US2020109467A1PendingUtilityA1
High entropy alloy structure and a method of preparing the same
Est. expiryOct 4, 2038(~12.2 yrs left)· nominal 20-yr term from priority
C22C 30/00C22C 19/00C22C 1/02C22F 1/002C22F 1/10
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Claims
Abstract
A method for preparing a high entropy alloy (HEA) structure includes the steps of: preparing an alloy by arc melting raw materials comprising five or more elements; drop casting the melted alloy into a cooled mold to form a bulk alloy; applying an external force against the bulk alloy to reshape the bulk alloy; and heat-treating the reshaped bulk alloy, wherein the bulk alloy is reshaped and/or heat-treated for manipulating the distribution of the microstructure therein. The present invention also relates to a high entropy alloy structure prepared by the method.
Claims
exact text as granted — not AI-modified1 . A method of preparing a high entropy alloy structure comprising the steps of:
A. preparing an alloy by arc melting raw materials comprising five or more elements; B. drop casting the melted alloy into a cooled mold to form a bulk alloy; C. applying an external force against the bulk alloy to reshape the bulk alloy; and D. heat-treating the reshaped bulk alloy; wherein the bulk alloy is reshaped and/or heat-treated for manipulating the distribution of the microstructure therein.
2 . The method according to claim 1 , wherein step C includes step C 1 of rolling the bulk alloy along a first direction to reduce the thickness of the bulk alloy.
3 . The method according to claim 2 , wherein step C 1 of rolling is carried out along a longitudinal direction of the bulk alloy.
4 . The method according to claim 2 , wherein the thickness of the rolled bulk alloy is reduced by 70%.
5 . The method according to claim 1 , wherein formed bulk alloy includes a homogenous structure within which the microstructures are uniformly dispersed.
6 . The method according to claim 1 , wherein heat-treated bulk alloy includes a heterogeneous structure within which the microstructures are non-uniformly dispersed.
7 . The method according to claim 1 , wherein the crystals in the microstructure are deformed during the heat treatment in step D to form a plurality of twins.
8 . The method according to claim 1 , wherein step D includes step D 1 of heating the bulk alloy to facilitate the movement of the microstructures.
9 . The method according to claim 8 , wherein step D includes step D 2 , after step D 1 , of water quenching the heat-treated alloy.
10 . The method according to claim 1 , wherein each of the elements is provided in an atomic percentage of 10% to 30%.
11 . The method according to claim 1 , wherein the elements are Cobalt, Nickel, Chromium, Iron and Aluminum.
12 . The method according to claim 11 , wherein Cobalt, Nickel, Chromium, Iron and Aluminum are provided in an atomic ratio of 30:30:20-0.5x:20-0.5x:x, with X being an integer of 14 to 20.
13 . The method according to claim 1 , wherein the raw materials have a high purity of >99.90%.
14 . The method according to claim 1 , wherein step A includes step A 1 of flipping and re-melting the raw materials in a repetitive manner.
15 . The method according to claim 1 , wherein the mold is made of copper.
16 . The method according to claim 1 , wherein the alloy is arc melted within a Ti-gettered argon atmosphere with a pressure below 8×10 −4 Pa.
17 . The method according to claim 8 , wherein the rolled bulk alloy is annealed at a temperature of at least 800° C. for 6 hours.
18 . A high entropy alloy structure prepared by the method according to claim 1 .
19 . The high entropy alloy structure according to claim 18 , wherein the alloy structure includes lamellar structures.
20 . The high entropy alloy structure according to claim 19 , wherein the size of the lamellar structures is provided in submicron range.
21 . The high entropy alloy structure according to claim 18 , wherein the alloy structure possesses a hardness of 330 to 404 HV.
22 . The high entropy alloy structure according to claim 18 , wherein the yield stress of the alloy structure is around 850 to 1000 MPa.
23 . The high entropy alloy structure according to claim 18 , wherein the Young's modulus of the alloy structure is around 230 GPa.
24 . The high entropy alloy structure according to claim 18 , wherein the alloy structure is thermal stable up to a predetermined temperature of 900° C.
25 . The high entropy alloy structure according to claim 18 , wherein the structure is a dual phase eutectic structure.
26 . The high entropy alloy structure according to claim 25 , wherein the dual phase includes ordered face center cubic (FCC) phase and body center cubic (BCC) phase.Join the waitlist — get patent alerts
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