Heat transferring module and manufacturing method thereof

Abstract

A heat transferring module includes a first conductor plate, a second conductor plate, a working fluid and a reinforcing layer. The second conductor plate is connected to the first conductor plate to form a cavity. The working fluid is located in the cavity. The reinforcing layer is formed on an outer surface of at least one of the first conductor plate and the second conductor plate, wherein at least one of the first conductor plate and the second conductor plate has a capillary structure. The capillary structure is located on an inner surface of at least one of the first conductor plate and the second conductor plate, and a structural strength of the reinforcing layer is greater than a structural strength of the first conductor plate and a structural strength of the second conductor plate. In addition, a manufacturing method of a heat transferring module is also provided.

1 . A heat transferring module, comprising:
 a first conductor plate;   a second conductor plate, connected to the first conductor plate to form a cavity;   a working fluid, located in the cavity; and   a reinforcing layer, formed on an outer surface of at least one of the first conductor plate and the second conductor plate, wherein at least one of the first conductor plate and the second conductor plate has a capillary structure, the capillary structure is located on an inner surface of the at least one of the first conductor plate and the second conductor plate, and a structural strength of the reinforcing layer is greater than a structural strength of the first conductor plate and a structural strength of the second conductor plate.   
     
     
         2 . The heat transferring module according to  claim 1 , wherein a material of the first insulating layer comprises a tungsten-nickel alloy or a nickel-cobalt alloy. 
     
     
         3 . The heat transferring module according to  claim 1 , wherein the reinforcing layer is an electroplated reinforcing layer. 
     
     
         4 . The heat transferring module according to  claim 1 , wherein the reinforcing layer comprises a first reinforcing layer and a second reinforcing layer, the first reinforcing layer is formed on the outer surface of the first conductor plate, and the second reinforcing layer is formed on the outer surface of the second conductor plate. 
     
     
         5 . The heat transferring module according to  claim 1 , wherein a material of at least one of the first conductor plate and the second conductor plate is selected from a group consisting of copper, aluminum and titanium. 
     
     
         6 . The heat transferring module according to  claim 1 , wherein a maximum thickness of the heat transferring module is less than or equal to 0.5 mm. 
     
     
         7 . The heat transferring module according to  claim 1 , wherein a thickness of the first conductor plate ranges between 0.1 mm and 0.4 mm, and a thickness of the second conductor plate ranges between 0.1 mm and 0.4 mm. 
     
     
         8 . The heat transferring module according to  claim 1 , wherein the capillary structure comprises a first capillary structure and a second capillary structure, the first capillary structure is formed by a part of the first conductor plate, and the second capillary structure is formed by a part of the second conductor plate. 
     
     
         9 . A manufacturing method of a heat transferring module, comprising:
 providing a first conductor plate and a second conductor plate;   etching at least one of the first conductor plate and the second conductor plate to form a capillary structure;   combining the first conductor plate and the second conductor plate to form a cavity;   forming a reinforcing layer on an outer surface of at least one of the first conductor plate and the second conductor plate, wherein a structural strength of the reinforcing layer is greater than that of at least one of the first conductor plate and the second conductor plate; and   vacuuming the cavity and providing a working fluid to the cavity.   
     
     
         10 . The manufacturing method of the heat transferring module according to  claim 9 , wherein among the steps, performing in sequence the steps of etching to form the capillary structure; combining the first conductor plate and the second conductor plate; and forming the reinforcing layer. 
     
     
         11 . The manufacturing method of the heat transferring module according to  claim 9 , wherein among the steps, performing in sequence the steps of etching to form the capillary structure; forming the reinforcing layer; and combining the first conductor plate and the second conductor plate. 
     
     
         12 . The manufacturing method of the heat transferring module according to  claim 9 , wherein among the steps, performing in sequence the steps of forming the reinforcing layer; etching to form the capillary structure; and combining the first conductor plate and the second conductor plate. 
     
     
         13 . The manufacturing method of the heat transferring module according to  claim 9 , wherein a material of the first insulating layer comprises a tungsten-nickel alloy or a nickel-cobalt alloy. 
     
     
         14 . The manufacturing method of the heat transferring module according to  claim 9 , wherein the method of forming the reinforcing layer on the outer surface of the at least one of the first conductor plate and the second conductor plate further comprises:
 forming the reinforcing layer on the outer surface of the at least one of the first conductor plate and the second conductor plate by means of electroplating.   
     
     
         15 . The manufacturing method of the heat transferring module according to  claim 9 , wherein the reinforcing layer comprises a first reinforcing layer and a second reinforcing layer, and the method of forming the reinforcing layer on the outer surface of the at least one of the first conductor plate and the second conductor plate further comprises:
 forming the first reinforcing layer on the outer surface of the first conductor plate by means of electroplating; and   forming the second reinforcing layer on the outer surface of the second conductor plate by means of electroplating.   
     
     
         16 . The manufacturing method of the heat transferring module according to  claim 9 , wherein the capillary structure comprises a first capillary structure and a second capillary structure, and the method of etching the at least one of the first conductor plate and the second conductor plate to form the capillary structure further comprises:
 etching a part of the first conductor plate to form the first capillary structure; and   etching a part of the second conductor plate to form the second capillary structure.