US2020172440A1PendingUtilityA1

Multi-component composition for producing an aqueous coating mass

Assignee: HERAEUS DEUTSCHLAND GMBH & CO KGPriority: Jul 31, 2017Filed: Apr 18, 2018Published: Jun 4, 2020
Est. expiryJul 31, 2037(~11 yrs left)· nominal 20-yr term from priority
Inventors:Markus Scheibel
C04B 24/126B28B 1/24C04B 24/06H01L 23/291C04B 28/34C04B 2111/00844H01L 21/56H05K 5/065B28B 11/24C04B 14/046H10W 74/43H10W 74/01H10W 74/10H10W 74/40C04B 12/02C04B 40/065C04B 14/303C04B 2111/00525C04B 14/30C04B 2111/00086C04B 14/304C04B 22/062C04B 22/064C04B 14/06C04B 2111/00482C04B 14/309C04B 14/062C04B 14/308
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Claims

Abstract

A composition consisting essentially of (a) 1 to 30 wt. % of a hydrogen phosphate selected from the group consisting of mono and dihydrogen phosphates of sodium, potassium, ammonium, magnesium, calcium, aluminium, zinc, iron, cobalt, and copper; (b) 1 to 40 wt. % of a compound selected from the group consisting of oxides, hydroxides, and oxide hydrates of magnesium, calcium, iron, zinc, and copper; (c) 40 to 95 wt. % of a particulate filler selected from the group consisting of glass; mono-, oligo- and poly-phosphates of magnesium, calcium, barium and aluminium; calcium sulfate; barium sulfate; simple and complex silicates; simple and complex aluminates; simple and complex titanates; simple and complex zirconates; zirconium dioxide; titanium dioxide; aluminium oxide; silicon dioxide; silicon carbide; aluminium nitride; boron nitride and silicon nitride; and (d) 0 to 25 wt. % of a constituent that differs from constituents (a) to (c).

Claims

exact text as granted — not AI-modified
1 . Composition consisting essentially of the following constituents:
 (a) 1 to 30 wt. % of at least one hydrogen phosphate selected from the group consisting of mono and dihydrogen phosphates of sodium, potassium, ammonium, magnesium, calcium, aluminium, zinc, iron, cobalt, and copper; if applicable, in combination with 1 to 90 wt-% aqueous phosphoric acid;   (b) 1 to 40 wt. % of at least one compound selected from the group consisting of oxides, hydroxides, and oxide hydrates of magnesium, calcium, iron, zinc, and copper;   (c) 40 to 95 wt. % of at least one particulate filling agent selected from the group consisting of glass; mono-, oligo- and poly-phosphates of magnesium, calcium, barium and aluminium; calcium sulfate; barium sulfate; simple and complex silicates comprising sodium, potassium, calcium, aluminium, magnesium, iron and/or zirconium; simple and complex aluminates comprising sodium, potassium, calcium, magnesium and/or zirconium; simple and complex titanates comprising sodium, potassium, calcium, aluminium, magnesium, barium and/or zirconium; simple and com-plex zirconates comprising sodium, potassium, calcium, aluminium and/or magnesium; zirconi-um dioxide; titanium dioxide; aluminium oxide; silicon dioxide; silicon carbide; aluminium nitride; boron nitride and silicon nitride; and   (d) 0 to 25 wt. % of at least one constituent that differs from constituents (a) to (c);   whereby constituent (a) can comprise up to 10 wt. % free water, relative to the total of constituent (a);   whereby constituent (d) can comprise up to 10 wt. % free water, relative to the total of constituent (d);   whereby the composition is present as a two- or multicomponent system, and whereby constituents (a) and (b) are present essentially separate from each other or, if constituent (a) comprises phosphoric acid, are present separate from each other.   
     
     
         2 . Composition according to  claim 1 , whereby constituent (a) is at least one hydrogen phosphate selected from the group consisting of mono- and dihydrogen phosphates of magnesium, potassium, aluminium, and ammonium. 
     
     
         3 . Composition according to  claim 1 , whereby constituent (b) is at least one compound selected from the group consisting of magnesium oxide, iron oxide, and calcium oxide. 
     
     
         4 . Composition according to  claim 1 , whereby constituent (c) is at least one particulate filling agent selected from the group consisting of zirconium silicate, silicic acid, and quartz. 
     
     
         5 . Composition according to  claim 1 , whereby the components of the two- or multicomponent system are present in a provided amount that corresponds to the quantitative ratios of constituents (a) to (d). 
     
     
         6 . Aqueous hydraulically curable preparation that can be produced by mixing the components of a composition according to  claim 1  with each other and with water. 
     
     
         7 . Aqueous hydraulically curable preparation according to  claim 6 , whereby the mixing ratio is 100 parts by weight of the composition and 5 to 30 parts by weight of water. 
     
