US2020091190A1PendingUtilityA1

Semiconductor memory device

Assignee: TOSHIBA MEMORY CORPPriority: Jun 28, 2011Filed: Nov 25, 2019Published: Mar 19, 2020
Est. expiryJun 28, 2031(~4.9 yrs left)· nominal 20-yr term from priority
G11C 8/12G11C 5/025G11C 2213/71G11C 5/063G11C 7/18G11C 5/04G11C 16/0483H10W 20/43H01L 23/528H01L 27/11582H01L 27/10H01L 27/11575H01L 29/7926H01L 27/11568H10D 30/693H10B 43/27H10B 43/30H10B 43/50
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Claims

Abstract

A semiconductor memory device comprises: a semiconductor substrate; a plurality of memory units provided on the semiconductor substrate and each including a plurality of memory cells that are stacked; and a plurality of bit lines formed above each of a plurality of the memory units aligned in a column direction, an alignment pitch in a row direction of the plurality of bit lines being less than an alignment pitch in the row direction of the memory units, and an end of each of the memory units aligned in the column direction being connected to one of the plurality of bit lines formed above the plurality of the memory units aligned in the column direction.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A semiconductor memory device, comprising:
 a semiconductor substrate;   a plurality of memory units provided on the semiconductor substrate and each including a plurality of memory cells that are stacked; and   a plurality of bit lines formed above each of a plurality of the memory units aligned in a column direction   an alignment pitch in a row direction of the plurality of bit lines being less than an alignment pitch in the row direction of the memory units, and   an end of each of the memory units aligned in the column direction being connected to one of the plurality of bit lines formed above the plurality of the memory units aligned in the column direction.

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