US2020161255A1PendingUtilityA1

Devices related to shielded radio-frequency modules having reduced area

Assignee: SKYWORKS SOLUTIONS INCPriority: Sep 30, 2014Filed: Oct 10, 2019Published: May 21, 2020
Est. expirySep 30, 2034(~8.2 yrs left)· nominal 20-yr term from priority
H01L 2224/04042H01L 2224/05013H01L 2224/48227H01L 23/66H01L 24/85H01L 2223/6655H01L 2924/00014H01L 2224/45016H01L 2924/1421H01L 24/00H01L 2924/19107H01L 2924/3025H01L 2224/48105H01L 24/45H01L 24/05H01L 24/48H01L 2224/06181H01L 2924/19105H01L 23/552H01L 24/06H10W 90/754H10W 72/07554H10W 72/944H10W 72/932H10W 72/923H10W 72/533H10W 72/59H10W 44/234H10W 72/075H10W 72/00H10W 44/20H10W 42/20H10W 72/90H10W 72/50
60
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Claims

Abstract

Shielded radio-frequency (RF) module having reduced area. In some embodiments, an RF module can include a packaging substrate configured to receive a plurality of components, and a plurality of shielding wirebonds implemented on the packaging substrate and configured to provide RF shielding functionality for one or more regions on the packaging substrate. The packaging substrate can include a first area associated with implementation of each shielding wirebond. The RF module can further include one or more devices mounted on the packaging substrate. The packaging substrate can further include a second area associated with mounting of each of the one or more devices. Each device can be mounted with respect to a corresponding shielding wirebond such that the second area associated with the device overlaps at least partially with the first area associated with the corresponding shielding wirebond.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A wireless device comprising:
 a transceiver;   a radio-frequency (RF) module in communication with the transceiver and configured to process an RF signal, the RF module including a packaging substrate configured to receive a plurality of components, the RF module further including a plurality of shielding wirebonds implemented on the packaging substrate and configured to provide RF shielding functionality for one or more regions on the packaging substrate, the packaging substrate including a first area associated with implementation of each shielding wirebond, the RF module further including one or more devices mounted on the packaging substrate, the packaging substrate further including a second area associated with mounting of each of the one or more devices, each device mounted with respect to a corresponding shielding wirebond such that the second area associated with the device overlaps at least partially with the first area associated with the corresponding shielding wirebond; and   an antenna in communication with the RF module and configured to facilitate transmission or reception of the RF signal.

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