Dielectric heat path devices, and systems and methods using the same

Abstract

Devices, systems, and methods for dissipating heat generated from an electrical current carrying device are provided herein. The disclosed concept provides a dielectric heat path device that assists in heat dissipation of an electrical current carrying device by transferring heat from one end of the device to another. The disclosed concept also provides systems that communicate heat generated by an electrical device to a thermally grounded secondary device through a dielectric heat path device to dissipate heat.

What is claimed is: 
     
         1 . A method for assembling a heat path device, the method comprising:
 providing a first structure formed of a first thermally conductive material, the first structure including a first end and a second end;   providing a second structure formed of a second thermally conductive material, the second structure including a first end and a second end;   providing a third structure formed of a dielectric material, the third structure including a first end and a second end;   attaching the first end of the third structure to the first end of the first structure, wherein attaching comprises mechanically coupling and thermally coupling; and   attaching the second end of the third structure to the first end of the second structure, wherein attaching comprises mechanically coupling and thermally coupling.   
     
     
         2 . The method of  claim 1 , further comprising:
 placing a cover about at least a portion of the third structure such that the cover surrounds at least a portion of the heat path device wherein the cover is structured to provide at least one of spacing, attachment, and encapsulation.   
     
     
         3 . The method of  claim 2 , further comprising placing the cover over at least a portion of the first structure and over at least a portion of the second structure to provide thermal insulation. 
     
     
         4 . The method of  claim 1 , wherein the first structure and the second structure are each positioned on a first plane and the third structure is positioned on a second plane. 
     
     
         5 . The method of  claim 1 , wherein heat conducted by the first structure is communicated to the second structure via the third structure, and wherein electrical current conducted by the first structure is attenuated by the third structure. 
     
     
         6 . The method of  claim 1 , further comprising:
 providing a fourth structure formed of a second dielectric material, the fourth structure including a first end and a second end;   attaching the first end of the fourth structure to a first end of the first structure, wherein attaching comprises at least mechanically coupling and thermally coupling; and.   attaching the second end of the fourth structure to a first end of the second structure, wherein attaching comprises at least mechanically coupling and thermally coupling;   wherein a gap is defined between the third structure and the fourth structure.   
     
     
         7 . The method of  claim 6 , wherein the first structure and the second structure are each positioned on a first plane, the third structure is positioned on a second plane, and the fourth structure is positioned on a third plane. 
     
     
         8 . The method of  claim 6 , wherein attaching the third structure to the first structure comprises attaching the first end of the third structure to overlap the first end of the first structure;
 wherein attaching the third structure to the second structure comprises attaching the second end of the third structure to overlap the first end of the second structure;   wherein attaching the fourth structure to the first structure comprises attaching the first end of the fourth structure to overlap the first end of the first structure; and,   wherein attaching the fourth structure to the second structure comprises attaching the second end of the fourth structure to overlap the first end of the second structure.   
     
     
         9 . The method of  claim 6 , further comprising:
 providing a cover over at least a portion of each of the third structure and the fourth structure to provide thermal insulation.   
     
     
         10 . The method of  claim 9 , further comprising placing the cover over at least a portion of the first structure and over at least a portion of the second structure to provide thermal insulation. 
     
     
         11 . The method of  claim 6 , wherein heat conducted by the first structure is communicated to the second structure via the third and the fourth structures, and wherein electrical current conducted by the first structure is attenuated by the third and the fourth structures. 
     
     
         12 . The method of  claim 1 , further comprising:
 attaching the heat path device to form a system by at least mechanically coupling and thermally coupling the second end of the first structure to an electrical device, the electrical device being spaced from the third structure; and   at least mechanically coupling and thermally coupling the second end of the second structure to a secondary device, the secondary device being spaced from the third structure.