Optoelectronic modules having fluid permeable channels and methods for manufacturing the same

Abstract

An optoelectronic module includes a spacer with an optical component mounting surface, a fluid permeable channel, and a module mounting surface. The fluid permeable channel and module mounting surface allow the channels to be sealed to foreign matter during certain manufacturing steps and to remain free from blockages, such as solidified flux, during certain manufacturing steps. Further, the channels can permit heat to escape from the optoelectronic module during operation.

1 . An optoelectronic module comprising:
 an active optoelectronic component mounted electrically to an active optoelectronic component substrate;   a spacer laterally surrounding the active optoelectronic component forming a chamber, wherein the spacer includes an optical component mounting surface, a fluid permeable channel, and a module mounting surface; and   an optical component mounted onto the optical component mounting surface.   
     
     
         2 . The optoelectronic module of  claim 1 , the fluid permeable channel being adjacent to the optical component mounting surface. 
     
     
         3 . The optoelectronic module of  claim 1 , the module mounting surface being adjacent to the optical component mounting surface. 
     
     
         4 . The optoelectronic module of  claim 1 , the active optoelectronic component being operable to emit a particular range of wavelengths and/or being sensitive to a particular range of wavelengths. 
     
     
         5 . The optoelectronic module of  claim 4 , wherein the spacer is substantially non-transmissive to the particular range of wavelengths. 
     
     
         6 . The optoelectronic module of  claim 1 , wherein the optical component is mounted to the optical component mounting surface with adhesive. 
     
     
         7 . The optoelectronic module of  claim 1 , wherein the spacer further includes an adhesive channel adjacent to the optical component mounting surface. 
     
     
         8 . The optoelectronic module of  claim 1 , wherein the spacer further includes an alignment component and adhesive channel adjacent to the optical component mounting surface. 
     
     
         9 . The optoelectronic module of  claim 1 , wherein the optical component includes an adhesive channel and an alignment component. 
     
     
         10 . The optoelectronic module of  claim 1 , the fluid permeable channel being adjacent to the active optoelectronic component, the fluid permeable channel being disposed with a fluid permeable membrane. 
     
     
         11 . The optoelectronic module of  claim 1 , the module mounting surface being operable to seal the chamber and fluid permeable channel when in contact with an adhesive substrate. 
     
     
         12 . The optoelectronic module of  claim 1 , the active optoelectronic component being a laser diode, a light-emitting diode, an array of laser diodes, and/or an array of light emitting diodes. 
     
     
         13 . The optoelectronic module of  claim 1 , the active optoelectronic component being a photodiode, an array of photodiodes, and/or an array of pixels. 
     
     
         14 . The optoelectronic module of  claim 1 , the spacer being composed of a polymeric material. 
     
     
         15 . The optoelectronic module of  claim 1 , the active optoelectronic component substrate being composed of a lead frame. 
     
     
         16 . A method of manufacturing an optoelectronic module from a plurality of optoelectronicmodules, the method comprising the steps of:
 electrically mounting a plurality of active optoelectronic components to an active optoelectronic component substrate, the active optoelectronic component substrate being laterally surrounded by a spacer forming a chamber, the spacer including an optical component mounting surface, a fluid permeable channel, and module mounting surface;   applying an adhesive to the optical component mounting surface;   mounting an optical component to the optical component mounting surface;   curing the adhesive;   mounting the optoelectronic module via the module mounting surface to an adhesive substrate;   separating the plurality of optoelectronic modules into singulated optoelectronic modules.   
     
     
         17 . The method of  claim 16  further comprising the step of removing the adhesive substrate from the plurality of optoelectronic modules with thermal and/or electromagnetic radiation. 
     
     
         18 . The method of  claim 16  further comprising the step of mounting the optoelectronic module into a host device. 
     
     
         19 . The method of  claim 18  further comprising the step of subjecting the optoelectronic module to a heat treatment. 
     
     
         20 . The method of  claim 16  wherein the adhesive substrate is a dicing tape.