Heat transfer fluids, methods and systems

Abstract

A heat transfer fluid including 1-trifluoromethyl-1,2,2-trifluorocyclobutane (TFMCB) for high temperature heat transfer applications and environmental and safety requirements, which is non-flammable (and has no flash point below 100° F.), has low toxicity, an ODP of <0.01 and a GWP of 44, is dielectric and electrically stable.

1 . A method for cooling a heat generating component that is operating in an electronic device, said method comprising:
 (a) operating said electronic device;   (b) providing a thermal management fluid comprising 1-trifluoromethyl-1,2,2-trifluorocyclobutane (TFMCB) in thermal contact with the heat generating component of said operating electronic device; and   (c) transferring heat from said operating, heat-generating component to said thermal management fluid by thermal contact with said TFMCB.   
     
     
         2 . The method of  claim 1 , wherein the thermal management fluid is in direct contact with the heat generating component and wherein said step of transferring heat comprises vaporizing said TFMCB or adding sensible heat to said TFMCB, or a combination of these. 
     
     
         3 . The method of  claim 1 , wherein the thermal management fluid consists essentially of TFMCB. 
     
     
         4 . The method of  claim 1 , wherein the thermal management fluid comprises at least about 50% by weight of TFMCB. 
     
     
         5 . The method of  claim 1 , wherein said TFMCB is at a temperature greater than about 55° C. during said transferring step (c). 
     
     
         6 . The method of  claim 1 , wherein the thermal management fluid has a dielectric constant of less than 30 and an electrical conductivity of less than 15 nS/cm. 
     
     
         7 . The method of  claim 1 , wherein the heat generating component is selected from semiconductor integrated circuits (ICs), electrochemical cells, power transistors, resistors, and electroluminescent elements, such as microprocessors, wafers used to manufacture semiconductor devices, power control semiconductors, electrical distribution switch gear, power transformers, circuit boards, multi-chip modules, packaged or unpackaged semiconductor devices, semiconductor integrated circuits, fuel cells, lasers (conventional or laser diodes), light emitting diodes (LEDs), and electrochemical cells, e.g. used for high power applications such as, for example, hybrid or electric vehicles. 
     
     
         8 . The method of  claim 1 , wherein said electronic device is selected from personal computers, microprocessors, servers, cell phones, tablets, digital home appliances (e.g. televisions, media players, games consoles etc.), personal digital assistants, Datacenters, batteries both stationary and in vehicles, hybrid or electric vehicles, wind turbine, train engine, or generator. 
     
     
         9 . The method of  claim 8 , wherein the electronic device is a hybrid or electric vehicle. 
     
     
         10 . A heat transfer composition comprising TFMCB. 
     
     
         11 . A process for converting thermal energy to mechanical energy in a Rankine cycle, the method comprising the steps of i) vaporizing the heat transfer composition of  claim 1  as working fluid with a heat source and expanding the resulting vapor, then ii) cooling the working fluid with a heat sink to condense the vapor, wherein the working fluid comprises at least about 50% by weight of TFMCB. 
     
     
         12 . A high temperature heat pump comprising the heat transfer composition of  claim 1  as a heat transfer fluid, wherein the heat transfer fluid comprises TFMCB, with the proviso that the heat transfer fluid is not an azeotrope which is an admixture of about 21 to 27 weight percent TFMCB, 64 to 72 weight percent trans-1,2-dichloroethylene and about 5 to 11 weight percent methanol and the heat transfer fluid is not an azeotropic composition which is an admixture of about 82 to 92 weight percent TFMCB and about 8 to 18 weight percent methanol or an admixture of about 82 to 92 weight percent TFMCB and about 8 to 18 weight percent ethanol. 
     
     
         13 . A secondary loop system comprising the heat transfer composition of  claim 1  as a refrigerant comprising TFMCB. 
     
     
         14 . The heat transfer composition of  claim 10 , further comprising a lubricant. 
     
     
         15 . The heat transfer composition of  claim 14 , wherein the lubricant comprises at least one of a polyol ester (POE), a polyvinyl ether (PVE), and a polyalkylene gloycol (PAG). 
     
     
         16 . A method of replacing an existing refrigerant in a heat transfer system, said method comprising the steps of:
 (a) removing at least a portion of said existing refrigerant from said system and subsequently;   (b) introducing into said system the heat transfer composition of  claim 1  as a refrigerant comprising TFMCB.   
     
     
         17 . A method for removing heat from an article, device or fluid comprising:
 (a) providing a high temperature heat source which is generating heat at a temperature above about 70° C.; and   (b) removing heat from said high temperature heat source by thermal contact with TFMCB liquid, wherein the temperature of said TFMCB liquid is above about 55° C.   
     
     
         18 . The method of  claim 17 , wherein said heat transfer fluid comprises at least about 50% by weight of TFMCB. 
     
     
         19 . The method of  claim 17 , wherein said heat transfer fluid is a non-flammable heat transfer fluid consisting essentially of TFMCB and having a dielectric constant of less than 30 and an electrical conductivity of less than 15 nS/cm. 
     
     
         20 . The method of  claim 17  wherein said step of removing heat comprises vaporizing said TFMCB or adding sensible heat to said TFMCB, or a combination of these.