Semiconductor device package

Abstract

A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.

What is claimed is: 
     
         1 . A semiconductor device package, comprising:
 a carrier; and   an encapsulant disposed on the carrier,   wherein at least one portion of the encapsulant is spaced from the carrier by a space.   
     
     
         2 . The semiconductor device package of  claim 1 , wherein
 the carrier has a first surface and the encapsulant is disposed on the first surface of the carrier,   the encapsulant has a first surface, a second surface opposite to the first surface of the encapsulant and a third surface located at a height between a height of the first surface of the encapsulant and a height of the second surface of the encapsulant, and   the second surface of the encapsulant is attached to the first surface of the carrier and the third surface of the encapsulant is spaced from the first surface of the carrier.   
     
     
         3 . The semiconductor device package of  claim 1 , wherein
 the carrier has a first surface and a second surface recessed with respect to the first surface, and the encapsulant is disposed on the first surface of the carrier, and   the encapsulant has a first surface and a second surface opposite to the first surface of the encapsulant, and a first portion of the second surface of the encapsulant is spaced from the second surface of the carrier and a second portion of the second surface of the encapsulant is attached to the first surface of the carrier.   
     
     
         4 . The semiconductor device package of  claim 3 , further comprising a conductive layer disposed on the second surface of the carrier. 
     
     
         5 . The semiconductor device package of  claim 1 , wherein
 the carrier has a first surface and a second surface recessed with respect to the first surface, and the encapsulant is disposed on the first surface of the carrier,   the encapsulant has a first surface, a second surface opposite to the first surface of the encapsulant and a third surface located at a height between a height of the first surface of the encapsulant and a height of the second surface of the encapsulant, and   the second surface of the encapsulant is attached to the first surface of the carrier and the third surface of the encapsulant is spaced from the second surface of the carrier.   
     
     
         6 . The semiconductor device package of  claim 5 , wherein the encapsulant further has a fourth surface, which is adjacent to the third surface of the encapsulant and spaced from the second surface of the carrier. 
     
     
         7 . The semiconductor device package of  claim 1 , wherein
 the carrier has a first surface, a second surface recessed with respect to the first surface, and a third surface connecting the first surface and the second surface, and the encapsulant is disposed on the first surface of the carrier,   the encapsulant has a first surface, a second surface opposite to the first surface of the encapsulant, a third surface located at a height between a height of the first surface of the encapsulant and a height of the second surface of the encapsulant, and a fourth surface,   the second surface of the encapsulant is attached to the first surface of the carrier and the third surface of the encapsulant is spaced from the first surface of the carrier and the second surface of the carrier,   the fourth surface of the encapsulant is connected to the second surface of the encapsulant and the third surface of the encapsulant, and the fourth surface of the encapsulant is disposed on the first surface of the carrier, and is not coplanar with the third surface of the carrier,   and the third surface of the carrier is disposed under the third surface of the encapsulant.   
     
     
         8 . The semiconductor device package of  claim 7 , wherein the encapsulant further has:
 a fifth surface, which is adjacent to the third surface of the encapsulant and spaced from the second surface of the carrier, and   a sixth surface connecting the first surface of the encapsulant and the fifth surface of the encapsulant.   
     
     
         9 . The semiconductor device package of  claim 1 , wherein
 the carrier has a first surface and a second surface protruded with respect to the first surface, and the encapsulant is disposed on the first surface of the carrier,   the encapsulant has a first surface, a second surface opposite to the first surface of the encapsulant and a third surface located at a height between a height of the first surface of the encapsulant and a height of the second surface of the encapsulant, and   a first portion of the third surface of the encapsulant is spaced from the first surface of the carrier, and a second portion of the third surface of the encapsulant is attached to the second surface of the carrier.   
     
     
         10 . The semiconductor device package of  claim 1 , wherein
 the carrier has a first surface and a second surface protruded with respect to the first surface, and the encapsulant is disposed on the first surface of the carrier,   the encapsulant has a first surface, a second surface opposite to the first surface of the encapsulant, a third surface located at a height between a height of the first surface of the encapsulant and a height of the second surface of the encapsulant, and a fourth surface adjacent to the third surface of the encapsulant and at a height lower than the height of the third surface of the encapsulant, and   the third surface of the encapsulant is attached to the second surface of the carrier and the fourth surface of the encapsulant is spaced from the first surface of the carrier.   
     
     
         11 . The semiconductor device package of  claim 1 , wherein
 the carrier has a first surface and a second surface protruded with respect to the first surface, and the encapsulant is disposed on the first surface of the carrier,   the encapsulant has a first surface, a second surface opposite to the first surface of the encapsulant, and a third surface located at a height between a height of the first surface of the encapsulant and a height of the second surface of the encapsulant, and   the third surface of the encapsulant is spaced from the first surface of the carrier and the second surface of the carrier.   
     
     
         12 . The semiconductor device package of  claim 11 , wherein the encapsulant further has a fourth surface, which is adjacent to the third surface of the encapsulant and spaced from the first surface of the carrier and the second surface of the carrier, and is at a height lower than the height of the third surface of the encapsulant. 
     
     
         13 . The semiconductor device package of  claim 1 , wherein
 the carrier has a first surface and includes a conductive layer, and the encapsulant is disposed on the first surface of the carrier, and a portion of a surface of the conductive layer is exposed and recessed with respect to the first surface of the carrier, and   the encapsulant has a first surface and a second surface opposite to the first surface of the encapsulant, and a first portion of the second surface of the encapsulant is spaced from the portion of the surface of the conductive layer and a second portion of the second surface of the encapsulant is attached to the first surface of the carrier.   
     
     
         14 . A semiconductor device package, comprising:
 a carrier having a first surface and a second surface adjacent to the first surface; and   an encapsulant disposed on the first surface of the carrier;   wherein a roughness of the second surface of the carrier is greater than a roughness of the first surface of the carrier.   
     
     
         15 . The semiconductor device package of  claim 14 , wherein the carrier further has a third surface adjacent to and angled with respect to the second surface of the carrier, and the roughness of the second surface of the carrier is greater than a roughness of the third surface of the carrier. 
     
     
         16 . The semiconductor device package of  claim 14 , wherein the carrier further has a fourth surface adjacent to and angled with respect to the first surface of the carrier, and the roughness of the second surface of the carrier is greater than a roughness of the fourth surface of the carrier. 
     
     
         17 . A method of manufacturing a semiconductor device package, comprising:
 providing a carrier having a surface;   forming a sacrificial layer on the surface of the carrier;   encapsulating the carrier and the sacrificial layer by an encapsulant;   removing a portion of the encapsulant to expose a portion of the sacrificial layer such that the encapsulant is divided into a first portion and a second portion, wherein the first portion of the encapsulant is attached to the carrier and the second portion of the encapsulant is attached to the sacrificial layer; and   removing the sacrificial layer and the second portion of the encapsulant.   
     
     
         18 . The method of  claim 17 , wherein the surface of the carrier defines a cavity. 
     
     
         19 . The method of  claim 18 , wherein a conductive layer is disposed within the cavity. 
     
     
         20 . The method of  claim 17 , wherein the surface of the carrier includes a protrusion.