Semiconductor device package and method of manufacturing the same

Abstract

A semiconductor device package includes a carrier; a sensor element disposed on or within the carrier; a cover disposed above the carrier and comprising a top surface, a bottom surface and an inner sidewall, the inner sidewall defining a penetrating hole extending from the top surface to the bottom surface; and a light transmissive element covering the penetrating hole, wherein the sensor element senses or detects light passing through the light transmissive element.

1 . A semiconductor device package, comprising:
 a carrier;   a sensor element disposed on or within the carrier; and   a cover comprising a top surface, a bottom surface and an inner sidewall,   wherein the inner sidewall defines a penetrating hole extending from the top surface to the bottom surface, the penetrating hole exposes the sensor element, the inner sidewall comprises a titled inner sidewall, and   wherein the inner sidewall is a light reflection surface.   
     
     
         2 . The semiconductor device package according to  claim 1 , wherein the tilted inner sidewall is tilted at an angle of between about 10° to less than 90°, relative to the top surface. 
     
     
         3 . The semiconductor device package according to  claim 1 , wherein the tilted inner sidewall is tilted at an angle of between about 15° to about 80°, relative to the top surface. 
     
     
         4 . The semiconductor device package according to  claim 1 , wherein the cover comprises a liquid crystal polymer, an epoxy resin, a polyphthalamide (PPA) resin, a metal, or a combination thereof. 
     
     
         5 . The semiconductor device package according to  claim 1 , further comprising a light transmissive element covering the penetrating hole. 
     
     
         6 . The semiconductor device package according to  claim 1 , wherein the receiving area of the sensor element does not overlap the cover in vertical projection direction. 
     
     
         7 . The semiconductor device package according to  claim 5 , wherein the cover further comprises a portion protruding from the top surface of the cover, and the protruding portion comprises an inner sidewall defining a space to accommodate the light transmissive element. 
     
     
         8 . The semiconductor device package according to  claim 1 , further comprising a wire wherein the wire electrically connects the sensor element to the carrier or an electronic device disclosed on or within the carrier and wherein the wire overlaps the cover in vertical projection direction. 
     
     
         9 . The semiconductor device package according to  claim 1 , wherein the inner sidewall comprises an upper portion and a lower portion connected to the upper portion, and wherein the upper portion is substantially perpendicular to the top surface of the cover. 
     
     
         10 . A semiconductor device package, comprising:
 a carrier;   a sensor element disposed on or within the carrier; and   a cover comprising a top surface, a bottom surface, and an inner sidewall,   wherein the inner sidewall defines a penetrating hole extending from the top surface to the bottom surface, the penetrating hole exposes the sensor element, and a dimension of the penetrating hole at the bottom surface is larger than a dimension of the penetrating hole at the top surface, and   wherein the inner sidewall is a light reflection surface.   
     
     
         11 . The semiconductor device package according to  claim 10 , wherein the inner sidewall comprises a titled inner sidewall and wherein the tilted inner sidewall is tilted at an angle of between about 10° to less than 90°, relative to the top surface. 
     
     
         12 . The semiconductor device package according to  claim 11 , wherein the tilted inner sidewall is tilted at an angle of between about 15° to about 80°, relative to the top surface. 
     
     
         13 . The semiconductor device package according to  claim 10 , wherein the inner sidewall is configured to reduce or minimize undesired parasitic light from entering the sensor element. 
     
     
         14 . The semiconductor device package according to  claim 10 , wherein the inner sidewall directs undesired parasitic light away from the sensor element by reflection. 
     
     
         15 . The semiconductor device package according to  claim 10 , wherein the sensor element includes a receiving area for receiving light and the dimension of the penetrating hole at the top surface is larger than a dimension of the receiving area of the sensor element. 
     
     
         16 . The semiconductor device package according to  claim 10 , wherein the receiving area of the sensor element does not overlap the cover in vertical projection direction. 
     
     
         17 . A semiconductor device package, comprising:
 a carrier;   a sensor element for receiving light disposed on or within the carrier; and   a cover comprising a top surface, a bottom surface, and an inner sidewall,   wherein the inner sidewall defines a penetrating hole extending from the top surface to the bottom surface, the penetrating hole exposes the sensor element, the inner sidewall comprises a titled inner sidewall, and   wherein the inner sidewall is configure to direct undesired parasitic light away from the sensor element.   
     
     
         18 . The semiconductor device package according to  claim 17 , wherein the tilted inner sidewall is tilted at an angle of between about 10° to less than 90°, relative to the top surface. 
     
     
         19 . The semiconductor device package according to  claim 17 , further comprising a wire wherein the wire electrically connects the sensor element to the carrier or an electronic device disclosed on or within the carrier and wherein the wire overlaps the cover in vertical projection direction. 
     
     
         20 . The semiconductor device package according to  claim 17 , wherein the inner sidewall comprises an upper portion and a lower portion connected to the upper portion, and wherein the upper portion is substantially perpendicular to the top surface of the cover.