Soft hand copolyamide composition

Abstract

Composition comprising, on a weight basis, the total being equal to 100%: from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (T m ) from about 90 to about 150° C., in particular from about 100° C. to about 125° C., and having a flexural modulus of less than 100 MPa, as determined according to standard ISO 178 (2010); from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof, for the manufacture of a heat-sensitive adhesive, in particular a veil, a film, granules, a filament, a grate, a powder or a suspension.

1 . A method of using a heat-sensitive adhesive, comprising the steps of:
 a) forming a heat-sensitive adhesive composition of a HMA (hot-melt adhesive) type, consisting of a composition comprising on a weight basis, the total being equal to 100%:
 from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (T m ) from about 100° C. to about 125° C., and having a flexural modulus of less than 100 MPa, as determined according to standard ISO 178 (2010); the said amide unit being 6/12, with a weight proportion of the long chain aliphatic repeat unit C12 of the amide unit being from 50% to 95%, the polyether units being derived from polytetramethylene glycol (PTMG), the weight proportion of polyether units in the copolyamide being greater than 40%, 
 from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof wherein the form of said heat-sensitive adhesive is selected from the group consisting of a veil, a film, granules, a filament, and a grate; 
   b) melting said heat-sensitive composition by heating;   c) applying said adhesive to at least one of a first part or a second part of a lamination, wherein said first part comprises a material comprising at least one of: cotton, spandex, polyamide, and polyester and said second part comprises a material comprising at least one of: cotton, spandex, polyamide, and polyester;   d) allowing said heat-sensitive adhesive composition to cool thereby forming the lamination.   
     
     
         2 . The method of  claim 1 , wherein the weight proportion of the long chain aliphatic repeat unit C12 of the amide unit is 70% to 80%. 
     
     
         3 . The method of  claim 1 , wherein the adhesive is in the form of a veil. 
     
     
         4 . The method of  claim 1 , wherein said adhesive has a thickness of from 5 to 30 micrometers for a veil, 20 to 100 micrometers for a film, and 10 to 50 micrometers for a grate, and said adhesive has an adherence of greater than 3 N/cm to said first part or said second part, as determined by the T peel test at 100 mm/min. 
     
     
         5 . The method of  claim 1 , wherein said adhesive has an adherence of about 14 N/cm, as determined by the T peel test at 100 mm/min, to a first part comprising a material comprising a cotton/polyester mixture at a ratio of 90/10, for a thickness of about 30 μm with a lamination temperature of 120° C. 
     
     
         6 . The method of  claim 1 , wherein said adhesive has an adherence of about 12 N/cm, as determined by the T peel test at 100 mm/min, to a first part comprising a material comprising spandex, for a thickness of about 30 μm with a lamination temperature of 120° C. 
     
     
         7 . The method of  claim 1 , wherein said adhesive has an adherence from about 11 to about 22 N/cm, as determined by the T peel test at 100 mm/min, to a first part comprising a material comprising a cotton/polyester mixture at a ratio of 90/10, for a thickness of about 60 μm with a lamination temperature of from 140° C. to 180° C. 
     
     
         8 . The method of  claim 1 , wherein said adhesive has an adherence of greater than about 5 N/cm, as determined by the T peel test at 100 mm/min, to a first part comprising a material comprising at least one of cotton or spandex, for a thickness of about 55 to about 90 micrometers with a lamination temperature of from 140 to 160° C. 
     
     
         9 . The method according to  claim 1 , having a loss of adherence after at least two washes at 40° C. from about 2% to about 18%. 
     
     
         10 . The method of  claim 1 , wherein the weight proportion of polyether units in the copolyamide is between about 40% and about 80%. 
     
     
         11 . The method of  claim 1 , wherein the weight proportion of polyether units in the copolyamide is about 50%. 
     
     
         12 . The method of  claim 1 , wherein the method is used to manufacture sports articles. 
     
     
         13 . A heat-sensitive adhesive comprising, on a weight basis, the total being equal to 100%:
 from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (T m ) from about 90 to about 150° C., and having a flexural modulus of less than 100 MPa, as determined according to standard ISO 178 (2010);   the said amide unit having the following structure:
   (A) x /(B) y /(C) 
   resulting from the condensation of unit (A), unit (B), and unit (C), in which:
 x=0 or 1, y=0 or 1 and x+y=1 or 2, 
 A and B corresponding to an aliphatic repeating unit chosen from a unit obtained from at least one amino acid and a unit obtained from at least one lactam, or a unit X.Y obtained from the polycondensation of:
 at least one diamine chosen from a linear or branched aliphatic diamine, a cycloaliphatic diamine, and an aromatic diamine or a mixture thereof, and 
 at least one dicarboxylic acid chosen from an aliphatic diacid, a cycloaliphatic diacid, and an aromatic diacid, 
 the diamine and the diacid comprising from 4 to 36 carbon atoms; 
 
   (C) represents a long-chain aliphatic repeating unit, obtained from an amino acid, a lactam, or a unit X.Y, of C10 or more, or a mixture thereof, and   (A) and (B) being different from each other when they are both present, and (A) and (B) being different from (C) when they are present alone or together,   the weight proportion of polyether units in the copolyamide being greater than 40%, from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof, wherein the form of the heat-sensitive adhesive is selected from the group consisting of a veil, a film, granules, a filament, a grate, a powder, and a suspension.   
     
     
         14 . The heat-sensitive adhesive of  claim 13 , wherein the form of the heat-sensitive adhesive is selected from the group consisting of a veil, a film, granules, a filament, and a grate. 
     
     
         15 . The heat-sensitive adhesive of  claim 13 , wherein the form of the heat-sensitive adhesive is a veil.