     
         8 . Method for the production of an aqueous hydraulically curable preparation according to  claim 6  by mixing the components of a composition with each other and with water, the composition consisting essentially of the following constituents:
 (a) 1 to 30 wt. % of at least one hydrogen phosphate selected from the group consisting of mono and dihydrogen phosphates of sodium, potassium, ammonium, magnesium, calcium, aluminium, zinc, iron, cobalt, and copper; if applicable, in combination with 1 to 90 wt-% aqueous phosphoric acid; 
 (b) 1 to 40 wt. % of at least one compound selected from the group consisting of oxides, hydroxides, and oxide hydrates of magnesium, calcium, iron, zinc, and copper; 
 (c) 40 to 95 wt. % of at least one particulate filling agent selected from the group consisting of glass; mono-, oligo- and poly-phosphates of magnesium, calcium, barium and aluminium; calcium sulfate; barium sulfate; simple and complex silicates comprising sodium, potassium, calcium, aluminium, magnesium, iron and/or zirconium; simple and complex aluminates comprising sodium, potassium, calcium, magnesium and/or zirconium; simple and complex titanates comprising sodium, potassium, calcium, aluminium, magnesium, barium and/or zirconium; simple and com-plex zirconates comprising sodium, potassium, calcium, aluminium and/or magnesium; zirconi-um dioxide; titanium dioxide; aluminium oxide; silicon dioxide; silicon carbide; aluminium nitride; boron nitride and silicon nitride; and 
 (d) 0 to 25 wt. % of at least one constituent that differs from constituents (a) to (c); 
 whereby constituent (a) can comprise up to 10 wt. % free water, relative to the total of constituent (a); 
 whereby constituent (d) can comprise up to 10 wt. % free water, relative to the total of constituent (d); 
 whereby the composition is present as a two- or multicomponent system, and whereby constituents (a) and (b) are present essentially separate from each other or, if constituent (a) comprises phosphoric acid, are present separate from each other. 
 
     
     
         9 . Method according to  claim 8 , whereby, initially all components of the two- or multicomponent system are mixed without adding water and subsequently are mixed with water to produce the aqueous hydraulically curable preparation. 
     
     
         10 . Method according to  claim 8 , whereby at least one of the components of the two- or multicomponent system is first mixed with water to produce at least one aqueous intermediate, before this is mixed further with the further component(s) and/or the further aqueous intermediate(s). 
     
     
         11 . Method for the production of a hydraulically cured enclosure of an electronic component, comprising the steps of
 (1) providing an electronic component to be enclosed;   (2) providing an aqueous enclosing mass in the form of an aqueous hydraulically curable preparation according to  claim 6 ;   (3) enclosing the electronic component provided in step (1) in the aqueous enclosing mass pro-vided in step (2); and   (4) hydraulic curing of the aqueous enclosing mass enclosing the electronic component after completion of step (3).   
     
     
         12 . Method according to  claim 11 , whereby the electronic component to be enclosed is a passive electronic component or a semiconductor module. 
     
     
         13 . Method according to  claim 11  implemented on an industrial scale. 
     
     
         14 . Method according to  claim 13 , whereby step (2) comprises the following sub-steps:
 (2a) Providing a two-component composition from a first component A comprising constituent (a) and a second component B comprising constituent (b);   (2b) separately mixing each of the components A and B with water to produce two separate aqueous intermediates A′ and B′; and   (2c) mixing aqueous intermediates A′ and B′ by means of a static mixer to produce an aqueous enclosing mass in the form of the aqueous hydraulically curable preparation.
 wherein constituent (a) is at least one hydrogen phosphate selected from the group consisting of mono and dihydrogen phosphates of sodium, potassium, ammonium, magnesium, calcium, aluminium, zinc, iron, cobalt, and copper; if applicable, in combination with 1 to 90 wt-% aqueous phosphoric acid, and 
 wherein constituent (b) is at least one compound selected from the group consisting of oxides, hydroxides, and oxide hydrates of magnesium, calcium, iron, zinc, and copper. 
   
     
     
         15 . Method according to  claim 14 , whereby the two aqueous intermediates A′ and B′ have volumes that differ by no more than 20% from each other and/or each have a viscosity in the range of 0.5 to 50 Pa·s (rotation viscosimetry, plate-plate measuring principle, plate diameter 25 mm, measuring gap 1 mm, sample temperature 20° C., shear rate 36 min-1, viscosity values determined after a measuring time of 2 minutes). 
     
     
         16 . Method for the production of a hydraulically cured enclosure of an electronic component, comprising the steps of
 (1) providing an electronic component to be enclosed;   (2) providing an aqueous enclosing mass in the form of an aqueous hydraulically curable preparation produced according to a method according to  claim 8 ;   (3) enclosing the electronic component provided in step (1) in the aqueous enclosing mass pro-vided in step (2); and   (4) hydraulic curing of the aqueous enclosing mass enclosing the electronic component after completion of step (3).

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