Multi-Layered Food Product and Method For Forming

Abstract

A multi-layered food product comprises a filling encapsulated by a partially or fully baked dough layer, and wherein the dough layer is optionally partially or fully encapsulated by a partially or fully baked batter layer that was applied to the dough layer after the dough layer had been partially or fully baked, and the multi-layered food product can optionally include one or more toppings atop the outer dough or batter layer.

What is claimed: 
     
         1 . A multi-layered food product comprising:
 a baked yeast-leavened dough layer encapsulating at least 80% of a filling; and   a baked chemically-leavened batter layer that encapsulates at least 80% of said baked yeast-leavened dough layer, and   wherein said filling, said yeast-leavened dough layer, and said chemically-leavened batter layer all have a different composition,   wherein said baked chemically-leavened batter layer forms a light and airy cake/quick bread-type layer, and   wherein said baked yeast-leavened dough layer shapes said filling and provides a supportive structure to the multi-layered food product structure.   
     
     
         2 . The multi-layered food product as defined in  claim 1 , wherein a thickness of said baked chemically-leavened batter layer is greater than a thickness of said baked yeast-leavened dough layer. 
     
     
         3 . The multi-layered food product as defined in  claim 1 , wherein a density of said baked chemically-leavened batter layer is less than a density of said baked yeast-leavened dough layer. 
     
     
         4 . The multi-layered food product as defined in  claim 1 , further including a topping layer on a top surface of said baked chemically-leavened batter layer, said topping layer at least partially embedded in said baked chemically-leavened batter layer. 
     
     
         5 . A multi-layered food product comprising:
 a baked dough layer encapsulating at least 80% of a filling; and   topping layer on a top surface of said dough layer; and   wherein said dough layer is a yeast-leavened dough layer,   wherein said filling, said dough layer, and said topping layer all have a different composition,   wherein a thickness of said dough layer is greater than a thickness of said topping layer.   
     
     
         6 . The multi-layered food product as defined in  claim 5 , wherein said topping layer is at least partially embedded in said dough layer. 
     
     
         7 . A method for forming a multi-layered food product, said method comprising the steps of:
 a) providing a food insert, said food insert comprising a filling and a dough layer, said dough layer encapsulating at least 80% of said filling, a composition of said filling and dough layer is different;   b) providing a bi-molded plate assembly, said bi-molded plate assembly comprising a first plate and a second plate, said first plate including a depression configured to at least receive said food insert, said second plate configured to be inserted over said first plate to form a closed cavity that fully encapsulates said food insert when said food insert is positioned in said closed cavity;   c) heating said bi-molded plate assembly to a predetermined temperature;   d) placing said food insert into said depression in said first plate;   e) mating said second plate with said first plate to fully encapsulate said food insert in said closed cavity, said closed cavity forming a heated and sealed baking cavity for said sandwich insert;   f) baking said food insert in said closed cavity for a period of time to form a baked food insert; and   g) moving one of said first and second plates to enable said baked food insert to be removed from said depression in said first plate.   
     
     
         8 . The method as defined in  claim 7 , further including the steps of:
 providing topping, said topping having a different composition from said filling and said dough layer; and,   inserting said topping on a top surface of said sandwich insert while said food insert is positioned in said depression in said first plate and prior to said second plate being mated with said first plate.   
     
     
         9 . A method for forming a multi-layered food product comprising the following steps:
 a. providing a food insert, said sandwich insert comprising a filling and a yeast-leavened dough layer, said yeast-leavened dough layer encapsulating at least 80% of said filling, a composition of said filling and yeast-leavened dough layer is different;   b. baking said food insert to form a baked sandwich insert;   c. encapsulating at least 80% of said baked food insert in said chemically-leavened batter; and   d. baking said chemically-leavened batter; and   wherein said filling, said yeast-leavened dough layer and said chemically-leavened batter layer all have a different composition,   wherein said baked chemically-leavened batter layer forms a light and airy cake/quick bread-type layer, and   wherein said baked yeast-leavened dough layer shapes said filling and provides a supportive structure to the multi-layered food product structure.   
     
     
         10 . The method as defined in  claim 9 , wherein a thickness of said baked chemically-leavened batter layer is greater than a thickness of said baked yeast-leavened dough layer. 
     
     
         11 . The method as defined in  claim 9 , wherein a density of said baked chemically-leavened batter layer is less than a density of said baked yeast-leavened dough layer. 
     
     
         12 . The method as defined in  claim 9 , further including inserting a topping layer on a top surface of said chemically-leavened batter layer prior to said step of baking said chemically-leavened batter layer, said topping layer at least partially embedded in said baked chemically-leavened batter layer. 
     
     
         14 . The method as defined in  claim 9 , wherein said step of baking said food insert further comprises providing a first bi-molded plate assembly, said first bi-molded plate assembly comprising a first plate and a second plate, said first plate including a depression configured to at least receive said food insert, said second plate configured to be inserted over said first plate to form a closed cavity that fully encapsulates said food insert when said food insert is positioned in said closed cavity, and further including the steps of:
 heating said first bi-molded plate assembly to a predetermined temperature;   placing said food insert into said depression in said first plate;   mating said second plate with said first plate to fully encapsulate said food insert in said closed cavity, said closed cavity forming a heated and sealed baking cavity for said sandwich insert; and   baking said food insert in said closed cavity for a period of time.   
     
     
         15 . The method as defined in  claim 9 , wherein said steps of encapsulating and baking further comprises providing a second bi-molded plate assembly, said second bi-molded plate assembly comprising a first plate and a second plate, said first plate including a depression, said second plate configured to be inserted over said first plate to form a closed cavity, and further including the steps of:
 heating said second bi-molded plate assembly to a predetermined temperature;   pouring said chemically-leavened batter in said depression in said first plate;   placing said baked food insert in said depression in said first plate that includes said chemically-leavened batter;   pouring additional chemically-leavened batter over said baked food insert that is located in said depression in said first plate;   mating said second plate with said first plate to fully encapsulate said food insert that is coated with said chemically-leavened batter in said closed cavity, said closed cavity forming a heated and sealed baking cavity for said food insert that is coated with said chemically-leavened batter; and   baking said food insert in said closed cavity for a period of time.   
     
     
         16 . The method as defined in  claim 15 , further comprising the step of inverting said second bi-molded plate assembly during said baking of said chemically-leavened batter. 
     
     
         17 . The method as defined in  claim 9 , further including the steps of:
 providing topping, said topping having a different composition from said filling, said yeast-leavened dough layer, and said chemically-leavened batter; and,   inserting said topping on a top surface of chemically-leavened batter prior to said step of baking said chemically-leavened batter.   
     
     
         18 . The method as defined in  claim 17 , wherein topping layer on said top surface of said baked chemically-leavened batter layer is at least partially embedded in said baked chemically-leavened batter layer.