Flexible devices and methods using laser lift-off

Abstract

A method of making a flexible device comprises providing a rigid substrate and a flexible substrate, disposing a layer of print adhesive on the rigid substrate, and micro-transfer printing micro-devices onto the print adhesive. Each of the micro-devices comprises a micro-device substrate separate, independent, and distinct from the rigid substrate and from the flexible substrate. A bonding layer is provided to bond the flexible substrate to the micro-devices such that (i) the bonding layer is disposed between the flexible substrate and the micro-devices and (ii) the micro-devices are disposed between the rigid substrate and the flexible substrate (e.g., forming a device structure). The flexible substrate is separated from the rigid substrate so that the micro-devices remain bonded to the flexible substrate providing a flexible device. The micro-devices can comprise at least a portion of a micro-device tether.

1 - 19 . (canceled) 
     
     
         20 . A device structure, comprising:
 a rigid substrate;   a layer of print adhesive disposed on the rigid substrate;   micro-devices disposed on or in the print adhesive, wherein each micro-device comprises a micro-device substrate separate, independent, and distinct from the rigid substrate and at least a portion of a micro-device tether;   a bonding layer; and   a flexible substrate bonded to the micro-devices,   wherein (i) the bonding layer is disposed between the flexible substrate and the micro-devices and (ii) the micro-devices are disposed between the rigid substrate and the flexible substrate, and (iii) the micro-device substrate of each of the micro-devices is separate, independent, and distinct from the flexible substrate.   
     
     
         21 . The device structure of  claim 20 , comprising one or more micro-elements disposed on the micro-device substrate of each of the micro-devices, wherein each of the one or more micro-elements comprises a micro-element substrate separate, independent, and distinct from the rigid substrate, from the flexible substrate, from the micro-device substrate, and from any other micro-element substrate, wherein the one or more micro-elements each comprise at least a portion of a micro-element tether. 
     
     
         22 . A flexible device, comprising:
 a flexible substrate;   a bonding layer;   micro-devices bonded to the flexible substrate with the bonding layer, wherein each micro-device comprises a micro-device substrate separate, independent, and distinct from the flexible substrate and comprises at least a portion of a micro-device tether, and   wherein the micro-devices are exposed to the environment.   
     
     
         23 . The device structure of  claim 20 , wherein the print adhesive is electromagnetic radiation absorbent to dissociate the rigid substrate from the micro-devices, from the bonding layer, and from the bonded flexible substrate. 
     
     
         24 . The device structure of  claim 20 , wherein the rigid substrate is glass, quartz, sapphire, or a semiconductor, wherein the flexible substrate is plastic, or wherein the rigid substrate is glass, quartz, sapphire, or a semiconductor and the flexible substrate is plastic. 
     
     
         25 . The device structure of  claim 20 , wherein the micro-devices comprise a first micro-device comprising one or more first material(s) and a second micro-device comprising one or more second material(s) that are different from the one or more first material(s). 
     
     
         26 . The device structure of  claim 20 , wherein each micro-device is non-native to the rigid substrate and the flexible substrate. 
     
     
         27 . The device structure of  claim 20 , wherein each of the micro-devices is an inorganic micro-light-emitting diode (micro-iLED) and the micro-device substrate is a micro-iLED substrate separate, independent, and distinct from the rigid substrate, from the flexible substrate, and from any other micro-iLED substrate. 
     
     
         28 . The device structure of  claim 20 , wherein each of the micro-devices comprises one or more micro-elements disposed on the micro-device substrate and each of the one or more micro-elements comprises a micro-element substrate separate, independent, and distinct from the rigid substrate, from the flexible substrate, from the micro-device substrate, and from any other micro-element substrate. 
     
     
         29 . The device structure of  claim 28 , wherein each micro-element of the one or more micro-elements comprises at least a portion of a micro-element tether. 
     
     
         30 . The device structure of  claim 29 , wherein each of the one or more micro-elements is non-native to the micro-device substrate. 
     
     
         32 . The device structure of  claim 28 , wherein the micro-devices are pixels and one or more of the one or more micro-elements are inorganic micro-light-emitting diodes (micro-iLEDs), and for each of the one or more micro-elements that is an inorganic micro-iLED, the micro-element substrate is a micro-iLED substrate separate, independent, and distinct from the rigid substrate, from the flexible substrate, from the pixel substrate, and from any other micro-iLED substrate. 
     
     
         33 . The device structure of  claim 32 , wherein each of the micro-devices comprises a micro-controller and the micro-controller comprises a micro-controller substrate separate, independent, and distinct from the rigid substrate, from the flexible substrate, from the micro-device substrate, from any micro-iLED substrate, and from any other micro-controller substrate. 
     
     
         34 . The device structure of  claim 28 , wherein the one or more micro-elements comprises a first micro-element comprising one or more first material(s) and a second micro-element comprising one or more second material(s) that are different from the one or more first material(s). 
     
     
         35 . The device structure of  claim 20 , comprising electrical conductors disposed on the flexible substrate. 
     
     
         36 . The device structure of  claim 35 , wherein each of the micro-devices comprises one or more connection posts electrically connected to a micro-device circuit and each connection post of the one or more connection posts is electrically connected to an electrical conductor. 
     
     
         37 . The device structure of  claim 35 , wherein the micro-devices each comprise electrical contacts electrically connected to the micro-device circuits and the electrical contacts of each of the micro-devices are electrically connected to the electrical conductors on the flexible substrate. 
     
     
         38 . The device structure of  claim 37 , comprising vias formed through the bonding layer and at least one electrical connection formed through the vias. 
     
     
         39 . The device structure of  claim 20 , wherein the micro-devices each comprise micro-device contact pads and electrical conductors disposed on the bonding layer that electrically connect the electrical conductors to the micro-device contact pads.