Method for preparing titanium plating solution and method for manufacturing titanium plated product

Abstract

The titanium plating solution production method including measuring a titanium plating solution containing fluorine and titanium by cyclic voltammetry under the following conditions, and adding titanium to the titanium plating solution so that the potential difference between the spontaneous potential and the Ti3+/Ti4+ redox potential is 0.75 V or more. Conditions: when the temperature of the titanium plating solution is 650° C. to 850° C. and when glassy carbon is used as a working electrode, platinum is used as a pseudo-reference electrode and titanium is used as a counter electrode, the potential scanning is repeatedly performed on the working electrode for at least five times at a scanning speed of 1 mV/sec to 500 mV/sec between a lower potential limit which is the immersion potential of the working electrode and an upper potential limit which is a potential that is 2 V to 4 V higher than the lower potential limit.

1 . A method for preparing a titanium plating solution comprising:
 measuring a titanium plating solution containing fluorine and titanium by cyclic voltammetry under the following conditions; and   adding titanium to the titanium plating solution so that a potential difference between the spontaneous potential and the Ti3 + /Ti 4+  redox potential is 0.75 V or more,   
       conditions: when the temperature of the titanium plating solution is 650° C. or more and 850° C. or less and when glassy carbon is used as a working electrode, platinum is used as a pseudo-reference electrode and titanium is used as a counter electrode, the potential scanning is repeatedly performed on the working electrode for at least five times at a scanning speed of 1 mV/sec or more and 500 mV/sec or less between a lower potential limit which is the immersion potential of the working electrode and an upper potential limit which is a potential that is 2 V to 4 V higher than the lower potential limit. 
     
     
         2 . The method for preparing a titanium plating solution according to  claim 1 , wherein the titanium plating solution is obtained by dissolving titanium in a molten salt of potassium fluoride and potassium chloride. 
     
     
         3 . The method for preparing a titanium plating solution according to  claim 1 , wherein the titanium plating solution is obtained by dissolving K 2 TiF 6  in a molten salt of potassium fluoride and potassium chloride. 
     
     
         4 . The method for preparing a titanium plating solution according to  claim 3 , wherein the content of K 2 TiF 6  in the titanium plating solution is 0.1 mol % or more. 
     
     
         5 . The method for preparing a titanium plating solution according to  claim 2 , wherein the molar mixing ratio between potassium fluoride and potassium chloride is 10:90 to 90:10. 
     
     
         6 . The method for preparing a titanium plating solution according to  claim 1 , wherein the titanium added to the titanium plating solution is titanium sponge. 
     
     
         7 . A method for manufacturing a titanium plated product which includes an electrolyzing step of carrying out a molten salt electrolysis by using a cathode and an anode provided in a titanium plating solution containing fluorine and titanium so as to electrodeposit titanium on the surface of the cathode,
 the titanium plating solution being prepared by the method for preparing a titanium plating solution according to  claim 1 .   
     
     
         8 . The method for manufacturing a titanium plated product according to  claim 7 , wherein the titanium plating solution used in the electrolyzing step is measured by cyclic voltammetry under the following conditions, and a potential difference between the spontaneous potential and the Ti3 + /Ti 4+  redox potential is controlled to be 0.75 V or more, conditions: when the temperature of the titanium plating solution is 650° C. or more and 850° C. or less and when glassy carbon is used as a working electrode, platinum is used as a pseudo-reference electrode and titanium is used as a counter electrode, the potential scanning is repeatedly performed on the working electrode for at least five times at a scanning speed of 1 mV/sec or more and 500 mV/sec or less between a lower potential limit which is the immersion potential of the working electrode and an upper potential limit which is a potential that is 2 V to 4 V higher than the lower potential limit.