of the general formulas (I) to (III), the R 2  is the general formula (IV) or (V), and the Formula (A) or the Formula (B) is bonded with 2-position or 6-position of the R 1  or the R 2 . 
     
     
         9 . The electrolytic Sn or Sn alloy plating solution according to  claim 2 , wherein the acids or water-soluble salts thereof are one or more types of acids or salts thereof selected from sulfuric acid, hydrochloric acid, nitric acid, phosphoric acid, sulfamic acid, organic sulfonic acid, carboxylic acid, or salt thereof, and also,
 the surfactant includes one or more types of surfactants selected from anionic surfactant, cationic surfactant, and non-ionic surfactant.   
     
     
         10 . The electrolytic Sn or Sn alloy plating solution according to  claim 2 , further comprising one or more types of metal salts other than Sn salt selected from Ag salt, Cu salt, Bi salt, In salt, Au salt, Sb salt, Zn salt, and Ni salt.