Electronic device and method for manufacturing the same

Abstract

An electronic device is provided. The electronic device includes a first substrate and a second substrate disposed on the first substrate. The first substrate includes a first side, and the first side includes a first portion and a second portion. The second substrate covers the first portion. The first portion is unprocessed and the second portion is processed.

What is claimed is: 
     
         1 . An electronic device, comprising:
 a first substrate comprising a first side, the first side comprising a first portion and a second portion; and   a second substrate disposed on the first substrate, wherein the second substrate covers the first portion; and   wherein the first portion is unprocessed and the second portion is processed.   
     
     
         2 . The electronic device as claimed in  claim 1 , wherein the second substrate does not cover the second portion. 
     
     
         3 . The electronic device as claimed in  claim 1 , further comprising a liquid-crystal layer disposed between the first substrate and the second substrate. 
     
     
         4 . The electronic device as claimed in  claim 1 , wherein the first side further comprises a third portion located between the first portion and the second portion, and the third portion is not covered by the second substrate and is unprocessed. 
     
     
         5 . The electronic device as claimed in  claim 4 , wherein a length of the second portion is greater than a length of the third portion. 
     
     
         6 . The electronic device as claimed in  claim 1 , wherein a length of the first portion is greater than a length of the second portion. 
     
     
         7 . The electronic device as claimed in  claim 1 , wherein the second portion is processed by a grinding process, a lapping process, a polishing process, a milling process, a coating process or a combination thereof. 
     
     
         8 . The electronic device as claimed in  claim 1 , wherein the second portion is partially processed. 
     
     
         9 . The electronic device as claimed in  claim 1 , further comprising:
 a third substrate disposed adjacent to the first substrate and comprising a third side; and   a fourth substrate disposed on the third substrate and adjacent to the second substrate and comprising a fourth side,   wherein the fourth substrate overlaps the second portion of the first substrate.   
     
     
         10 . The electronic device as claimed in  claim 9 , wherein the first substrate further comprises a second side that is not covered by the second substrate, and the second side is processed. 
     
     
         11 . The electronic device as claimed in  claim 10 , wherein the third side of the third substrate is at least partially unprocessed. 
     
     
         12 . The electronic device as claimed in  claim 11 , wherein the second side of the first substrate is adjacent to the third side of the third substrate. 
     
     
         13 . The electronic device as claimed in  claim 1 , wherein a surface roughness of the first portion is different from a surface roughness of the second portion. 
     
     
         14 . The electronic device as claimed in  claim 1 , wherein the second portion is coated with a protective material. 
     
     
         15 . A method for manufacturing an electronic device, comprising:
 providing a first substrate, the first substrate comprising a first side, wherein the first side comprises a first portion and a second portion;   forming a second substrate on the first substrate, wherein the second substrate covers the first portion; and   processing the second portion while leaving the first portion unprocessed.   
     
     
         16 . The method for manufacturing an electronic device as claimed in  claim 15 , wherein the second substrate does not cover the second portion. 
     
     
         17 . The method for manufacturing an electronic device as claimed in  claim 15 , further comprising forming a liquid-crystal layer between the first substrate and the second substrate. 
     
     
         18 . The method for manufacturing an electronic device as claimed in  claim 15 , wherein the processing comprises a grinding process, a lapping process, a polishing process, a coating process or a combination thereof. 
     
     
         19 . The method for manufacturing an electronic device as claimed in  claim 15 , wherein the second portion is partially processed. 
     
     
         20 . The method for manufacturing an electronic device as claimed in  claim 15 , wherein the second portion is entirely processed.