Infrared detection device

Abstract

The signal processing board includes a plurality of signal processing circuits configured to process signals output from a plurality of pixels of an infrared detecting element. The signal processing board includes an element placement area where the infrared detecting element is placed, and a circuit placement area positioned outside the element placement area to surround the element placement area when viewed from a direction orthogonal to the signal processing board. The signal processing board includes a plurality of insulating layers that are stacked on a surface side opposing the semiconductor substrate. A plurality of signal processing circuits are placed in the circuit placement area. A heat-conducting layer is placed to be positioned on at least one of the insulating layers and in the element placement area, in the signal processing board. The heat-conducting layer has a heat conductivity that is higher than a heat conductivity of the insulating layers.

1 - 7 . (canceled) 
     
     
         8 : An infrared detecting device comprising:
 an infrared detecting element including a semiconductor substrate in which a plurality of pixels are two-dimensionally arranged; and   a signal processing board including a plurality of signal processing circuits configured to process signals output from the plurality of pixels, the signal processing board being disposed to oppose the semiconductor substrate, wherein   the signal processing board includes a first region where the infrared detecting element is placed, and a second region positioned outside the first region to surround the first region when viewed from a direction orthogonal to the signal processing board,   the plurality of signal processing circuits are placed in the second region to surround the first region.   
     
     
         9 : The infrared detecting device according to  claim 8 , wherein
 the signal processing board has a rectangular shape when viewed from the direction orthogonal to the signal processing board, and   the plurality of signal processing circuits are placed along respective edges of the signal processing board in the second region.   
     
     
         10 : The infrared detecting device according to  claim 8 , wherein
 the first region has a rectangular shape having a pair of edges that oppose each other and parallel to a pair of opposing edges of the signal processing board, and a pair of edges that oppose each other and parallel to another pair of opposing edges of the signal processing board, when viewed from the direction orthogonal to the signal processing board,   a signal processing board includes a plurality of electrodes electrically connected to the respective pixels, the electrodes being two-dimensionally arranged in the first region to correspond to arrangement of the plurality of pixels, and   when the first region includes four partial regions each having a rectangular shape, the electrodes placed in each of the four partial regions are connected to the signal processing circuits placed along an edge of the signal processing board that opposes an edge of each of the four partial regions where the electrodes are placed.   
     
     
         11 : The infrared detecting device according to  claim 8 , further comprising:
 a supporting wiring board on which the signal processing board is mounted, wherein   the supporting wiring board includes an electrode being in contact with a principal surface side of the signal processing board.   
     
     
         12 : The infrared detecting device according to  claim 8 , further comprising:
 a supporting wiring board on which the signal processing board is mounted, wherein   the signal processing board includes a plurality of first electrodes electrically connected to the respective pixels,   the supporting wiring board includes a plurality of second electrodes electrically connected to the first electrodes.   
     
     
         13 : The infrared detecting device according to  claim 12 , wherein
 each of the first electrodes is electrically connected to the corresponding second electrode by a bonding wire.   
     
     
         14 : The infrared detecting device according to  claim 8 , wherein
 the signal processing board includes a plurality of electrodes arranged in the first region, each of the electrodes being electrically connected to a corresponding pixel of the plurality of pixels,   each of the signal processing circuits is electrically connected to a corresponding electrode of the plurality of electrodes though a conductive line, and   the signal processing board is configured to output a signal output from the pixel to the signal processing circuit though the electrode and conductive line corresponding the pixel.