Multilayer encapsulation thin-film

Abstract

A multilayer encapsulation thin-film and a method and apparatus for preparing a multilayer encapsulation thin-film are provided. The multilayer encapsulation thin-film includes an inorganic thin film that includes a metal oxide, and an organic thin film that includes a polymer and is formed on the inorganic thin film, where the inorganic thin film and the organic thin film are alternately stacked in multiple layers

What is claimed is: 
     
         1 . An apparatus for producing a multilayer encapsulation thin-film comprising:
 a substrate loading unit on which a substrate is loaded;   an inorganic thin film deposition unit to deposit an inorganic thin film on the substrate; and   an organic thin film deposition unit to deposit an organic thin film on the inorganic thin film,
 wherein the inorganic thin film deposition unit and the organic thin film deposition unit are sequentially connected to each other, and the substrate loading unit is alternately moved to the inorganic thin film deposition unit and the organic thin film deposition unit, so that the inorganic thin film and the organic thin film are alternately deposited on the substrate. 
   
     
     
         2 . The apparatus of  claim 1 , wherein the organic thin film deposition unit further comprises a UV curing unit. 
     
     
         3 . The apparatus of  claim 1 , wherein a plurality of inorganic thin film deposition units are sequentially connected to the organic thin film deposition unit through more than one connection. 
     
     
         4 . The apparatus of  claim 3 , wherein the plurality of inorganic thin film deposition units and the organic thin film deposition unit are alternately arranged. 
     
     
         5 . The apparatus of  claim 3 , wherein the organic thin film deposition unit is arranged at a terminus of the sequential connection of units.