Led package

Abstract

An LED package is disclosed. The LED package includes: a metal reflector having a cavity formed therein; an LED chip arranged on the bottom of the cavity of the reflector; a wavelength converting panel including a lower glass plate, an upper glass plate, and a wavelength converting sheet interposed between the lower glass plate and the upper glass plate and arranged on the cavity of the reflector; and a sealing member disposed on the side surface of the lower glass plate and the side surface of the upper glass plate and connecting the wavelength converting panel to the reflector.

What is claimed is: 
     
         1 . An LED package comprising:
 a reflector having a cavity formed therein and comprising an upper wall surrounding an upper space of the cavity and a lower wall surrounding a lower space of the cavity;   an LED chip arranged in the lower space of the cavity of the reflector;   a wavelength converting panel covering the upper end of the LED chip, arranged in the upper space of the reflector, and comprising a lower glass plate, an upper glass plate, and a wavelength converting sheet interposed between the lower glass plate and the upper glass plate; and   a sealing member disposed between the side surface of the wavelength converting panel and the upper space of the reflector to connect the wavelength converting panel to the reflector,   wherein the lower space of the cavity of the reflector is tapered downwardly and the upper space of the cavity of the reflector is vertically connected to the lower space.   
     
     
         2 . The LED package according to  claim 1 , wherein the LED chip is a flip-chip type LED chip having a pair of electrode pads with opposite polarities at the lower side thereof and the pair of electrode pads are bonded to electrodes disposed on a PCB. 
     
     
         3 . The LED package according to  claim 1 , wherein the LED package comprises a stepped portion depressed into the cavity in the upper space of the reflector and protruding outward from the cavity in the lower space of the reflector. 
     
     
         4 . The LED package according to  claim 2 , wherein the lower glass of the wavelength converting panel is in contact with the stepped portion and is fixed by the sealing member. 
     
     
         5 . The LED package according to  claim 1 , wherein a mixture of silica as an amorphous resin and a resin is filled in the lower space of the reflector. 
     
     
         6 . The LED package according to  claim 1 , wherein the upper wall defining the upper space of the reflector and the lower wall defining the lower space of the reflector are made of a metal material comprising at least one metal of Ni, Cr, Ag, Al, Au, Zn, Sn, and Pt. 
     
     
         7 . The LED package according to  claim 1 , wherein the sealing member is formed by filling a thermally conductive metal in the form of a liquid, powder or gel and solidifying the thermally conductive metal. 
     
     
         8 . The LED package according to  claim 1 , wherein the upper glass plate has the same area as the lower glass plate and the wavelength converting sheet has an area smaller than the area of the lower glass plate and the area of the upper glass plate such that a recess is formed along the edge of the wavelength converting panel. 
     
     
         9 . The LED package according to  claim 1 , wherein the upper glass plate of the wavelength converting panel is located at a position lower than the upper wall of the reflector. 
     
     
         10 . The LED package according to  claim 1 , wherein the wavelength converting material is a quantum dot (QD) phosphor. 
     
     
         11 . The LED package according to  claim 1 , wherein a solid component comprising a glass molding material, an epoxy resin or a silicone resin is disposed between the upper surface of the lower glass plate and the lower surface of the wavelength converting sheet and between the lower surface of the upper glass plate and the wavelength converting sheet. 
     
     
         12 . An LED package comprising:
 a reflector having a cavity formed therein and comprising an upper wall surrounding an upper space of the cavity and a lower wall surrounding a lower space of the cavity;   an LED chip arranged in the lower space of the cavity of the reflector;   a wavelength converting panel covering the upper end of the LED chip, arranged in the upper space of the reflector, and comprising a lower glass plate, an upper glass plate, and a wavelength converting sheet interposed between the lower glass plate and the upper glass plate; and   a sealing member disposed between the side surface of the wavelength converting panel and the upper space of the reflector to connect the wavelength converting panel to the reflector,   wherein the upper glass plate of the wavelength converting panel is located at a position lower than the upper wall of the reflector and the lower glass plate is arranged on a stepped portion of the lower wall of the reflector.   
     
     
         13 . The LED package according to  claim 12 , wherein the upper glass plate has the same area as the lower glass plate and the wavelength converting sheet has an area smaller than the area of the lower glass plate and the area of the upper glass plate such that a recess is formed along the edge of the wavelength converting panel. 
     
     
         14 . The LED package according to  claim 12 , wherein the sealing member is formed by filling a thermally conductive metal in the form of a liquid, powder or gel and solidifying the thermally conductive metal. 
     
     
         15 . The LED package according to  claim 12 , wherein the upper wall defining the upper space of the reflector and the lower wall defining the lower space of the reflector are made of a metal material comprising at least one metal of Ni, Cr, Ag, Al, Au, Zn, Sn, and Pt. 
     
     
         16 . The LED package according to  claim 12 , wherein the LED chip is a flip-chip type LED chip having a pair of electrode pads with opposite polarities at the lower side thereof and the pair of electrode pads are bonded to electrodes disposed on a PCB. 
     
     
         17 . The LED package according to  claim 12 , wherein the wavelength converting material is a quantum dot (QD) phosphor. 
     
     
         18 . The LED package according to  claim 12 , wherein a solid component comprising a glass molding material, an epoxy resin or a silicone resin is disposed between the upper surface of the lower glass plate and the lower surface of the wavelength converting sheet and between the lower surface of the upper glass plate and the wavelength converting sheet. 
     
     
         19 . An LED package comprising:
 a reflector having a cavity formed therein and comprising an upper wall surrounding an upper space of the cavity and a lower wall surrounding a lower space of the cavity;   an LED chip arranged in the lower space of the cavity of the reflector;   a wavelength converting panel covering the upper end of the LED chip, arranged in the upper space of the reflector, and comprising a lower glass plate, an upper glass plate, and a wavelength converting sheet interposed between the lower glass plate and the upper glass plate; and   a sealing member connecting the wavelength converting panel to the reflector, wherein the sealing member extends from the side surface of the wavelength converting panel to the lower surface of the lower glass plate of the wavelength converting panel.   
     
     
         20 . The LED package according to  claim 19 , wherein the LED chip is a flip-chip type LED chip having a pair of electrode pads with opposite polarities at the lower side thereof and the pair of electrode pads are bonded to electrodes disposed on a PCB.