Imprint apparatus, imprint method, and manufacturing method of semiconductor device

Abstract

According to one embodiment, an imprint apparatus that presses a fine pattern of an original plate against a photo-curable resin dropped onto a substrate, and transfers the fine pattern to the photo-curable resin by applying light, includes a dropping unit that drops the photo-curable resin onto a shot region obtained by dividing the substrate into a plurality of sections, an original plate supporting unit that stamps the original plate on the photo-curable resin on the substrate, the original plate being supported the fine pattern towards the substrate side, and a substrate supporting unit that supports the substrate and moves the substrate such that a position of a predetermined shot region of the substrate is a dropping position of the dropping unit or a stamping position of the original plate, in which the dropping unit is controlled such that the photo-curable resin is sequentially dropped onto the plurality of shot regions of the substrate, and the original plate supporting unit is controlled such that the fine pattern is transferred by sequentially stamping the original plate on the photo-curable resin dropped onto the plurality of shot regions, while operating the substrate supporting unit.

What is claimed is: 
     
         1 . An imprint apparatus that presses a pattern of an original plate against a photo-curable resin dropped onto a substrate, and transfers the fine pattern to the photo-curable resin by applying light, the apparatus comprising:
 a dropping unit that drops the photo-curable resin onto a shot region obtained by dividing the substrate into a plurality of sections;   an original plate supporting unit that contacts the pattern of the original plate to the photo-curable resin on the substrate; and   a substrate supporting unit that supports the substrate and moves the substrate, a predetermined shot region of the substrate being moved to a dropping position of the dropping unit or a contacting position of the original plate,   wherein the dropping unit is controlled to drop the photo-curable resin onto the plurality of shot regions of the substrate sequentially before contacting the original template to the photo-curable resin, and   the original plate supporting unit is controlled to contacts the original plate to the photo-curable resin dropped onto the plurality of shot regions sequentially to transfer the pattern to the resin, while operating the substrate supporting unit.   
     
     
         2 . The imprint apparatus according to  claim 1 ,
 wherein the dropping unit is controlled such that the photo-curable resin is dropped in the order of a first shot region and a second shot region, and   the original plate supporting unit is controlled such that the pattern is transferred by contacting the original plate on the photo-curable resin, in the order of the second shot region and the first shot region.   
     
     
         3 . The imprint apparatus according to  claim 1 , further comprising:
 an irradiation unit that irradiates light onto a liquid droplet of the photo-curable resin dropped onto the substrate before the original plate is contacted   
     
     
         4 . The imprint apparatus according to  claim 3 , further comprising:
 a light intensity changing unit that changes an intensity of light to be applied to the liquid droplet of the photo-curable resin from the irradiation unit.   
     
     
         5 . The imprint apparatus according to  claim 4 ,
 wherein the light intensity changing unit is a shutter or a diffuser plate.   
     
     
         6 . The imprint apparatus according to  claim 3 ,
 wherein the irradiation unit is disposed to be adjacent to the dropping unit.   
     
     
         7 . The imprint apparatus according to  claim 3 , further comprising:
 a light source that irradiates light to the photo-curable resin, in a state in which the original plate is contacted to the photo-curable resin,   wherein the irradiation unit is disposed to be adjacent to the light source.   
     
     
         8 . The imprint apparatus according to  claim 1 , further comprising:
 an irradiation unit that irradiates light to a liquid droplet of the photo-curable resin dropped onto the substrate, before the original plate is contacted,   wherein an intensity of light applied to the liquid droplet is changed among the plurality of shot regions, the intensity being changed according to a length of a time from when the photo-curable resin is dropped to when the original plate is contacted to the photo-curable resin.   
     
     
         9 . The imprint apparatus according to  claim 8 ,
 wherein the intensity of the light applied to the liquid droplet increases as the time from when the photo-curable resin is dropped to when the original plate is stamped on the photo-curable resin, increases, in the plurality of shot regions.   
     
     
         10 . The imprint apparatus according to  claim 1 ,
 wherein at least any one of a contacting speed of the original plate, a pressing force of the original plate with respect to the photo-curable resin, and a releasing speed of the original plate from the photo-curable resin is changed in the plurality of shot regions, according to a length of a time from when the photo-curable resin is dropped to when the original plate is contacted on the photo-curable resin.   
     
     
         11 . An imprint method of pressing a fine pattern of an original plate against a photo-curable resin dropped onto a substrate, and of transferring the pattern to the photo-curable resin by applying light, the method comprising:
 sequentially dropping the photo-curable resin onto a plurality of shot regions obtained by dividing the substrate into a plurality of sections, and then, transferring the pattern by sequentially contacting the original plate to the photo-curable resin dropped onto the plurality of shot regions.   
     
     
         12 . The imprint method according to  claim 11 , further comprising:
 dropping the photo-curable resin in the order of a first shot region and a second shot region at the time of dropping the photo-curable resin; and   contacting the original plate on the photo-curable resin, in the order of the second shot region and the first shot region, at the time of contacting the original plate on the photo-curable resin.   
     
     
         13 . The imprint method according to  claim 11 , further comprising:
 irradiating light to a liquid droplet of the photo-curable resin dropped onto the substrate before the original plate is contacted.   
     
     
         14 . The imprint method according to  claim 13 , further comprising:
 changing an intensity of light applied to the liquid droplet in the plurality of shot regions, according to a length of a time from when the photo-curable resin is dropped to when the original plate is contacted on the photo-curable resin.   
     
     
         15 . The imprint method according to  claim 11 , further comprising:
 changing at least any one of a contacting speed to the original plate, a pressing force of the original plate with respect to the photo-curable resin, and a releasing speed of the original plate from the photo-curable resin in the plurality of shot regions, according to a length of a time from when the photo-curable resin is dropped to when the original plate is contacted to the photo-curable resin.   
     
     
         16 . A manufacturing method of a semiconductor device that presses a pattern of an original plate against a photo-curable resin dropped onto a semiconductor substrate, and transfers the pattern to the photo-curable resin by applying light, the method comprising:
 preparing the semiconductor substrate on which a film to be processed is formed;   sequentially dropping the photo-curable resin onto a plurality of shot regions obtained by dividing the semiconductor substrate into a plurality of sections, and then, transferring the pattern by sequentially contacting the original plate to the photo-curable resin dropped onto the plurality of shot regions; and   processing the film to be processed by using the photo-curable resin to which the pattern is transferred, as a mask.   
     
     
         17 . The manufacturing method of a semiconductor device according to  claim 16 , further comprising:
 dropping the photo-curable resin in the order of a first shot region and a second shot region, at the time of dropping the photo-curable resin; and   contacting the original plate to the photo-curable resin, in the order of the second shot region and the first shot region, at the time of contacting the original plate to the photo-curable resin.   
     
     
         18 . The manufacturing method of a semiconductor device according to  claim 16 , further comprising:
 irradiating light to a liquid droplet of the photo-curable resin dropped onto the semiconductor substrate before the original plate is contacted.   
     
     
         19 . The manufacturing method of a semiconductor device according to  claim 18 , further comprising:
 changing an intensity of light applied to the liquid droplet in the plurality of shot regions, according to a length of a time from when the photo-curable resin is dropped to when the original plate is contacted to the photo-curable resin.   
     
     
         20 . The manufacturing method of a semiconductor device according to  claim 16 , further comprising:
 changing at least any one of a contacting speed of the original plate, a pressing force of the original plate with respect to the photo-curable resin, and a releasing speed of the original plate from the photo-curable resin in the plurality of shot regions, according to a length of a time from when the photo-curable resin is dropped to when the original plate is contacted to the photo-curable resin.