High-speed electroplating method

Abstract

A high-speed electroplating method is provided. The high-speed electroplating method includes the following steps: providing a substrate containing a conductive layer on its surface; coating a dry-film photoresist on the conductive layer of the substrate, and patterning the dry-film photoresist; performing a pretreatment process to clean the substrate; disposing the substrate in an electroplating solution; turning on an ultrasonic oscillation machine to vibrate the electroplating solution, and turning on a jet flow device to agitate the electroplating solution, and performing a pre-electroplating process with a plating current density of 0.5 A/dm2 to 5 A/dm2, and then performing a high-speed electroplating process with a plating current density of 6 A/dm2 to 100 A/dm2; depositing a conductive pillar on areas without the dry-film photoresist; and removing the dry-film photoresist being coated on the conductive layer of the substrate. Thus, the high-speed electroplating method can achieve high-speed electrodeposition with uniform microstructures.

What is claimed is: 
     
         1 . A high-speed electroplating method, comprising:
 providing a substrate containing a conductive layer on its surface;   coating a dry-film photoresist on the conductive layer of the substrate, and patterning the dry-film photoresist;   disposing the substrate in an electroplating solution;   turning on an ultrasonic oscillation machine to vibrate the electroplating solution, and turning on a jet flow device to agitate the electroplating solution, and performing a pre-electroplating process with a plating current density of 0.5 A/dm 2  to 5 A/dm 2 , and then performing a high-speed electroplating process with a plating current density of 6 A/dm 2  to 100 A/dm 2 ;   depositing a conductive pillar on areas without the dry-film photoresist; and   removing the dry-film photoresist being coated on the conductive layer of the substrate.   
     
     
         2 . The method according to  claim 1 , wherein ultrasonic oscillation of the electroplating solution is controlled to a frequency of 5 kilohertz (KHz) to 100 KHz. 
     
     
         3 . The method according to  claim 1 , wherein metallic ions in the electroplating solution are selected from the group consisting of silver ions, gold ions, nickel ions, cobalt ions, palladium ions, and copper ions. 
     
     
         4 . The method according to  claim 1 , wherein the step of removing the dry-film photoresist being coated on the conductive layer of the substrate, further comprises: using tetrahydrofuran (THF) or sodium hydroxide (NaOH) to remove the dry-film photoresist being coated on the conductive layer of the substrate. 
     
     
         5 . A high-speed electroplating method, comprising:
 providing a substrate;   forming a blind-hole structure or a through-hole structure on the substrate through laser drilling or mechanical drilling;   forming a conductive layer on a surface of the substrate and a hole wall of the blind-hole structure or the through-hole structure;   performing a pretreatment process to clean the substrate;   disposing the substrate in an electroplating solution; and   turning on an ultrasonic oscillation machine to vibrate the electroplating solution, and turning on a jet flow device to agitate the electroplating solution, and performing a pre-electroplating process with a plating current density of 0.5 A/dm 2  to 5 A/dm 2 , and then performing a high-speed electroplating process to fill the blind-hole structure or the through-hole structure with a metal conductive material with a plating current density of 6 A/dm 2  to 100 A/dm 2 .   
     
     
         6 . The method according to  claim 5 , wherein ultrasonic oscillation of the electroplating solution is controlled to a frequency of 5 KHz to 100 KHz. 
     
     
         7 . The method according to  claim 5 , wherein metallic ions in the electroplating solution are selected from the group consisting of silver ions, gold ions, nickel ions, cobalt ions, palladium ions, and copper ions. 
     
     
         8 . A high-speed electroplating method, comprising:
 providing a component containing a gap between two adjacent metal parts;   performing a pretreatment process to clean the component;   disposing the component in an electroplating solution; and   turning on an ultrasonic oscillation machine to vibrate the electroplating solution, and turning on a jet flow device to agitate the electroplating solution, and performing a pre-electroplating process with a plating current density of 0.5 A/dm 2  to 5 A/dm 2 , and then performing a high-speed electroplating process to fill the gap with a plating current density of 6 A/dm 2  to 100 A/dm 2  to metallize the gap.   
     
     
         9 . The method according to  claim 8 , wherein ultrasonic oscillation of the electroplating solution is controlled to a frequency of 5 KHz to 100 KHz. 
     
     
         10 . The method according to  claim 8 , wherein metallic ions in the electroplating solution are selected from the group consisting of silver ions, gold ions, nickel ions, cobalt ions, palladium ions, and copper ions.