Photosensitive siloxane composition

Abstract

[Object] To provide a composition capable of forming a cured film having low permittivity and excellence in chemical resistance, in heat resistance and in resolution; and further to provide a production process employing the composition. [Means] The present invention provides a composition comprising: an alkali-soluble resin, namely, a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit; a polysiloxane; a diazonaphthoquinone derivative a compound generating acid or base when exposed to heat or light; and a solvent.

1 .- 12 . (canceled) 
     
     
         13 . A composition comprising:
 an alkali-soluble resin which is a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit,   a polysiloxane,   a diazonaphthoquinone derivative,   a compound generating acid or base when exposed to heat, and   a solvent and
 wherein said compound generating acid or base when exposed to heat or light is a heat acid- or base-generator whose absorbance ratio at 365 nm/436 nm or at 365 nm/405 nm is 5/1 or more. 
   
     
     
         14 . The composition according to  claim 13 , wherein said carboxyl-containing polymerization unit is derived from an unsaturated carboxylic acid, an unsaturated carboxylic anhydride, or a mixture thereof. 
     
     
         15 . The composition according to  claim 13 , wherein said alkoxysilyl-containing polymerization unit is derived from a monomer represented by the following formula (I):
   X—(CH 2 ) a —Si(OR) b (CH 3 ) 3-b   (I)
   in which   X is a vinyl, styryl or (meth)acryloyloxy group;   R is methyl or ethyl group;   a is an integer of 0 to 3; and   b is an integer of 1 to 3.   
     
     
         16 . The composition according to  claim 13 , wherein said polysiloxane is derived from a monomer represented by the following formula (II):
   R 1 [Si(OR 2 ) 3 ] p   (II)
   in which   p is an integer of 1 to 3;   R 1  is hydrogen or a p-valent straight, branched or cyclic hydrocarbon group which has 20 or less carbon atoms and which may contain oxygen or nitrogen, provided that any hydrogen of the hydrocarbon group may be replaced with fluorine; and   each R 2  is independently hydrogen or an alkyl group having 1 to 10 carbon atoms.   
     
     
         17 . (canceled) 
     
     
         18 . The composition according to  claim 13 , wherein said alkali-soluble resin has a weight average molecular weight of 3000 to 50000. 
     
     
         19 . The composition according to  claim 13 , wherein said polysiloxane has a weight average molecular weight of 800 to 15000. 
     
     
         20 . The composition according to  claim 13 , wherein the mixing ratio of said alkali-soluble resin and said polysiloxane is 5:95 to 95:5 by weight. 
     
     
         21 . A method for forming a cured film, comprising:
 coating a substrate with the composition according to  claim 13 , to form a coating film;   exposing the coating film to light;   developing the exposed film with an alkali developer, to form a pattern; and   heating the obtained pattern.   
     
     
         22 . The method for forming a cured film, according to  claim 21 ;
 which further comprises the step of exposing the whole film surface to light before the step of heating the obtained pattern.   
     
     
         23 . A cured film produced by a method comprising:
 coating a substrate with the composition according to  claim 13 , to form a coating film;   exposing the coating film to light;   developing the exposed film with an alkali developer, to form a pattern; and   heating the obtained pattern.   
     
     
         24 . A device comprising the cured film according to  claim 23 .