Printed circuit board

Abstract

A printed circuit board including: a circuit layer including a plurality of circuit layers; a first structure including a plurality of first unit vias, each first unit via being vertically disposed and formed between successive circuit layers that are vertically adjacent to each other; and a second structure including a plurality of second unit vias, each second unit via being vertically disposed and horizontally spaced apart from a respective first unit via, wherein a horizontal spaced distance between each respective first unit via and the second unit via is a set value or less.

What is claimed is: 
     
         1 . A printed circuit board comprising:
 a circuit layer comprising a plurality of circuit layers;   a first structure comprising a plurality of first unit vias, each first unit via being vertically disposed and formed between successive circuit layers that are vertically adjacent to each other; and   a second structure comprising a plurality of second unit vias, each second unit via being vertically disposed and horizontally spaced apart from a respective first unit via,   wherein a horizontal spaced distance between each respective first unit via and second unit via is a set value or less.   
     
     
         2 . The printed circuit board of  claim 1 , wherein the first structure comprises a first pad connected to the circuit layers and vertically connected to each of the first unit vias. 
     
     
         3 . The printed circuit board of  claim 2 , wherein the second structure comprises a second pad vertically connected to each of the second unit vias. 
     
     
         4 . The printed circuit board of  claim 3 , wherein the first pad and the second pad are electrically insulated from each other. 
     
     
         5 . The printed circuit board of  claim 3 , wherein at least a portion of the second pad is in contact with the first pad. 
     
     
         6 . The printed circuit board of  claim 1 , wherein the set value is 1 mm. 
     
     
         7 . The printed circuit board of  claim 1 , wherein each second unit via is the only via disposed within the horizontal spaced distance from the respective first unit via. 
     
     
         8 . The printed circuit board of  claim 1 , further comprising a plurality of the second structures. 
     
     
         9 . A printed circuit board comprising:
 a plurality of circuit layers; and   a via structure electrically connected to the circuit layers,   wherein the via structure comprises:   a plurality of unit vias, each of which is vertically disposed between successive circuit layers that are vertically adjacent to each other; and   a via conductor formed around any one of the unit vias,   wherein a horizontal spaced distance between one unit via and the via conductor is a set value or less.   
     
     
         10 . The printed circuit board of  claim 9 , wherein the via structure comprises a first pad connected to the circuit layers and vertically connected to each of the unit vias. 
     
     
         11 . The printed circuit board of  claim 10 , wherein the via conductor is in contact with the first pad. 
     
     
         12 . The printed circuit board of  claim 10 , wherein the via conductor is vertically connected to a second pad, and
 the second pad is insulated from the first pad.   
     
     
         13 . The printed circuit board of  claim 9 , wherein the set value is 1 mm. 
     
     
         14 . The printed circuit board of  claim 9 , wherein the via conductor is the only via disposed within the horizontal spaced distance from one unit via. 
     
     
         15 . The printed circuit board of  claim 9 , further comprising a plurality of the via conductors.