Cooling device

Abstract

A cooling device is configured to cool a heat source. The cooling device includes a tank, a cover and a cooling liquid. The tank includes a bottom surface, a tank inlet and a tank outlet. The cover is disposed on the tank. The cover and the tank form a space therebetween, and the space is configured to accommodate the heat source. The cooling liquid is located in the space.

What is claimed is: 
     
         1 . A cooling device, configured to cool a heat source, comprising:
 a tank, including a bottom surface, a tank inlet and a tank outlet;   a cover, disposed on the tank, the cover and the tank forming a space therebetween, and the space configured to accommodate the heat source; and   a cooling liquid, located in the space.   
     
     
         2 . The cooling device according to  claim 1 , wherein the tank inlet of the tank is closer to the bottom surface of the tank than the tank outlet. 
     
     
         3 . The cooling device according to  claim 2 , further comprising a liquid channel and a vapor channel, the liquid channel connected to the tank via the tank inlet, and the vapor channel connected to the tank via the tank outlet. 
     
     
         4 . The cooling device according to  claim 3 , wherein the vapor channel includes an inlet end and an outlet end, the inlet end is connected to the tank outlet of the tank, and the inlet end is closer to the bottom surface of the tank than the outlet end. 
     
     
         5 . The cooling device according to  claim 4 , wherein the cover includes a first side and a second side, the first side is closer to the tank outlet of the tank than the second side, and the first side is farther away from the bottom surface of the tank than the second side. 
     
     
         6 . The cooling device according to  claim 3 , further comprising a heat exchange portion, wherein the vapor channel is connected to the liquid channel via the heat exchange portion. 
     
     
         7 . The cooling device according to  claim 6 , further comprising a heat dissipation device connected to the heat exchange portion. 
     
     
         8 . The cooling device according to  claim 1 , further comprising an electrical connector connected to the cover, wherein the electrical connector is configured to be electrically connected to the heat source. 
     
     
         9 . The cooling device according to  claim 1 , further comprising a liquid pump device connected to the tank. 
     
     
         10 . The cooling device according to  claim 1 , further comprising an air pump device connected to the tank.