Top emission microled display and bottom emission microled display and a method of forming the same

Abstract

A microLED display includes a first main substrate, microLEDs disposed above the first main substrate, a first light blocking layer disposed above the first main substrate to define emission areas, a light guiding layer disposed in the emission areas, and a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.

What is claimed is: 
     
         1 . A method of forming a top emission microLED display, comprising:
 providing a first main substrate;   forming a plurality of microLEDs above the first main substrate;   forming a first light blocking layer above the first main substrate to define a plurality of emission areas;   forming a light guiding layer in the emission areas; and   forming a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.   
     
     
         2 . The method of  claim 1 , wherein the connecting structures have a same pattern. 
     
     
         3 . The method of  claim 1 , wherein the connecting structures comprise transparent material. 
     
     
         4 . The method of  claim 1 , wherein the connecting structures comprise opaque material. 
     
     
         5 . The method of  claim 1 , before forming the microLEDs, further comprising a step of entirely forming a conductive layer in the emission areas of the first main substrate. 
     
     
         6 . The method of  claim 1 , before forming the connecting structures, further comprising a step of forming contact holes above the microLEDs. 
     
     
         7 . The method of  claim 1 , wherein the first light blocking layer comprises black matrix. 
     
     
         8 . The method of  claim 1 , wherein a red microLED, a green microLED and a blue microLED in the emission area respectively correspond to the connecting structures with a same pattern. 
     
     
         9 . The method of  claim 1 , wherein the step of forming the first light blocking layer comprises:
 forming black resin; and   treating the black resin by photo process and curing process to form the first light blocking layer with black matrix.   
     
     
         10 . The method of  claim 1 , wherein the step of forming the first light blocking layer comprises:
 using ink-jet printing technique and curing process to form the first light blocking layer with black matrix.   
     
     
         11 . The method of  claim 1 , wherein the step of forming the first light blocking layer comprises:
 forming a chromium/chromium oxide film; and   treating the chromium/chromium oxide film by photo etching technique to form the first light blocking layer with black matrix.   
     
     
         12 . A method of forming a bottom emission microLED display, comprising:
 providing a first main substrate;   forming a plurality of connecting structures in a plurality of emission areas;   forming a plurality of microLEDs above the connecting structures;   forming a first light blocking layer above the first main substrate to define the emission areas covering the connecting structures; and   forming a light guiding layer in the emission areas.   
     
     
         13 . The method of  claim 12 , wherein the connecting structures have a same pattern. 
     
     
         14 . The method of  claim 12 , wherein the connecting structures comprise transparent material. 
     
     
         15 . The method of  claim 12 , wherein the connecting structures comprise opaque material. 
     
     
         16 . The method of  claim 12 , after forming the light guiding layer or the first light blocking layer, further comprising a step of entirely forming a conductive layer in the emission areas of the first main substrate. 
     
     
         17 . The method of  claim 16 , before forming the conductive layer, further comprising a step of forming contact holes above the microLEDs. 
     
     
         18 . The method of  claim 12 , wherein the first light blocking layer comprises black matrix. 
     
     
         19 . The method of  claim 12 , wherein a red microLED, a green microLED and a blue microLED in the emission area respectively correspond to the connecting structures with a same pattern. 
     
     
         20 . The method of  claim 12 , wherein the step of forming the first light blocking layer comprises:
 forming black resin; and   treating the black resin by photo process and curing process to form the first light blocking layer with black matrix.   
     
     
         21 . The method of  claim 12 , wherein the step of forming the first light blocking layer comprises:
 using ink-jet printing technique and curing process to form the first light blocking layer with black matrix.   
     
     
         22 . The method of  claim 12 , wherein the step of forming the first light blocking layer comprises:
 forming a chromium/chromium oxide film; and   treating the chromium/chromium oxide film by photo etching technique to form the first light blocking layer with black matrix.