Sensor chain devices and methods
Abstract
Methods of manufacturing a chain segment having wires that connect various electrical devices and connectors together are disclosed. The wires are arranged in a pattern to facilitate strain relief. The wires, electrical devices, and connectors are encased in an injection molded material, and they are preferably coupled with a flexible material such as a fabric that can be stitched into a garment. The chain segment facilitates collection of movement data when stitched into an article of clothing. A method of manufacturing the chain segment that is modular to enable different configurations and different lengths of chains.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of manufacturing a segment of a chain of electrical devices that is semi-flexible, comprising:
arranging a first wire mold module and a first electrical device mold module according to a chain design; disposing a first set of wires into the first wire mold module; disposing a first electrical device into the first electrical device mold module; coupling the first set of wires with the first electrical device; injecting a first material into the first wire mold module to encase the first set of wires in place; and injecting a second material into the first electrical device mold module to encase the first electrical device in place with respect to the first set of wires.
2 . The method of manufacturing a segment of a chain of electrical devices that is semi-flexible of claim 1 , wherein the first material is a soft silicone.
3 . The method of manufacturing a segment of a chain of electrical devices that is semi-flexible of claim 1 , wherein the second material is a hard silicone.
4 . The method of manufacturing a segment of a chain of electrical devices that is semi-flexible of claim 1 , further comprising the step of curing the first material and the second material in a pressure tube.
5 . The method of manufacturing a segment of a chain of electrical devices that is semi-flexible of claim 1 , further comprising:
arranging a second wire mold module adjacent to the first wire mold module; positioning the first set of wires in the second wire mold module; and injecting the first material into the second wire mold module to encase the first set of wires in place.
6 . The method of manufacturing a segment of a chain of electrical devices that is semi-flexible of claim 1 , further comprising:
providing access to a second wire mold module and a second electrical device mold module; arranging the second wire mold module and the second electrical device mold module according to the chain design; disposing a second set of wires into the second wire mold module; disposing a second electrical device into second first electrical device mold module; coupling the second set of wires with the second electrical device and also with the first electrical device; injecting the first material into the second wire mold module to encase the second set of wires in place; and injecting the second material into the second electrical device mold module to encase the second electrical device in place with respect to the second set of wires.
7 . The method of manufacturing a segment of a chain of electrical devices that is semi-flexible of claim 1 , wherein the first wire mold module comprises a plurality of protrusions to hold the set of wires in a pattern.
8 . The method of manufacturing a segment of a chain of electrical devices that is semi-flexible of claim 7 , wherein the pattern is S-shaped.
9 . The method of manufacturing a segment of a chain of electrical devices that is semi-flexible of claim 7 , wherein the pattern is Z-shaped.Join the waitlist — get patent alerts
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